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[TPU] Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report - Page 2  

post #11 of 387
If I owned an IB processor I'd delid it. thumb.gif
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post #12 of 387
Time to protest, put your wallets away now wink.gif
    
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post #13 of 387
Seems like a foolish cost saving measure.
Quote:
Originally Posted by AbdullahG View Post

Just curious, how many users here actually remove the IHS for performance-related reasons?

I have.
Quote:
Originally Posted by Phillychuck View Post

Quote:
In comparison, Intel used flux-less solder to bind the IHS to the core on previous-generation Sandy Bridge Core processors.
That doesn't make sense to me, I could see soldering the IHS to the substrate the chip is mounted to, but how do you solder the IC case to metal?
Maybe they used a hardening TIM before?

No, they used indium based solder before.

Yes, the IHS was/is soldered to the die. Yes, I have seen this myself.
Quote:
Originally Posted by Dmac73 View Post

Intel had to have some positive reason for doing this, other than save money..... rolleyes.gif

Doubtful.

The solder itself and the layer of gold they had to use on the base of the IHS for improved wetability probably cost 10 cents too much.
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post #14 of 387
Quote:
Originally Posted by Blameless View Post

Doubtful.
The solder itself and the layer of gold they had to use on the base of the IHS for improved wetability probably cost 10 cents too much.
He was being sarcastic.
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post #15 of 387
Quote:
Originally Posted by treeman View Post

So I guess if people just take off the IHS and run the cooler straight on the die it could help?... or crush the die?...

Potentially both. It would will almost always help to use your heatsink directly on the die, but if you're not careful you can crush or crack the die.
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post #16 of 387
Quote:
Originally Posted by SinX7 View Post

They should try putting the "best" TIM on the IHS and see if that makes a difference tongue.gif But after reading this and Intel not going to do anything about it, I might not get the 3570k now :/

Why not? Temps at 4.8GHz is still under 90C which is max safe 24/7.
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post #17 of 387
Quote:
Originally Posted by IronWill1991 View Post

Why not? Temps at 4.8GHz is still under 90C which is max safe 24/7.

I'm waiting on official numbers from Intel, but Sin made a comment on where at the same high voltages SB degraded much faster than IB and his IB still hasn't degraded.

I think this new process, especially with all the revisions Intel has done with it, is much more resilient than older models. I wonder if 80-80c is the new 70c on SB
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post #18 of 387
Quote:
Originally Posted by lordikon View Post

It would will almost always help to use your heatsink directly on the die, but if you're not careful you can crush or crack the die.

BY careful do you mean really careful or just don't do something silly?

I guess this could actually turn out to be a bit of a boon for non-pro enthusiast overclockers.

Cheers
Zane
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post #19 of 387

I am just going to throw my 3570k under a good bit of water and lap the crap out of the IHS. Just like I have with all of my CPUs since the E6600 came out. 

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post #20 of 387
Can the Die handle the pressure of a Water Block? I hope its as simple as this. Tri-Gate does show it it much more efficient and cooler.
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