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[TPU] Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report - Page 16  

post #151 of 387
I want to say a lot about this, But i cant at the same time :/

I do want to see someone run the chip without a HS, Or some lulzy tests, Maybe very little TP on your cooler?
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post #152 of 387
Quote:
Originally Posted by Da1Nonly View Post

Not sure if serious... Real overclockers take that crap of anyways and put the cooler right smack down where it matters. biggrin.gifrolleyes.gif

It's not usual to be able to remove the IHS...
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post #153 of 387
Quote:
Originally Posted by ZealotKi11er View Post

Can the Die handle the pressure of a Water Block? I hope its as simple as this. Tri-Gate does show it it much more efficient and cooler.

Easily. Just make sure you put it on evenly.
Quote:
Originally Posted by 996gt2 View Post

Quote:
Originally Posted by Arni90 View Post

Why can't they just sell the K-versions without an IHS?
I'd rather don't have an IHS than an IHS using thermal paste.

It is very easy to crack the die without an IHS protecting it.

After I removed the IHS on my Athlon X2 some years ago, I cracked the die while trying to mount the CPU heatsink.

Just imagine how many RMAs Intel would get if they sold it without an IHS.

Not really. It's extremely difficult to crack a die if you're careful and know what you're doing..I've put heatsinks very uncarefully on Athlon XPs, etc (No IHS to speak of) and never suffered a cracked die apart from a Celeron D I chipped by accident while I was delidding it.

Sometimes chips don't actually do anything, I chipped the die on my Core i3 while I was replacing the TIM (Very small on the edge of the chip) and it works fine.

Quote:
Originally Posted by Malcolm View Post

Anyone think Ivy could get ~6 GHz on air running lidless with a shim? I'd be tempted to upgrade if this turns out to be the case eek.gif


If temperatures were the main limit, probably. It all depends on how much voltage it takes easily.
Quote:
Originally Posted by Scorpion667 View Post

Does it look like the die is encased in a metal cover? I mean it has rounded edges... most dies are rectangular with sharp edges...

I think if it IS metal, we should be able to use heatsink on the direct die. If the test shows massive temp headroom gains I would delid a 3770k and slap a waterblock on there.

273

That'd be the stuff that keeps the die bonded to the PCB. wink.gif
Quote:
Originally Posted by Alatar View Post

Quote:
Originally Posted by cayennemist View Post

now I want to try this with SB lol

don't. This is what happens when you try to remove the IHS from a chip that has solder instead of TIM:

468

Depends, some people get it off and some people don't. It's not anywhere nearly as much of a drop with soldered chips compared to TIM chips like IB seems to be though.

Else you just literally sand the IHS off.
Quote:
Originally Posted by AddictedGamer93 View Post

Quote:
Originally Posted by SonDa5 View Post

So just take a blow torch to it? kookoo.gif

Sort of. http://www.overclock.net/t/305443/ihs-removals-how-to-do-it-should-i-do-it-and-the-facts

According to that link, the solder melts at 80-90C. If thats true in SB, wouldnt the solder melt BEFORE the cpu hits its thermal shutdown temperature?!?

Yep. It'd probably downclock around 90c though. If you cut the glue around the IHS, turned the chip on without a heatsink (Idiotic idea) and pulled the IHS after a few seconds you'd probably get it right off with no damage from the IHS removal...The heat on the other hand... wink.gif

Does anyone know if people have de-lidded SB-e and SB? They might run TIM too for all we know...
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post #154 of 387
There is one possible thing here.lets imagine intel is dev a composite polymer termal paste.but it wasnt ready at ib lunch or will be an option in the 3gen extreme serie(very likly).they wouldnt use two way instead they use regular quality for non extreme and use cptp for extreme composite polymer have a 695 w/mk that is known.if intel had a termal paste or similar in lab this ib move would make sense in the long run
post #155 of 387
Quote:
Originally Posted by Brutuz View Post

Easily. Just make sure you put it on evenly.
Not really. It's extremely difficult to crack a die if you're careful and know what you're doing..I've put heatsinks very uncarefully on Athlon XPs, etc (No IHS to speak of) and never suffered a cracked die apart from a Celeron D I chipped by accident while I was delidding it.
Sometimes chips don't actually do anything, I chipped the die on my Core i3 while I was replacing the TIM (Very small on the edge of the chip) and it works fine.

Oh ya - now I remember those fellas ... Im wondering if I still have my mb/cpu in the attic (athlon xp) ... I think I remember putting artic silver right on the die and evening it out with a razor blade; hmmm Id hate to mess up a 300 dollar ivy thou and not being able to return it. Resell value going to kind of blow thou ...
    
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post #156 of 387
I wonder if delidding an Ivy Bridge CPU will make a huge difference. It would be crazy if there was some massive improvement. (Edit: I don't want to speculate)

Man. Someone should totally give this a go. thumb.gif
post #157 of 387
Silver vs copper.426w/mk vs 400w / mk so dont bother lol
post #158 of 387
Warr10r: just removing the lid ?dont bother!the idea here is to figurativly vacuum the heat away from there for that you will need a medium.composite polymer is a likly candidate if it can do all a process
or medium is required to do
post #159 of 387
Wished had Ivy-e info, don't see why they dont release them soon, but no word at all yet, heck there are rumers it won't even happen, le sigh the great decision on:D a purchase and ivy messing around with this stuff messed me up more,
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post #160 of 387
There's some interesting information on this subject in this guide to removing the IHS: http://www.overclock.net/t/305443/ihs-removals-how-to-do-it-should-i-do-it-and-the-facts

Here are some of the key points:
Quote:
(1.0) Advantages and Disadvantages [to removing the IHS]

(+)

-Higher clocks
-Higher volts
-Lower Temps
-Non-soldered IHS removal is very easy
-Soldered IHS removal can be done if you are very carefull and do not rush

(-)

-CPU Warranty is down the toliet
-Removing IHS on soldered CPU is extremely difficult, chance to destroy CPU is high
Quote:
Expect at minimum a 10c drop and a maximum of a 25c drop! I myself experienced a 17c drop
Quote:
You will feel amazed with the amount of money you spent on your CPU, found its proposed limit due to heat, then came across this guide and completed it successfully, and pulled another 200-500Mhz out of that processor of yours!

It also lists some of the IHS that were soldered and some that used paste from previous cpus. Here are a few that are interesting:

IHS Not Soldered To Die
-Core 2 Duo E7300
-Core 2 Duo E7400
-Core 2 Duo E7500
-Core 2 Duo E7600

IHS Soldered To Die
-Core 2 Duo E8300
-Core 2 Duo E8400
-Core 2 Duo E8500
-Core 2 Duo E8600

The E7000 series and E8000 series were fairly similar, but the cheaper E7000 series got the paste instead of solder likely to encourage overclockers to go for the more expensive E8000 series due to lower temps and better overclocks.

As I said before, I have a feeling Intel's doing this again with Ivy Bridge and Ivy Bridge-E. Ivy Bridge will probably get the paste, and Ivy Bridge-E will probably get the solder.
Edited by Mad Skillz - 4/26/12 at 6:17am
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Overclock.net › Forums › Industry News › Rumors and Unconfirmed Articles › [TPU] Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report