Originally Posted by $ilent
Read through about half of this thread but I have to ask the begging questions now.
1. If you remove the IHS of say a 3770k, what would you do after that just apply your aftermarket heatsink and make direct contact between the die and the heatsink? I would have thought there would like like 2mm gap between the heatsink and the die; if this is the case how would you go about ensuring the contact?
2. Does removing the IHS specifically require a waterblock to contact the die or can you use any after market air cooler?
edit: also to those saying the ES might have TIM but retail may be soldered, havent people been posting results with retail chips bought from Asia already and still have bad temps?
1) Remove the shim around the socket, this wasn't really any work for 775 at all but I can't speak for 1155.
2) No, anything that has screws you can adjust the tension on. You just bolt it down a bit harder than normal.
Originally Posted by samwiches
I see. Then IB's max safe temps are going to be 5C
higher than SB---but that doesn't excuse the fact that actual IB temps are 10-20C
above what you'd see at similar clocks of equal performance on SB.
So does the higher TjMax of 105C mean nothing?
People babied their SBs a lot of the time. Can't speak at high voltages but even on SB 85c or so should be fine.
Originally Posted by Kirby1
I really doubt retail chips will use thermal paste. Intels pockets are way to deep to make such a needless cut to their CPUs.
And that'd stop them why? Extra money is always good.
Everyone: The TIM won't be the only reason IB runs hotter than SB, it'll be part of it but a lot of it still comes down to heat density. This means that we should be able to lower temperatures a bit assuming it stays like that on retail chips. And it likely will.