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[TPU] Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report - Page 24  

post #231 of 387
Quote:
Originally Posted by Kirby1 View Post

I really doubt retail chips will use thermal paste. Intels pockets are way to deep to make such a needless cut to their CPUs.

Money is money to any big corporation. And with the amount of IVB chips that Intel expects to sell that .05c (very low estimate I'm guessing) will add up quickly. And where better to have that .05c? Intel's bank accounts.

It's sad thinking that Intel would stoop that low but it's a very possible reason.
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post #232 of 387
Quote:
Originally Posted by punceh View Post

@1.225V ye, good luck getting a chip that does 4.8~5 below 1.25.. i was just lucky tongue.gif sandy's @ 1.225V have awesome temps aswell.

Do you mind me asking how your chip was tested for stability? and whats max clocks after 4.8ghz?
Quote:
Originally Posted by Kirby1 View Post

I really doubt retail chips will use thermal paste. Intels pockets are way to deep to make such a needless cut to their CPUs.

I dont understand people saying retail wont use TIM (be hot chips) when several people have posted results of their retail chips bought from HK that were hot and had TDP of 95W? Unless those people have been scammed and got some sort of fake or ES that didnt show up in cpuz?
post #233 of 387
Quote:
Originally Posted by $ilent View Post

Do you mind me asking how your chip was tested for stability? and whats max clocks after 4.8ghz?

12hr prime blend and 30 runs of ibt on max mem.
after 4.8ghz(or 1.25~1.3V) the temps spike just as they do in other reviews. there seems to be quite a brick wall at 4.8 though, where it takes like 1.3 to get 4.9 close to stable, and 1.35~1.4 to get 5 close to stable.
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post #234 of 387
Quote:
Originally Posted by Kirby1 View Post

I really doubt retail chips will use thermal paste. Intels pockets are way to deep to make such a needless cut to their CPUs.

Define needless. If using paste allows the unit to function within factory specifications and costs less they will absolutely use it over a solder. Intel is in business to make money, and in manufacturing the goal is to produce the product as advertised, or as closely to it, for as little as possible.
    
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post #235 of 387
Quote:
Originally Posted by $ilent View Post

several people have posted results of their retail chips bought from HK that were hot and had TDP of 95W?

Intel have stated that the 95W TDP is so that motherboards designed for Ivy Bridge have VRM's that are backwards compatible with Sandy Bridge, with it's 95W TDP, and that Ivy actually only consumes around 77W on load
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post #236 of 387
Quote:
Originally Posted by $ilent View Post

Read through about half of this thread but I have to ask the begging questions now.

1. If you remove the IHS of say a 3770k, what would you do after that just apply your aftermarket heatsink and make direct contact between the die and the heatsink? I would have thought there would like like 2mm gap between the heatsink and the die; if this is the case how would you go about ensuring the contact?

2. Does removing the IHS specifically require a waterblock to contact the die or can you use any after market air cooler?

edit: also to those saying the ES might have TIM but retail may be soldered, havent people been posting results with retail chips bought from Asia already and still have bad temps?

1) Remove the shim around the socket, this wasn't really any work for 775 at all but I can't speak for 1155.

2) No, anything that has screws you can adjust the tension on. You just bolt it down a bit harder than normal.
Quote:
Originally Posted by samwiches View Post

I see. Then IB's max safe temps are going to be 5C higher than SB---but that doesn't excuse the fact that actual IB temps are 10-20C above what you'd see at similar clocks of equal performance on SB.

So does the higher TjMax of 105C mean nothing?

People babied their SBs a lot of the time. Can't speak at high voltages but even on SB 85c or so should be fine.
Quote:
Originally Posted by Kirby1 View Post

I really doubt retail chips will use thermal paste. Intels pockets are way to deep to make such a needless cut to their CPUs.

And that'd stop them why? Extra money is always good.

Everyone: The TIM won't be the only reason IB runs hotter than SB, it'll be part of it but a lot of it still comes down to heat density. This means that we should be able to lower temperatures a bit assuming it stays like that on retail chips. And it likely will.
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post #237 of 387
Quote:
Originally Posted by Kirby1 View Post

I really doubt retail chips will use thermal paste. Intels pockets are way to deep to make such a needless cut to their CPUs.

Looks like they are trying to stuff their pockets with more money by saving money on production costs and intentionally gimping IB to make more money on current products and future products. Sad. (My opinion)

http://techreport.com/discussions.x/22859
Quote:
we asked Intel about the interface between the Ivy Bridge die and the heat spreader. Intel has confirmed to TR that Ivy uses a "different package thermal technology" than Sandy Bridge. The firm stopped short of answering our questions about why the change was made and how the thermal transfer properties of the two materials compare.
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post #238 of 387
Quote:
Originally Posted by Brutuz View Post


Everyone: The TIM won't be the only reason IB runs hotter than SB, it'll be part of it but a lot of it still comes down to heat density. This means that we should be able to lower temperatures a bit assuming it stays like that on retail chips. And it likely will.

Heat density was a problem for SB as well and by using fluxless solder the problem was better handled. TIM is not the proper way to help cool IB.

It's got to be about Intel making more money.
Edited by SonDa5 - 4/26/12 at 10:16pm
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post #239 of 387
Quote:
Originally Posted by SonDa5 View Post

Heat density does was a problem for SB as well and by using fluxless solder the problem was better handled. TIM is not the proper way to help cool IB.
It's got to be about Intel making more money.

Yes I would agree, its about cheapening up the chip. That or its about making the SB-E or IB-E more attractive to enthusiasts. There is absolutely no other reason to switch from solder TIM to cheap (ceramic?) paste just out of the blue.
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post #240 of 387
Quote:
Originally Posted by iMPLiCiT View Post

Yes I would agree, its about cheapening up the chip. That or its about making the SB-E or IB-E more attractive to enthusiasts. There is absolutely no other reason to switch from solder TIM to cheap (ceramic?) paste just out of the blue.

Do you have an EE degree or any experience in the semiconductor industry? I sure don't either, but I also know that I'm in no position to say without a shadow of a doubt why intel or any other company does what they do when it comes to their CPU design. Maybe there is a legitimate reason why the TIM is the way it is.
    
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