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[TPU] Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report - Page 25  

post #241 of 387
Quote:
Originally Posted by SonDa5 View Post

Looks like they are trying to stuff their pockets with more money by saving money on production costs and intentionally gimping IB to make more money on current products and future products. Sad. (My opinion)
http://techreport.com/discussions.x/22859

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post #242 of 387
Quote:
Originally Posted by Oedipus View Post

Do you have an EE degree or any experience in the semiconductor industry? I sure don't either, but I also know that I'm in no position to say without a shadow of a doubt why intel or any other company does what they do when it comes to their CPU design. Maybe there is a legitimate reason why the TIM is the way it is.

Why does Intel admit to the fact they changed it for retail, but has no comment as to WHY? There is no legitimate reason to change it. Its simple thing that provides a thermal interface between the die and the integrated heatspreader. There's nothing particularly special about choosing one TIM over the other. They both serve the exact same purpose.
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post #243 of 387
Once again, you're acting like you know what you're talking about. Also, intel doesn't have to tell us why they do anything.
    
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post #244 of 387
Quote:
Originally Posted by Oedipus View Post

Once again, you're acting like you know what you're talking about. Also, intel doesn't have to tell us why they do anything.

They really don't have to tell us anyway, and you don't need an EE degree to see that it is a money saving decision plain and simple. They knew it would perform just fine at rated specs and quite a bit over said specs with the cheaper solution, so they opted for the cheaper one. Just business. The other conspiracy theory type stuff is funny though.
post #245 of 387
You're over-complicating something simple. You're trying to paint this issue as something magical that only ones with a degree in EE can comprehend. At the end of the day we are talking about THERMAL PASTE. They don't have to justify anything, but heck, they like to justify what they do if it is a selling point (3D transistors etc etc).
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post #246 of 387
Quote:
Originally Posted by iMPLiCiT View Post

You're over-complicating something simple. You're trying to paint this issue as something magical that only ones with a degree in EE can comprehend. At the end of the day we are talking about THERMAL PASTE. They don't have to justify anything, but heck, they like to justify what they do if it is a selling point (3D transistors etc etc).

Or maybe they just like making you mad.

Personally, I prefer to count my blessings. If they get enough (ridiculous) negative press over this, next time they wont make any of their CPUs OCable except for the Extreme Editions. There. Problem solved.
    
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post #247 of 387
It is a followup to one of best overclockers ever (SB), which is part of the frustration/confusion. But maybe Intel is letting us de-lid their processors from now on. thinking.gif
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post #248 of 387
I'm not mad at all, as I'm not an extreme overclocker. I just question why they're doing it. I'm still getting 3770k when they come out regardless of the TIM. What I do hope at the end of the day, that is yes, if they get enough negative press, they will not do this again.
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post #249 of 387
Quote:
Originally Posted by Oedipus View Post

Quote:
Originally Posted by iMPLiCiT View Post

You're over-complicating something simple. You're trying to paint this issue as something magical that only ones with a degree in EE can comprehend. At the end of the day we are talking about THERMAL PASTE. They don't have to justify anything, but heck, they like to justify what they do if it is a selling point (3D transistors etc etc).

Or maybe they just like making you mad.

Personally, I prefer to count my blessings. If they get enough (ridiculous) negative press over this, next time they wont make any of their CPUs OCable except for the Extreme Editions. There. Problem solved.

Yeah, that was something I was hinting at in my previous post. They know these chips work just fine at and far above the rated specs with the thermal solution they chose. They have no obligation to do anything better than that, or even allow OC'ing at all. The small difference in price between the two methods adds up to quite a bit of money when selling millions of said product. The money saved was deemed a worthy trade off to the little difference in temps that only a very very small market will even have to worry about.(those that push above 1.3v or even OC at all, etc)
post #250 of 387
Quote:
Originally Posted by iMPLiCiT View Post

I'm not mad at all, as I'm not an extreme overclocker. I just question why they're doing it. I'm still getting 3770k when they come out regardless of the TIM. What I do hope at the end of the day, that is yes, if they get enough negative press, they will not do this again.

Or they will and they will further stratify their CPU lineup by not offering any more -K CPUs. These "heat issues" only come into play after OCing, after all. Otherwise, they perform easily within spec, which means that as far as intel is concerned, there is nothing wrong with their choice of TIM on the IB CPUs.
    
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