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[TPU] Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report - Page 26  

post #251 of 387
The idea that Intel would start hobbling their CPU's to protect against OC's doesn't make much sense to me. There is a hardware market for enthusiasts that is bigger than ever now.
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post #252 of 387
Quote:
Originally Posted by samwiches View Post

The idea that Intel would start hobbling their CPU's to protect against OC's doesn't make much sense to me. There is a hardware market for enthusiasts that is bigger than ever now.

Intel is in a position to shape the market to their will. This is why AMD needs to step it up.
    
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post #253 of 387
But uh, they will simply hand it to AMD if they try something like that. All the coolers, mobos, rams.. all for AMD at that point.
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post #254 of 387
Quote:
Originally Posted by Oedipus View Post

Quote:
Originally Posted by iMPLiCiT View Post

Yes I would agree, its about cheapening up the chip. That or its about making the SB-E or IB-E more attractive to enthusiasts. There is absolutely no other reason to switch from solder TIM to cheap (ceramic?) paste just out of the blue.

Do you have an EE degree or any experience in the semiconductor industry? I sure don't either, but I also know that I'm in no position to say without a shadow of a doubt why intel or any other company does what they do when it comes to their CPU design. Maybe there is a legitimate reason why the TIM is the way it is.

It'd be almost definitely money. Solder would work fine on these chips but isn't required, we can mod them so intel figured they'd do that to save a bit of money. And potentially make some when someone screws their delidding up and gets another chip.

I think it's great, a hark back to the old days of OCing actually requiring some skill, not changing 3-4 BIOS settings and stress testing.
    
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post #255 of 387
Quote:
Originally Posted by Brutuz View Post

It'd be almost definitely money. Solder would work fine on these chips but isn't required, we can mod them so intel figured they'd do that to save a bit of money. And potentially make some when someone screws their delidding up and gets another chip.
I think it's great, a hark back to the old days of OCing actually requiring some skill, not changing 3-4 BIOS settings and stress testing.



Will that be better at cooling die than the fluxless solder?
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post #256 of 387
Quote:
Originally Posted by Brutuz View Post

It'd be almost definitely money. Solder would work fine on these chips but isn't required, we can mod them so intel figured they'd do that to save a bit of money. And potentially make some when someone screws their delidding up and gets another chip.
I think it's great, a hark back to the old days of OCing actually requiring some skill, not changing 3-4 BIOS settings and stress testing.

That would only lead to them selling less chips. People who are looking to OC them will refuse to buy them at $300 a pop, if it means once the chip dies your left to no option but to fork out another $300. You might as well save yourself the headache now and buy a Sandy-E and OC it to 5Ghz.
Quote:
Originally Posted by Oedipus View Post

Or they will and they will further stratify their CPU lineup by not offering any more -K CPUs. These "heat issues" only come into play after OCing, after all. Otherwise, they perform easily within spec, which means that as far as intel is concerned, there is nothing wrong with their choice of TIM on the IB CPUs.

They should of at least used the TIM on locked chips (non-K) and not the unlocked ones. If this be the cause of the temperate problem at all, it wouldn't seem logical to sell a chip deemed "overclockable". That gets extremely hot when overclocked the slightest bit.
Edited by Warmonger - 4/26/12 at 10:27pm
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post #257 of 387
Quote:
Originally Posted by Brutuz View Post

Quote:
Originally Posted by Oedipus View Post

Do you have an EE degree or any experience in the semiconductor industry? I sure don't either, but I also know that I'm in no position to say without a shadow of a doubt why intel or any other company does what they do when it comes to their CPU design. Maybe there is a legitimate reason why the TIM is the way it is.

It'd be almost definitely money. Solder would work fine on these chips but isn't required, we can mod them so intel figured they'd do that to save a bit of money. And potentially make some when someone screws their delidding up and gets another chip.

I think it's great, a hark back to the old days of OCing actually requiring some skill, not changing 3-4 BIOS settings and stress testing.

That's what I'm thinking hoping-- hard to RMA a chip with its cores sticking out..
Edited by samwiches - 4/26/12 at 10:27pm
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post #258 of 387
Concrete evidence showing why Ivy bridge runs hot is considered a rumor? rolleyes.gif
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post #259 of 387
Quote:
Originally Posted by samwiches View Post

That's what I'm thinking hoping-- hard to RMA a chip with its cores sticking out..

Or maybe you can stick that IHS back on as easily as you took it off and hope it'll pass
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post #260 of 387
Quote:
Originally Posted by shiftwig113 View Post

Concrete evidence showing why Ivy bridge runs hot is considered a rumor? rolleyes.gif

We don't really have any solid evidence of the tim under the IHS causing IB to be hot, and that's what this thread is about.
 
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