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[TPU] Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report - Page 38  

post #371 of 387
Quote:
Originally Posted by KhaoticKomputing View Post

I see one thing to do with this. Remove IHS, LAP the living snot out of it! replace it with some kind of high end TIM, such as ICD,Shin Etsu, ect, ect. This would be a very user friendly performance mod in that you have less chance of destroying your CPU during the lapping process.

Removing the IHS from the CPU is vastly more dangerous than lapping the IHS while it's attached to the CPU. Putting the IHS back on would also defeat the whole point, as none of the TIMs you mention are appreciably better than what Intel is using.

Indeed, LGA CPUs are almost impossible to damage while lapping.
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post #372 of 387
Quote:
Originally Posted by Blameless View Post

Removing the IHS from the CPU is vastly more dangerous than lapping the IHS while it's attached to the CPU. Putting the IHS back on would also defeat the whole point, as none of the TIMs you mention are appreciably better than what Intel is using.
Indeed, LGA CPUs are almost impossible to damage while lapping.

Tall claim my friend. There are tons of things that can go wrong while lapping that could render the CPU useless or even affect the mobo socket. The replacing of the TIM wasn't for performance..but again I would be shocked if they used high quality TIM. The stuff they use on the HS's is of marginal quality and too much is used. From the pic on the first post It looks like they used too much... least IMO... anyway I don't really think it matter's at all.
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post #373 of 387
Lapping the heatsink base is important for gains on a lidless CPU. The IHS is concave, a heatsink base is convex and a CPU core is flat. Heatsink also needs to be flat, and preferably mirrored.
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post #374 of 387
Quote:
Originally Posted by KhaoticKomputing View Post

Tall claim my friend. There are tons of things that can go wrong while lapping that could render the CPU useless or even affect the mobo socket. The replacing of the TIM wasn't for performance..but again I would be shocked if they used high quality TIM. The stuff they use on the HS's is of marginal quality and too much is used. From the pic on the first post It looks like they used too much... least IMO... anyway I don't really think it matter's at all.

How do you do anything to the socket while lapping?

Anyways, lapping current intel CPUs is really safe. It's not hard, you really can't kill the CPU unless you sand the wrong side. I didn't even bother with protecting the CPU with tape or something the last time I did it. Turned out fine.

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post #375 of 387
Quote:
Originally Posted by KhaoticKomputing View Post

Tall claim my friend. There are tons of things that can go wrong while lapping that could render the CPU useless or even affect the mobo socket.

I've lapped dozens of CPU IHSes, never permanently damaged any of them via lapping, and never damaged an LGA CPU during lapping at all. Sand it flat, rinse it off, dry it out, install it...not much can go wrong unless you are a complete idiot.

Short of static electricity, there is almost nothing one can do (accidentally) that will seriously damage an LGA chip. Even static is rarely a concern if water is used to assist in lapping and/or basic precautions are taken.

There are no protrusion to break off, no pins to damage, and nothing that is especially vulnerable to corrosion, while the IHS itself protects the chip from mechanical forces.

I have no idea how you could possibly affect the motherboard's socket by lapping the CPU's IHS.
Quote:
Originally Posted by KhaoticKomputing View Post

The replacing of the TIM wasn't for performance..but again I would be shocked if they used high quality TIM. The stuff they use on the HS's is of marginal quality and too much is used. From the pic on the first post It looks like they used too much... least IMO

They didn't use too much, they used enough to make sure the entrity of the die was covered, which is absolutely critical. Unlike an IHS, every single square mm of the die has active transitors that need to be cooled. The bondline is quite thin, and this is what counts for thermal performance.

Intel doesn't skimp on the TIM, it's Dow Corning stuff and while chosen for their durability/longevity they do have good thermal characteristics.
Quote:
Originally Posted by Alatar View Post

I didn't even bother with protecting the CPU with tape or something the last time I did it.

I never put anything over the pads on LGA chips, fingers aren't going to hurt it, and tape just leaves adhesive that needs to be cleaned off.
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post #376 of 387
Quote:
Originally Posted by KhaoticKomputing View Post

Quote:
Originally Posted by Blameless View Post

Removing the IHS from the CPU is vastly more dangerous than lapping the IHS while it's attached to the CPU. Putting the IHS back on would also defeat the whole point, as none of the TIMs you mention are appreciably better than what Intel is using.
Indeed, LGA CPUs are almost impossible to damage while lapping.

Tall claim my friend. There are tons of things that can go wrong while lapping that could render the CPU useless or even affect the mobo socket. The replacing of the TIM wasn't for performance..but again I would be shocked if they used high quality TIM. The stuff they use on the HS's is of marginal quality and too much is used. From the pic on the first post It looks like they used too much... least IMO... anyway I don't really think it matter's at all.

eh-smiley.gif

Maybe on an AMD CPU, but so long as you keep the foam protection on the pins and your surface with paper completely flat(hence why mirrors and window panes are best) you shouldn't have a single problem with lapping the CPU. Done more than my fair share now and never had a single problem with borking a chip. I borked a finger by sanding through the epidermal layer but never a problem with a CPU. I think you gotta be pretty ham fisted to have a problem lapping one. mellowsmiley.gif

~Ceadder smil3dbd4e4c2e742.gif
 
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post #377 of 387
I guess all the horror story's involving lapping are made up then. but like I said. It dose not matter.
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post #378 of 387
Quote:
Originally Posted by KhaoticKomputing View Post

I guess all the horror story's involving lapping are made up then. but like I said. It dose not matter.

I can't speak to the horror stories, but I can say lapping is not for the faint of heart.

Here you have one of the most important pieces of a system.

One that could cost upwards to $1500.

And you're about to blow the warranty by removing the information that tells the manufacturer it's legitimately theirs on first glance. So if it's fried that's it. You have a $1500 paper weight.

I don't need horror stories to make me think twice. I have an expensive piece of the system that if you mess it up the system don't run and you don't get a second chance reprieve from the manufacturer.

If you can't reconcile that and feel confident in your ability, I wouldn't recommend lapping a CPU.

But you can always get your hands on a cheapo donor system and lapp that CPU for practice. Warranty is already done. No harm no foul if you bork the CPU in it. wink.gif

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post #379 of 387
Wrong thread biggrin.gif
Edited by Kasp1js - 4/30/12 at 12:28am
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post #380 of 387
Quote:
Originally Posted by IronWill1991 View Post

http://click.intel.com/tuningplan/

does this cover lapping as well?

edit: never mind, just read that it doesn't
Edited by Iketh - 4/30/12 at 1:13am
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Overclock.net › Forums › Industry News › Rumors and Unconfirmed Articles › [TPU] Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report