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[TPU] Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report - Page 5  

post #41 of 387
Quote:
Originally Posted by triallen View Post

Doesn't really make sense to me from a cost-saving perspective. The unlocked processors are already targeted at a limited market, and many already have ivy bridge ready motherboards. Limiting the overclocking by using cheap TIM is going to give people on SB no reason to upgrade. So by saving a few pennies, they essentially lose a great deal of potential customers.

Although given that this is the last processor family using the 1155 socket, it's possible they'd rather put that money towards Haswell.
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post #42 of 387
Quote:
Originally Posted by Xenthos View Post

Useless with these, since it is the contact on the inside that is supposedly bad, not the outside.

O really ..?
this is what you will get ;
CPU Die -> 5 W/mK TIM -> IHS -> 5 W/mK TIM -> Heatsink/H20 block will be better
(lapping IHS paper thin=around 30% instead of 100% )+ no TIM (Indigo is supper thin=like liquid/after flow is solid )
Edited by coolhandluke41 - 4/25/12 at 4:59pm
    
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post #43 of 387
Kinda disappointing considering the delays Ivy Bridge already has had. You think this will be the same for all the SKUs?
     
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post #44 of 387
Holy encyclopedia batman, my layman soldering information was purely based on tin/lead soldering, I wasn't thinking of the terms "flux" and soldering related to other ways to bond things. Just didn't make sense to solder non-metal materials :-)

Thanks for the education, public school left that out :-)
post #45 of 387
People are saying that we could just put the cooler straight on the die, but couldn't we just put new, better TIM on the die and slap the IHS back on? Wouldn't that reduce risk of cracking/chipping the die?
 
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post #46 of 387
Would have made for a much better article if they would have tested the chip after removing the IHS. There may be a reason behind not testing it, like finding a cooler that would make proper contact with the die. Even if you remove the mounting mechanism on the board you would probably have to lap the crap out of the contact surface to remove the bow that most coolers have. If Intel doesn't fix it maybe the aftermarket will come through with water blocks made specifically for lidless processors.
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post #47 of 387
Reminds me of my old Pentium E5200. It had the same generic looking white paste under the heatspreader. I ran that thing forever under a Zalman CNPS9500AT with no IHS and got much better temps than before removal. Had to bend the mounting clip across the center a little bit to compensate for the lower height, but that's the bad news though... How many coolers out there can be so easily modded to fit to the die after IHS removal? I'm guessing not many, not counting water blocks.
I know someone else already said it in this thread and I agree, I'd like to see someone do some temperature testing with the IHS removed. I'm guessing it'll happen soon as you can bet this news is spreading rapidly.
Edited by metal_gunjee - 4/25/12 at 5:16pm
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post #48 of 387
Quote:
Originally Posted by Scorpion667 View Post

I've removed the IHS before on an AMD 3700, it's not hard. The only issue was that it was very hard to find a cooler that could compensate for the reduce "ride" height of the Die, compared to Die + IHS.

This
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post #49 of 387
This really rustles my jimmies.

I wonder if the phanteks ph-tc14pe could work lidless... headscratch.gif
post #50 of 387
Some one test ASAP please biggrin.gif

I cant wait to see the results!
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Overclock.net › Forums › Industry News › Rumors and Unconfirmed Articles › [TPU] Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report