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Future ivy bridge release

post #1 of 5
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Any info on whether intel will release chips that are soldered to the ihs instead of using thermal paste? I'm assuming it would take a lot of effort and equipment to solder it as they do by yourself.
post #2 of 5
Don't think so, but they will make cooler versions in the future with different stepping.
    
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post #3 of 5
Quote:
Originally Posted by Willanhanyard View Post

Don't think so, but they will make cooler versions in the future with different stepping.

Sadly I doubt they will release a new stepping that actually fixes the temperatures(Considering Intel only showed 3 Steppings for Sandybridge and only 1 of them was available to consumers while the other 2 were ES's if I recall). Intel seems to already acknowledge that they meant to use the Thermal Interface instead of Solder and the fact that they used Thermal Interface instead of Solder is looking like the reason for higher temperatures.
Edited by Feud - 4/27/12 at 1:15am
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post #4 of 5
I just hope we can persuade them to use solder on haswell. Intel brought overclockers k chips, they eventually released tjmax after enough temp banter, and even made tjmax software accessible and released a white paper reviewing coretemp and realtemp. So they do listen if they get enough feedback. But I agree, at best we get solder tim by haswell release, seriously doubt any tim change until then.
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post #5 of 5
Quote:
Originally Posted by CarmelloTruffle View Post

Any info on whether intel will release chips that are soldered to the ihs instead of using thermal paste? I'm assuming it would take a lot of effort and equipment to solder it as they do by yourself.

I think it highly unlikely that they would change their minds and start soldering the die to the heatsink again. These sorts of decisions aren't made lightly. The undoubtedly did a great deal of testing and determined that the minimal effect on thermals at stock speeds was worth the decrease in cost by avoiding solder. The overclocking community probably isn't a large enough part of their market to warrant a few Ivy Bridge SKUs being soldered while the rest aren't.
Quote:
Originally Posted by Feud View Post

Quote:
Originally Posted by Willanhanyard View Post

Don't think so, but they will make cooler versions in the future with different stepping.

Sadly I doubt they will release a new stepping that actually fixes the temperatures(Considering Intel only showed 3 Steppings for Sandybridge and only 1 of them was available to consumers while the other 2 were ES's if I recall). Intel seems to already acknowledge that they meant to use the Thermal Interface instead of Solder and the fact that they used Thermal Interface instead of Solder is looking like the reason for higher temperatures.

I agree, there will almost certainly be no further steppings for Ivy Bridge. I would point out that Sandy Bridge actually had quite a few steppings before release - the retail D2 revision is the 7th stepping. The earliest leaks in June 2010 involved the 3rd stepping - C0. The sixth stepping - D1 - was used for qualification samples and some were sent to reviewers.

Ivy Bridge has had even more revisions. The retail E1 revision is the 9th stepping. The first leaks in June last year involved the 2nd stepping - B0. The 8th stepping - E0 - was used for qualification samples and probably went into production in very late Q3 2011. It was replaced by the retail E1 stepping which went into production in the last few weeks of 2011. With so many revisions, Intel has probably gotten Ivy Bridge as good as its going to get.

There will be new Ivy Bridge dies released - including a quad core die with only 6MB of L3 and HD 2500 graphics. These dies will have different stepping designations, but they are essentially just cropped versions of the full E1 die. This is similar to how the Core i7 3820 is based on the M1 stepping - which is essentially a cropped four core version of the C2 eight core die.
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