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[Xbit] Globalfoundries' Fab 8 to Enable 3D Stacking of Chips.

post #1 of 21
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Quote:
Globalfoundries said Thursday that it had begun to install a special set of production tools to create through-silicon vias (TSVs) in semiconductor wafers processed on the company's leading-edge 20nm technology platform at Fab 8. The TSV capabilities will allow customers to stack multiple chips on top of each other, providing another avenue for delivering the demanding requirements of future electronic devices.

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post #2 of 21
Interesting.

Although probably not very useful for high power density stuff like CPU's bcos of the heat. One would have to install diamond layers between the chips even at moderate energy densities for getting the heat out I imagine.
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post #3 of 21
Quote:
Originally Posted by Carniflex View Post

Interesting.
Although probably not very useful for high power density stuff like CPU's bcos of the heat. One would have to install diamond layers between the chips even at moderate energy densities for getting the heat out I imagine.

Good for lower power CPUs though. thumb.gif

ARM CPU + RAM on top.
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post #4 of 21
Quote:
Originally Posted by DuckieHo View Post

Good for lower power CPUs though. thumb.gif
ARM CPU + RAM on top.

Yeah that would definitely kill any bottleneck in a chip made for a mobile or other low power platform, but only if yields made it worth while. But like all other things I definitely wouldnt want the 1st gen of stacked chips in case they suck bad or just REALLY expensive.
 
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post #5 of 21
I like this plan of stacking the chips.
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post #6 of 21
Quote:
Originally Posted by DuckieHo View Post

Good for lower power CPUs though. thumb.gif
ARM CPU + RAM on top.

This.
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post #7 of 21
probably only useful for very low power - otherwise will end up hot like ivy
post #8 of 21
Quote:
Originally Posted by Carniflex View Post

Interesting.

Although probably not very useful for high power density stuff like CPU's bcos of the heat. One would have to install diamond layers between the chips even at moderate energy densities for getting the heat out I imagine.

Whatever they use to disperse heat between layers, as long as it keeps it cool, you could possibly see higher powered chips stacked on top of each other. But slabbing memory/gpus/etc., on top of each other would be really interesting to see happen from this. Would really benefit phones and tablets I'd think and eventually the desktop environment.
post #9 of 21
Stacked chips are good to reduce footprints/pins and reduce latency/skew. Makes life easier for OEM/ODMs.
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post #10 of 21
Quote:
Originally Posted by Alchemist07 View Post

probably only useful for very low power - otherwise will end up hot like ivy

Wrong, enjoy the read:
http://www.overclockers.com/ivy-bridge-temperatures

If the high power parts are close to the IHS it shouldn't be a problem.
Edited by Just a nickname - 4/27/12 at 5:23am
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