No point in me delidding, my paste freezes at about -160, If I had some GCextreme for under and on top of the IHS I would consider it. The amount of pressure the retention bracket puts on the IHS I wouldn't feel comfortable replicating on a bare die with a heavy pot either. Besides that.. all testing has shown an increase in temps with a bare die, so yeah, no thanks.
These chips are just hot, check the temps my phase was pulling on the last stream when folding @ 5ghz, was about 6 degrees hotter than a bulldozer @ 5.5. Small delta between cpu and pot temps too, 3 degrees at most. If there was a problem between die and ihs it would be much larger.
Lets see what all the fuss is about