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[PCEvaluation] Intel i7 3770K Temperature Measured Without IHS - Page 13

post #121 of 156
You guys are arguing about quite possibly the stupidest thing I've ever seen anybody argue about on OCN.... And I've seen some pretty stupid stuff here.
 
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post #122 of 156
Quote:
Originally Posted by G3RG View Post

You guys are arguing about quite possibly the stupidest thing I've ever seen anybody argue about on OCN.... And I've seen some pretty stupid stuff here.

Who's side you on then? Secure? Or Risk it?
post #123 of 156
I guess I'd tape it, it'd be much easier to apply the heatsink... and much safer tongue.gif
 
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post #124 of 156
Quote:
Originally Posted by G3RG View Post

I guess I'd tape it, it'd be much easier to apply the heatsink... and much safer tongue.gif

Thank You my Point. Not so Stupid after all biggrin.gif I just try to make 2+2=4 Not 22.
post #125 of 156
The chip stays in the socket even without the tape if you mount the cooler while to mobo is on a table or something. There is no point in using tape unless you just want to be careful for the sake of being careful.
 
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post #126 of 156
Quote:
Originally Posted by Alatar View Post

The chip stays in the socket even without the tape if you mount the cooler while to mobo is on a table or something. There is no point in using tape unless you just want to be careful for the sake of being careful.

Crap, now I'm part of the stupidest argument on ocn rolleyes.gif

Can't hurt.............................................................................
 
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post #127 of 156
Quote:
Originally Posted by G3RG View Post

Crap, now I'm part of the stupidest argument on ocn rolleyes.gif
Can't hurt.............................................................................

biggrin.gif Can't be the stupidest if your teaching people.
Quote:
Originally Posted by Alatar View Post

The chip stays in the socket even without the tape if you mount the cooler while to mobo is on a table or something. There is no point in using tape unless you just want to be careful for the sake of being careful.

There can never be to much safety. Plus what if he does not have the time to take the motherboard out just to change the CPU.
Edited by RussianHak - 5/5/12 at 5:42am
post #128 of 156
Quote:
Originally Posted by RussianHak View Post

Please tell me good Sir, How is he doing it Wrong? I don't think he is doing it for decoration, but for the tape to do it's thing. Meaning he is doing it right. The CPU Cooler is applying Pressure. Simple stuff guys. I can't believe half this thread is based on that. LOL

Seriously? You're calling me out on this? I thought it was fairly simple...Oh well, let me explain: Socket 1156/1155 come out. Noctua designs the D14 for it. Of course, the IHS is soldered on and not many people (if anyone) is removing it and Intel aren't providing any chips without an IHS. They design the pressure (ie. The entire SecuFirm2 locking technology) around what pressure it applies on a chip with the stock configuration. Taking the IHS off removes a good 2-3mm of height...The coolers springs are the same unless some voodoo magic changed it or he didn't say a word about changing them or whatever. Simple logic dictates that there is less pressure on the CPU die, which has been proven to directly impact performance.

He should have done something, anything (For example, stiffer springs...A way to mount all brackets 2-3mm lower, use invention logic to think of something) to make up for that extra space.

Come on, I've had two cups of vodka, three cans of rum and god-knows how much bourbon and I can understand this.
Quote:
Originally Posted by RussianHak View Post

You won't be saying that when you screw up some pins because the cooler is blocking sight of the socket.

Have you ran a chip without an IHS in an LGA socket before? I can post pictures proving I have. I've never screwed up pins. My mothers Pentium Dual Core E2180 is running IHSless at the moment. The E6700 I'm giving to a friend for his birthday would be if it wasn't soldered.
Quote:
Originally Posted by G3RG View Post

I guess I'd tape it, it'd be much easier to apply the heatsink... and much safer tongue.gif

Simply have the boards back on the table. Throw the chip in and put the cooler on. Gravity is more than enough to keep the chip in. Believe me. I have more than enough experience with this...I've even installed IHSless Socket 775 chips running at the normal angle they'll go in..Not easy, but fun to do. biggrin.gif

Unless you're in space...In which case I recommend not going IHSless...Those radiation hardened 386s don't even have an IHS.


And once again, just in case no-one got it last time: Running IHSless isn't going to reduce IB temps to 70c load at most running über high volts. But if it helps one person get to 4.8Ghz (And beat most SBs) then I'm content with posting all this information...Better than hiding it for myself.
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post #129 of 156
Quote:
Originally Posted by Brutuz View Post

Taking the IHS off removes a good 2-3mm of height...The coolers springs are the same unless some voodoo magic changed it or he didn't say a word about changing them or whatever. Simple logic dictates that there is less pressure on the CPU die, which has been proven to directly impact performance.

This is true and I can confirm it with what I've tried in the past by either delidding a chip or trying to use a mobile chip with the same cooler. With the delidded chips I eventually set the IHS back onto the chip and temps went back down to about where they had been before. With the mobiles I had to change coolers/cooling methods used to get temps down.
Quote:
Originally Posted by Brutuz View Post

He should have done something, anything (For example, stiffer springs...A way to mount all brackets 2-3mm lower, use invention logic to think of something) to make up for that extra space.
Come on, I've had two cups of vodka, three cans of rum and god-knows how much bourbon and I can understand this.

I'm sure I could understand it too if I'd had all of that but I don't know if I could see straight enough to actually do it......biggrin.gif
Quote:
Originally Posted by Brutuz View Post

Have you ran a chip without an IHS in an LGA socket before? I can post pictures proving I have. I've never screwed up pins. My mothers Pentium Dual Core E2180 is running IHSless at the moment. The E6700 I'm giving to a friend for his birthday would be if it wasn't soldered.
Simply have the boards back on the table. Throw the chip in and put the cooler on. Gravity is more than enough to keep the chip in. Believe me. I have more than enough experience with this...I've even installed IHSless Socket 775 chips running at the normal angle they'll go in..Not easy, but fun to do. biggrin.gif
Unless you're in space...In which case I recommend not going IHSless...Those radiation hardened 386s don't even have an IHS.
And once again, just in case no-one got it last time: Running IHSless isn't going to reduce IB temps to 70c load at most running über high volts. But if it helps one person get to 4.8Ghz (And beat most SBs) then I'm content with posting all this information...Better than hiding it for myself.

Again I must concur.

The only way I could see a lack of a IHS would make a difference is in the cooler's contact pressure with the difference in the surface height of the CPU's core surface vs the depth/ how low the cooler's own contact surface will extent down before the retention mechanism bottoms out, affecting the contact pressure itself which in turn affects the thermal transfer efficiency of the setup. Lose efficiency and you gain heat buildup within the chip - That's clearly not a good thing. True, the TIM used along with the cooler itself is a factor but we're talking about the basics here, what we know will adversely affect things in this way, all others being variables but controllable with the same pressure if considering contact pressure alone.

I've also noted alot of the talk has been about the TIM used, the smaller process used, ect but there is one thing that came to mind while reading through this. You have a CPU under the same size IHS that SB uses with cores packed in tightly, then you have on top of that the processes of a GPU going on too under all of that. That's alot of stuff going on under the lid and we know GPU's themselves will run hotter than CPU's do.... This is making me wonder if along with the tighter packed cores, the CPU processes and the GPU processes at work under the same lid, would higher temps simply be something that's unavoidable (At least to an extent) regardless of TIM/ TIM methods used?
Or is it even fair to expect temps to be the same as SB with the cores packed in tighter along with the new die shrink? headscratch.gif
Edited by Kryton - 5/5/12 at 10:20am
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post #130 of 156
Quote:
Originally Posted by Kryton View Post

This is true and I can confirm it with what I've tried in the past by either delidding a chip or trying to use a mobile chip with the same cooler. With the delidded chips I eventually set the IHS back onto the chip and temps went back down to about where they had been before. With the mobiles I had to change coolers/cooling methods used to get temps down.

I'm sure I could understand it too if I'd had all of that but I don't know if I could see straight enough to actually do it......biggrin.gif
Again I must concur.
The only way I could see a lack of a IHS would make a difference is in the cooler's contact pressure with the difference in the surface height of the CPU's core surface vs the depth/ how low the cooler's own contact surface will extent down before the retention mechanism bottoms out, affecting the contact pressure itself which in turn affects the thermal transfer efficiency of the setup. Lose efficiency and you gain heat buildup within the chip - That's clearly not a good thing. True, the TIM used along with the cooler itself is a factor but we're talking about the basics here, what we know will adversely affect things in this way, all others being variables but controllable with the same pressure if considering contact pressure alone.
I've also noted alot of the talk has been about the TIM used, the smaller process used, ect but there is one thing that came to mind while reading through this. You have a CPU under the same size IHS that SB uses with cores packed in tightly, then you have on top of that the processes of a GPU going on too under all of that. That's alot of stuff going on under the lid and we know GPU's themselves will run hotter than CPU's do.... This is making me wonder if along with the tighter packed cores, the CPU processes and the GPU processes at work under the lid, would higher temps simply be something that's unavoidable (At least to an extent) regardless of TIM/ TIM methods used?
Or is it even fair to expect temps to be the same as SB with the cores packed in tighter along with the new die shrink? headscratch.gif

It's three in the morning, but I honestly applauded your post. It is as correct as anyone except Blameless has been on this issue of IHS/Cooling for IB.
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