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[PCEvaluation] Intel i7 3770K Temperature Measured Without IHS - Page 14

post #131 of 156
5/5/12 at 10:26am
Quote:
Originally Posted by Brutuz View Post

It's three in the morning, but I honestly applauded your post. It is as correct as anyone except Blameless has been on this issue of IHS/Cooling for IB.

I can't say I'm actually 100% correct (That would just be arrogant of me) and was trying to think about "Why" temps were higher and a possible explanation to that. Not basing this on any experience with IB but on previous experiences with other chips, both lidded, delidded....... And re-lidded too. rolleyes.gif
Edited by Kryton - 5/5/12 at 10:31am
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post #132 of 156
5/5/12 at 10:37am
Its not Tim, its the 3d transistors causing more heat

100% positive

Please dont insult intel, they arnt that stupid
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post #133 of 156
5/5/12 at 11:08am
Quote:
Originally Posted by Kryton View Post

I can't say I'm actually 100% correct (That would just be arrogant of me) and was trying to think about "Why" temps were higher and a possible explanation to that. Not basing this on any experience with IB but on previous experiences with other chips, both lidded, delidded....... And re-lidded too. rolleyes.gif

Definitely. This is just finding a way to lower temps enough to beat SB in benchmarks and the real world.
Quote:
Originally Posted by finalturismo View Post

Its not Tim, its the 3d transistors causing more heat
100% positive
Please dont insult intel, they arnt that stupid

Damn right. See above as to why anyone is actually suggesting this method of reducing temperatures. wink.gif

I mean, an AU$89 cooler and AU$0.25 set of washers is cheaper than an AU$400 WC kit that'll cool just as much.
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post #134 of 156
5/5/12 at 12:29pm
Quote:
Originally Posted by johnny13oi View Post

If you are not worried about warranty. You could probably use a liquid metal type product like Indigo Xtreme or a really good thermal paste like IC Diamond which I have used before and is absolutely amazing in my opinion.

you mean use one of those for the CPU Die-IHS interface?
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post #135 of 156
5/5/12 at 1:25pm
so basically the limitation is the actual die that just isnt transfering heat fast enough out.

only thing you can do about that is bring the cold to the die itself. using dry ice or LN2.
not practical

anyone have any bright ideas on how to solve this problem? whats currently being done?

i feel bad for the people that spent so much money on a WC system because they just arent benefiting from it like they should.
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post #136 of 156
5/5/12 at 1:31pm
I don't think the iGPU is relevant to temps in these scenarios. It would have been almost completely idle in these tests, and silicon is a terrible thermal conductor, so even a hot GPU would have little impact on the CPU cores.
Quote:
Originally Posted by RussianHak View Post

Thing is, this guy is Extra Careful. There can never be to much insurance.

If he was being extra careful he probably wouldn't have cut the IHS off his CPU with a razor blade; he'd have sanded through it, leaving a bare die, and a convenient shim.

Anyway, like I said originally, tape is not necessary, but it's certainly not going to hurt anything.
Quote:
Originally Posted by finalturismo View Post

Its not Tim, its the 3d transistors causing more heat
100% positive

I suspect it's the die shrink more than the type of transistors. 3D/tri-gate transistors are likely reducing leakage and temps relative to what they would be on more conventional types, assuming a similar lithography node.
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post #137 of 156
5/6/12 at 8:20am
Quote:
Originally Posted by Blameless View Post

I don't think the iGPU is relevant to temps in these scenarios. It would have been almost completely idle in these tests, and silicon is a terrible thermal conductor, so even a hot GPU would have little impact on the CPU cores.
If he was being extra careful he probably wouldn't have cut the IHS off his CPU with a razor blade; he'd have sanded through it, leaving a bare die, and a convenient shim.
Anyway, like I said originally, tape is not necessary, but it's certainly not going to hurt anything.
I suspect it's the die shrink more than the type of transistors. 3D/tri-gate transistors are likely reducing leakage and temps relative to what they would be on more conventional types, assuming a similar lithography node.

so basically its about 30% smaller and we are cramming in just as much power into it as the sandy bridge?

i did find it weird that even taking off the IHS didnt do anything for the temp at all.
usually you see a big improvement.
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post #138 of 156
5/6/12 at 12:27pm
They should have soldered the IHS to die to see the actual reason of excessive heat.
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post #139 of 156
5/6/12 at 1:46pm
oh come on guys its intel plan. they aim for thi, so people want more better, u must get the sbe. remember when sb came out, and what happens to the 990x.
use ur brain n think. they already had bad selling of the sbe already, they need to make something that mainstream can't success,so people need to pay top dollar for top performance.periods
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post #140 of 156
5/6/12 at 3:50pm
Quote:
Originally Posted by forever109 View Post

oh come on guys its intel plan. they aim for thi, so people want more better, u must get the sbe. remember when sb came out, and what happens to the 990x.
use ur brain n think. they already had bad selling of the sbe already, they need to make something that mainstream can't success,so people need to pay top dollar for top performance.periods
Not a fan of all these self crippling conspiracies. It makes no business sense what so ever. You really expect them to do this over just producing a cheaper less capable product and keeping the same price?
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