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[PCEvaluation] Intel i7 3770K Temperature Measured Without IHS - Page 4

post #31 of 156
4/27/12 at 10:23pm
Quote:
Originally Posted by Comp4k View Post

The heatsink they used has many channels (pipes), since the core only takes up a small amount of space, only 1 channel is being used to cool the core vs, the 6-8 it has. The heatsink is optimized for a larger surface, which explains the higher temps- heat is only being dissapated from the center channel of the heatsink- instead of all the way across.

yes but that channel is as large as the contact area to begin with, not much more can be done.
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post #32 of 156
4/27/12 at 10:27pm
The heat sink dissipates all the way across just like IHS does when it makes contact with the chip

The heat sink is a solid chunk of metal with heat pipes. first the heat goes to the chunk of the heatsink then the heat pipes.
Edited by wingman99 - 4/27/12 at 10:35pm
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post #33 of 156
4/27/12 at 10:34pm
can sodium be used to raise the w/m-k rating of paste or even add a layer directly to processor priror to putting paste!its 84 w/m-k would rise paste cooling capacity by a lot i think
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post #34 of 156
4/27/12 at 10:54pm
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So clearly its not the TIM that is causing the heat issue here. Good to know thanks im now dissuaded.
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post #35 of 156
4/27/12 at 10:59pm
Maybe they were just at the thermal limit of the air cooler?

Should of used a water cooler tbh....
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post #36 of 156
4/27/12 at 10:59pm
Quote:
Originally Posted by Comp4k View Post

The heatsink they used has many channels (pipes), since the core only takes up a small amount of space, only 1 channel is being used to cool the core vs, the 6-8 it has. The heatsink is optimized for a larger surface, which explains the higher temps- heat is only being dissapated from the center channel of the heatsink- instead of all the way across.



This is why the fluxless solder directly on the die to the IHS helps increase the heat dissipation to the larger area. Intel has seriously crippled IB by not using proper fluxless solder method for proper IHS bonding.
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post #37 of 156
4/28/12 at 1:28am
Quote:
Originally Posted by Mr Frosty View Post

Maybe they were just at the thermal limit of the air cooler?
Should of used a water cooler tbh....

With IB? yeah no. power consumption / heat output is ridiculously small.
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post #38 of 156
4/28/12 at 1:37am
Quote:
Originally Posted by Oedipus View Post

IB is exactly what everyone expected for it to be, except for the temperature issue. It is better than SB except for the temp thing. Not a flop

Well as far as I have seen the major expectation was that it will be about the same as SB but will OC higher bcos its a smaller process. So in this regard it is not what "everyone" expected.

Not a bad chip overall and I would not go as far as to call it flop ofc - at least it has marginally higher IPC - unlike the recent release from the other manufacturer wink.gif
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post #39 of 156
4/28/12 at 1:49am
Quote:
Originally Posted by ehume View Post


+rep for ol' Chuck's sake.

I'm betting that the more closely packed circuitry is going to breathe new life into the mega-cooler biz. I suspect that when we go to OC them the 14nm chips will get hotter still -- with a smaller surface area to draw heat from. What will heatsink designers have to do? Heck, what will water cooler designers need to do? Good thing AMD has given up chasing smaller processes.

I would imagine the very top end ones would have a pure silver core over the chip itself and be either a closed loop similar to 620 or H70 or in the closed loop in the form of tower - i.e., instead of vapor chambers n stuff your tower cooler would have few hundred ml of liquid going around inside - again - the very top end ones might even go for quicksilver (but I doubt tbh bcos of all the regulations involved with this thing and its very high thermal expansion).
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post #40 of 156
4/28/12 at 2:00am
Quote:
Originally Posted by Carniflex View Post

Well as far as I have seen the major expectation was that it will be about the same as SB but will OC higher bcos its a smaller process. So in this regard it is not what "everyone" expected.
Not a bad chip overall and I would not go as far as to call it flop ofc - at least it has marginally higher IPC - unlike the recent release from the other manufacturer wink.gif

Exactly. There was a lot of talk of easily reaching 5 GHZ on air, and 5.5 GHZ on water.
Quote:
Originally Posted by jtom320 View Post

I see 5.5 to 6 ghz easily on these new processors.
Quote:
Originally Posted by Boyboyd View Post

Yeah i'd say the same. Most SB can do 5GHz on air (albeit if a little hot). I'm going to stick my neck out and say that IB might be capable of more than 5.5GHz on water comfortably.
Quote:
Originally Posted by stubass View Post

Where i think it will really shine is Overclocking as someone mentioned 5GHz on air should be easliy acheivable, maybe slightly higher.. 5.5GHz + on a decent water loop which imo makes ivy bridge more atrractive smile.gif

Not gonna bother to find more examples.

Intel spoiled us with SB and those 5+ GHZ OC's, the problem is that those higher volts required leads to chip degradation.

I still remember when SB launched and telling people that I wouldn't be comfortable going above 1.35v or 1.4v max, 'cuz we didn't know what the long term effects would be.

And again, people should aim for the max overclock they can achieve @ or below 1.3v for 24/7 OC's.
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