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[PCEvaluation] Intel i7 3770K Temperature Measured Without IHS - Page 9

post #81 of 156
Quote:
Originally Posted by KuuFA View Post

lol that's what this test was about...
I don't know where you have been but there have been many threads saying IVY doesn't use solder to bind the IHS to the die. It uses TIM so there fore there were tons of speculation that the TIM was one of the reasons why IVY ran so hot but he debunked it so it wasn't useless.
As the pressure between the die and heat sink he disassembled the chip holder to make sure there was a proper bond you can look at the spread pattern on the die and the heat sink to see that it made good contact.

The guy pulled the IHS and the die apart but went back to using standard TIM and tried to use a standard heatsink to see if there's any difference... of course there won't be, because the pressure that was there between the IHS and the die was probably greater.

To really show the difference you'd need to solder the IHS to the die, or find someway to surround the die with just enough TIM and clamp it down to the heatsink with enough force but not to cause a crack.

I'm just saying that this "test" is very inconclusive. I too believe that using TIM instead of solder is to blame for a good portion of Ivy's heat.
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post #82 of 156
artic silver can be used to cold solder !and its 65 % silver isnt too shabby for a solution!not the best but alternative like composite polymer are probably not avail!
post #83 of 156
We already have replacements for silicon, such as graphene. Guarantee they've already thought about it, and re-thought about it . But then again, why introduce a new technology when you can squeeze the most out of the other for decades to come?
post #84 of 156
Quote:
Originally Posted by 8800GT View Post

We already have replacements for silicon, such as graphene. Guarantee they've already thought about it, and re-thought about it . But then again, why introduce a new technology when you can squeeze the most out of the other for decades to come?

Graphene cant have a on off switch state like silicon, its either on or off. It will be a long time before graphene can be used in processors. Not to mention it cost a fortune to produce.
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post #85 of 156
being ES doesnt change the result?
post #86 of 156
Quote:
Originally Posted by PontiacGTX View Post

being ES doesnt change the result?

Stepping 9 is the same as retail, so the exact same thing except for being marked ES.
    
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post #87 of 156
one thing is sure they need to find a way because some carbon base stuff have 1200w/m-k!making it ideal for cooling if they add the magnetic trick to make the heat go in the direction they want,hell we would improve cooling a lot!and this is where all manufaturer are focusing their effort now i suspect !the one to find a solution and to protect it in all possible way will make huge pile of money!
post #88 of 156
Quote:
Originally Posted by strap624 View Post

i7-3820/ lga 2011 hex cores guys. What do you expect from a mainstream CPU? After much success with 1366 everyone jumped on the mainstream platform. Wait for the next enthusiast socket.
What? headscratch.gif
Anyway, the 3930K/3960K produce a funny amount of heat when OCed. I would love to see the 6core IVYs.
My 64mm thick 360ish rad would be crushed by them.
When 3930K/3960K watercooling was recommended. For the IVYs? just move to Siberia or let you phase change unit have fun.
thumbsupsmiley.png
I really wanted the 6core IVY badly. Now I rather doubt that this is a good idea, esp. when raising the voltages a tiny bit.
sozo.gif and sad-smiley-002.gif
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post #89 of 156
mr eiht!you are right gen3 extreme serie is a freaking big ? now!with all the temperature concern of yet unreleased ib!we re all like!outch technology industry really need to to fix the cooling issue for oc,and not not by removing oc capability!
post #90 of 156
It's not the density(*2) or the IHS it is the self heating effect Bulk FinFETs suffer from.

It is also null because FinFETs have stronger and more durable structures than normal FETs(*1). The only thing you need to worry about is power consumption. Then again, no one really cares since overclocking always increases power consumption.

(*1) -> Higher temperatures supported and longer lifespan at out of stock ranges.
(*2) -> Density does have a factor though as the more Fins in one area can increase the heat that travels down to the insulator and buried oxide.
Edited by Seronx - 4/28/12 at 3:55pm
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