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[MT] Intel Admits That Ivy Bridge Runs Hotter Because Of 22nm Shrink - Page 5

post #41 of 183
Quote:
Originally Posted by axipher View Post

Would using a copper cold plate like on TEC's help with cooling the small die area that output the same amount of heat?
Obviously the heat-pipe based coolers are not going to be as efficient on Ivy since the outer heat pipes wouldn't really pick up much heat from the processor itself.

What do you think the IHS is?

Problem is that if you add more metal you increase thermal resistance quite a bit, but if you don't have enough metal, heat is only conducted efficiently to a few of the heat pipes.
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post #42 of 183
Quote:
Originally Posted by Blameless View Post

Quote:
Originally Posted by axipher View Post

Would using a copper cold plate like on TEC's help with cooling the small die area that output the same amount of heat?
Obviously the heat-pipe based coolers are not going to be as efficient on Ivy since the outer heat pipes wouldn't really pick up much heat from the processor itself.

What do you think the IHS is?

Problem is that if you add more metal you increase thermal resistance quite a bit, but if you don't have enough metal, heat is only conducted efficiently to a few of the heat pipes.

Well I would assume that the IHS has the same problem that TEC cold plates do, there is a optimal thickness (8 mm - 12 mm if I recall). Not enough metal and the heat doesn't spread out enough and is confined to a small space, too much metal, and as you said, too much thermal resistance.
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post #43 of 183
Quote:
Originally Posted by axipher View Post

Well I would assume that the IHS has the same problem that TEC cold plates do, there is a optimal thickness (8 mm - 12 mm if I recall). Not enough metal and the heat doesn't spread out enough and is confined to a small space, too much metal, and as you said, too much thermal resistance.
I wouldn't bet my life on it, but I'm fairly certain that this is incorrect. If you want to hardcore thermal stress test something, you put a 70 pound block of copper on top of it. Huge thermal conductivity and huge thermal mass.
post #44 of 183
If I ever get around to snagging an Ivy (probably won't as I have a a Gulftown and a Sandy already), I'll remove the IHS, lap the heatsink I'm using with it to the heatpipes (or grab the best HDT cooler I can find), and put a 4mm thick 99.99% silver plate between the die and the heatsink, with a liquid metal TIM on both interfaces.
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post #45 of 183
Quote:
Originally Posted by Blameless View Post

If I ever get around to snagging an Ivy (probably won't as I have a a Gulftown and a Sandy already), I'll remove the IHS, lap the heatsink I'm using with it to the heatpipes (or grab the best HDT cooler I can find), and put a 4mm thick 99.99% silver plate between the die and the heatsink, with a liquid metal TIM on both interfaces.
A silver shim wouldn't work. The IHS would be the speed limit in thermal conductivity.
post #46 of 183
Quote:
Originally Posted by dr/owned View Post

A silver shim wouldn't work. The IHS would be the speed limit in thermal conductivity.

Did you miss the part where I said, "I'll remove the IHS"?

There will be nothing but two layers of TIM and a lapped plate of pure silver between the die and the heatpipes.
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post #47 of 183
Quote:
Originally Posted by Blameless View Post

Quote:
Originally Posted by dr/owned View Post

A silver shim wouldn't work. The IHS would be the speed limit in thermal conductivity.

Did you miss the part where I said, "I'll remove the IHS"?

Woops eyes skipped over that bit. Speed reading fail.redface.gif
A quick google shows that silver is only 5% better thermal conductivity than copper though. Probably not worth the cost/difficulty to acquire.
Edited by dr/owned - 4/30/12 at 11:43am
post #48 of 183
Quote:
Originally Posted by dr/owned View Post

Woops eyes skipped over that bit. Speed reading fail.redface.gif
A quick google shows that silver is only 5% better thermal conductivity than copper though. Probably not worth the cost/difficulty to acquire.

I vote diamond.
post #49 of 183
Quote:
Originally Posted by dr/owned View Post

I wouldn't bet my life on it, but I'm fairly certain that this is incorrect. If you want to hardcore thermal stress test something, you put a 70 pound block of copper on top of it. Huge thermal conductivity and huge thermal mass.
No, he's right about the optimal thickness. A huge block of copper would be a terrible heatsink. Copper has a thermal resistance so it gets "harder" for the heat to dissipate the further it goes.

i.e. Place one end of an aluminum bat in a small fire. Touch the area on the other end of the bat, right away... is it hot? Nope... heat has to travel. Wait 5 mins and touch it again.... is it hot? Yes, but is it as hot as the other end? No.... because heat has to travel.
Edited by DuckieHo - 4/30/12 at 11:50am
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post #50 of 183
Quote:
Originally Posted by DuckieHo View Post

Quote:
Originally Posted by Bullly View Post

Quote:
Surprisingly, Intel has admitted that their latest Ivy Bridge platform runs hotter and its because of the increased thermal density which is the result of 22nm manufacturing node. Intel said, “users may observe higher operating temperatures when overclocking”. They further added, “This is as designed and meets quality and reliability expectations for parts operating under specified conditions.”
Means a new stepping will not fix this. We'll have to live with it.
Source: Maximum-Tech
A new stepping can fix it.

While smaller processes increase heat density...... as the process matures, Intel will probably be able to reduce leakage and therefore less waste heat.

A new stepping could fix it, but intel won't waste money on that unless it costs more than current stepping.

Most likely, Intel will release their "kick butt" Ivy Bridge next phase as Haswell. Just like Sandy Bridge was the "kick butt" phase of Nehalem.

What I'm saying is, if you got Sandy Bridge wait for Haswell at the very least. If you got anything before Sandy Bridge or ANYTHING from AMD, just go Ivy Bridge. It costs nearly the same, and will net you about 5-10% performance gain even when overclocking.
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