Well, so, it seems fairly certain that Intel has chosen to double the number of layers of TIM in your IB setup, which has a whole lot to do with why IB runs so dang hot, it would seem. Or so they seem to think over here. I think they're probably right.
And well, since they even suggested this in the article:
Quote:
Anyway, here's hoping someone comes up with a solid process for ripping that crap off the top of an IB CPU and creating a decent heat transfer. The new lapping.
And well, since they even suggested this in the article:
Quote:
I'd just love to see someone here do that very thing. I can't help noticing the almost comical mismatch between the size of my heatsink (H100) and the size of the heat producing die. It's an inefficiency on a scale only possible in the world of personal computers where inefficiency is a necessary evil in order to produce products that are more universally interchangeable. (The H100 can fit a 775, 1155, 1156, or 2011 socket processor, for instance.)
Anyway, here's hoping someone comes up with a solid process for ripping that crap off the top of an IB CPU and creating a decent heat transfer. The new lapping.