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Did people put unrealistic expectations on Ivy Bridge? - Page 5

post #41 of 61
Quote:
Originally Posted by jtom320 View Post

Right but I don't think that is what the thread was addressing. Whether it's right or not baseless speculation happens all the time especially on a forum. Now personally I wasn't expecting a huge increase on OCing ability but I thought perhaps 5ghz would become more commonplace and really good chips might go even further. I don't think this was a ridiculous prediction going off Intel's last four releases.
As I said though in my first post seeing as Ivy is still the fasted x86 quad money can buy I wouldn't say I was dissapointed per say but the heat issues did make me decide to just stick with my current chip rather then upgrading. My gpus are plenty fast without 3.0 and a 5% CPU increase is not high on my list of priorities.

I agree with most everything you've said here.

I'm just saying that there is little excuse for people to have been surprised by the time launch date came around, and that a few generations of prior trend doesn't automatically mean the next generation is going to follow.
post #42 of 61
Quote:
Originally Posted by punceh View Post

Quote:
Originally Posted by samwiches View Post

Newbs, please stop crapping on IB. They run @ 4500 w/ 1.25v. That's like 4800 on the SB's, with less power and HD4000 IGP. It's a bonus.
they run 4800@1.25 if you got a good one wink.gif

Yeah already read your thread. rolleyes.gif

You should post in the Ivy suicide/stable thread so we can keep track of all the good chips so far.

Mine.. needs Sandy type voltage, it's garbage. I want to try and exchange for another one.
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post #43 of 61
Ummm, heat cant be a problem with IB. If heat were a problem, Intel would have improved on the package or the IHS. Instead, they made it worse with TIM. Ergo, heat is a feature of the IB. rolleyes.gif
post #44 of 61
You are a little behind. IHS testing was recently done and the removal gave zero improvement in temp.
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post #45 of 61
Quote:
Originally Posted by Blameless View Post

I agree with most everything you've said here.
I'm just saying that there is little excuse for people to have been surprised by the time launch date came around, and that a few generations of prior trend doesn't automatically mean the next generation is going to follow.

Well that's actually a really good point.
    
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post #46 of 61
Quote:
Originally Posted by samwiches View Post

You are a little behind. IHS testing was recently done and the removal gave zero improvement in temp.
LOL, so you believe that the experiment you are talking about proves that TIM is better or equal to fluxless solder in the ability to conduct heat?
Edited by youghmama - 5/1/12 at 7:21pm
post #47 of 61
Quote:
Originally Posted by youghmama View Post

LOL, so you believe that the experiment you are talking about proves that TIM is better or equal to fluxless solder in the ability to conduct heat?

The problem can be the leakiness and heat produced by 3D transistors. It is going to be tougher and tougher to pack so many transistors in such a small area considering we are still using silicon. Engineers and scientists are reaching the material limitations of silicon.
Edited by Riou - 5/1/12 at 7:22pm
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post #48 of 61
Quote:
Originally Posted by Riou View Post

The problem can be the leakiness and heat produced by 3D transistors.
How does that explain the use of TIM over fluxless solder? Does fluxless solder have an negative effect on leaky 3D transistors?
post #49 of 61
post #50 of 61
I already said that IHS removal has already been done, and gave no improvement:

http://www.eteknix.com/news/ivy-bridge-heat-problems-remain-even-after-ihs-removal/

Also, don't double post if you can help it.
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