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Why do 95% of people spread the TIM? - Page 4

post #31 of 140
@ deafboy & bruflot
You guys just spun the rotor on my roflcopter. laughingsmiley.gif
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post #32 of 140
just check the under of a intel cooler,it is 3 strip about 1/16 of an inch thick
post #33 of 140
credit card here = nice temps, but a little paste wasted on the sides of cpu,
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post #34 of 140
who cares about waste lol!it is the tickness that is improtant it .the tim is there only to make sure everything touches(no air pocket)if metal touch ?no biggy!if it doent then tim is for that 200um isnt very thick contrary to popular belief
post #35 of 140
I've seen a few people post saying that spreading the TIM is the worst possible method, but how can you say that when I idle at 21C on both CPU and GPU? I've done plenty of reseats and have had an i7 960 under the same exact loop and my GPU temps/CPU temps are always low. Even for my i7 it would idle around the lower mid 30s. It works for me, I get the paste to where I want it, how thick I want it, I get great temps, and most of all its a mental assurance that everything's getting covered.
     
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post #36 of 140
ok, so the paste does not need to spread to cover the area of the cpu/heatsink? I thought the purpose of the TIM was to make sure there wasn't air bubbles to make the heatsink contact the most efficient. if it does not cover the entire area of contact, then it is not getting rid of the air between them, and to me it seems that would make it less efficient. maybe someone can help me understand this better?
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post #37 of 140
There is no best method when it comes down to it.. however it's widely accepted to use a rice sized drop on the center of the chip, to spread it thinly and evenly across the chip, and to use a [X] pattern or even two lines like so: [||] (the brackets are the chip)

So long as you have the cooler installed right and you've used TIM between the two - you should have fairly similar results across all four application methods. Don't worry about it unless you see high temps.
post #38 of 140
It depends for me some pastes i like to just just a dot in center others seem to get better by spreading also depends on the cpu and heatsink or block. Like i seem to have better temps on as5 if i do a very small thin spread then a small dot in the center also i get the best temps doing it that way but each person will find their own tricks work best for them.
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post #39 of 140
Whenever I get a new processor and heatsink I always test them out to see what works best... eh, whatever works.

example:

http://www.overclock.net/t/566068/silent-night-lian-li-v1100bplus-ii-56k-warning/0_100#post_7054712
 
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post #40 of 140
I read a year ago about a review of the different methods. They found using the pea method was roughly 2 degrees cooler than the spread method if I remember correctly.
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