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Why do 95% of people spread the TIM? - Page 6

post #51 of 140
im lazy so i just put a dot and squash it thumb.gif
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Yep, Aeris died
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post #52 of 140
post #53 of 140
Quote:
Originally Posted by Schnitter View Post

http://www.arcticsilver.com/intel_application_method.html#
I just follow what arctic silver suggests.


Ditto I use AS5 and the horizontal/vertical line (whichever cpu i'm applying the paste to)
post #54 of 140
It's all a tradeoff. IMO, the amount is more significant than the type of application.

Spreading
+CPU case is covered
-Air bubbles
Case is covered yet hot spots

Dot
+No air bubbles
-CPU case is not covered
No air bubbles yet less points of contact

Line/X
+CPU case is almost covered
-Thermal insulating caused by too much TP
Case is almost covered yet thermal insulating

I spread it personally, thinly. I'd rather know that the CPU case is covered than not knowing how much the dot spread just out of mentality.
Edited by pengs - 5/8/12 at 3:43pm
post #55 of 140
I used to spread it with a bank card, now I just use the rice grain method. I haven't seen any difference in temperatures. As long as you aren't using too much, it doesn't really matter (except for huge dies).
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post #56 of 140
I never spread it. I use the #5 DICE method. A adequate dot in the middle and 4 small dabs in each of the corners.
 
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post #57 of 140
The biggest issue I see with people adopting one method over another is people not thinking and not realizing that one method cannot cover all circumstances.

Someone tells a fool that the dot-in the center method is best (and it generally is for flat based heatsinks used on chips with IHSes) and the fool uses this method even with HDT coolers (leading to higher temperatures), or worse on GPUs or CPUs with bare dies (which often results in disaster as the die is not an IHS and if it's not completely covered parts of the chip are totally uncooled.

Best method is always dependent on situation.
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post #58 of 140
Quote:
Originally Posted by pengs View Post

It's all a tradeoff. IMO, the amount is more significant than the type of application.
Spreading
+CPU case is covered
-Air bubbles
Dot
+No air bubbles
-CPU case is not covered
Line/X
+CPU case is almost covered
-Thermal insulating caused by too much TP
I spread it personally, thinly. I'd rather know that the CPU case is covered than not knowing how much the dot spread just out of mentality.

The entire point of using TIM in the first place is to fill in the microscopic groves and inconsistencies in the surface (which are filled with air). The reason for this is that air is a terrible conductor of heat (0.024 W/(mK)). In a perfect scenario where both surfaces are lapped (or leveled/smoothed) so that both surfaces are completely flat, then there would be no inconsistencies that need to be filled in, so IHS to Heatsink contact would be BETTER than also using TIM. The reason for this is TIM is actually a very poor heat conductor BUT it's better than air (TIM is ~5.6 W/(mK), or 233 times better than air) whereas the IHS and heatsink are most likely aluminum (250 W/(mK), or 45 times better than TIM, 10400 times better than air) and copper (401 W/(mK), or 72 times better than TIM, or 16700 times better than air). Now, it's impossible to ever have a perfectly smooth surface (especially if lapped by hand) so you will always need to use TIM to fill in the small inconsistencies (air pockets). But that's the ONLY purpose of TIM: to fill in the microscopic air-pockets in the two surfaces to increase thermal conductivity. Having anymore TIM than that is counter-productive and will actually reduce overall thermal conductance.

Now with all that being said, it's easy to see why the by-hand spread method is so terrible. It might fill in the air-pockets in the surface material but it creates it's own air bubbles which are many times larger than the ones in the surface. These larger air-bubbles can cause hotspots, and if one of these hotspots is right under a core, it can be extremely bad. The only way the 'spread' method is better than a dot/line is when it's done mechanically so there's no air-bubbles introduced. That's why a very small amount, devoid of all air-bubbles, right under the major heat-source (the cores) is the best by-hand method; and the only way to accomplish that is with a dot/line right under the cores.
Edited by SeanPoe - 5/8/12 at 4:25pm
post #59 of 140
For standard flat coolers its really just preference, other than overdoing, because thats just counterproductive. Heat pipe/vacuum sealed coolers like the dark knight, there is some method to the madness, such as filling in the gaps and X-patterns/dotted is proven to improve cooling temps.

Technically though, if you are touching the TIM via a card to spread or your finger, you are introducing foreign substances such as dirt/oils that could contaminate the otherwise "pure" TIM. Also, using a single dot method ensures a seal that is devoid of introduced micro-air bubbles and conforming the "seal" of either interface.
Edited by Blindrage606 - 5/8/12 at 4:31pm
 
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post #60 of 140
Quote:
Originally Posted by kikkO View Post

I never spread it. I use the #5 DICE method. A adequate dot in the middle and 4 small dabs in each of the corners.
I used to do the rice grain, but I started doing this as well, since I didn't like how the rice grain would need reapplication for some mounts.
    
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