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Why do 95% of people spread the TIM? - Page 7

post #61 of 140
5/8/12 at 4:33pm
Quote:
Originally Posted by drbaltazar View Post

they should apply it intel way; but most try to better the technique.beats me if one way is better then the other!but i suspect intel tested a lot prior to adopt this way
Good job, that is a post of yours that is readable. thumb.gif
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post #62 of 140
5/8/12 at 4:48pm
Just want to point out one more thing:

The reason why all of these methods work, and the reason the community as a whole hasn't really decided on which method is best, is because at such low temperatures and over such a small surface, it really doesn't even matter. Even if you used no TIM compared to the best TIM on the market, the temperature difference would only be 4-6C on average. So when you compare any method using the same TIM, the difference is going to be +/- 1C at best (which is negligible for this type of non-critical application). And with that being said, it's pretty obvious that the best method for a non-HDT heatsink is the one that's the most efficient in terms of both time and resources. This is always going to be either a dot/pea or line method.
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post #63 of 140
5/8/12 at 4:49pm
  • Ganf
  • Overclocker in Training
Look, all I know is that on my last TIM application I completely screwed it up. I kept my tower standing and squirted a bunch of runny TIM all over the place, it dripped on my GPU even, I stuck my water block on, realized I had it turned wrong, took it off, put it back on, took it off again because my screws were being a pain, put it back on, overtightened one corner, and then finally got it set straight and tightened squarely. I was intending to take it back off after doing something because I had screwed up so badly.

I forgot, I started it up later, went to overclocking, my temperatures are bang on. But I'll never intentionally screw up that badly again. biggrin.gif
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post #64 of 140
5/8/12 at 4:55pm
i make a line and have the headspreader...spread it.
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post #65 of 140
5/8/12 at 5:00pm
I use pea method...

However, the last time I applied it...I accidentally put pressure on it with my HSF without knowing...so when I lifted it back up..it had already spread a little...I than put it back down and applied full pressure to lock up the HSF...

Do you guys think that is a problem? to put pressure once, release and than put pressure again...instead of doing it in 1 swoop ? know what I mean?
Edited by malikq86 - 5/8/12 at 5:13pm
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post #66 of 140
5/8/12 at 5:06pm
Quote:
Originally Posted by malikq86 View Post

I
Do you guys think that is a problem? to put pressure once, release and than put pressure again...instead of doing it in 1 swoop ? know what I mean?

It's worse than if you had just done it "in one swoop" but the difference is going to be negligible. Worst case scenario, maybe a 1-2C increase. But most likely, it will be less than 0.5C difference.
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post #67 of 140
5/8/12 at 5:06pm
Quote:
Originally Posted by malikq86 View Post

I use pea method...
However, the last time I applied it...I confidently put pressure on it with my HSF without knowing...so when I lifted it back up..it had already spread a little...I than put it back down and applied full pressure to lock up the HSF...
Do you guys think that is a problem? to put pressure once, release and than put pressure again...instead of doing it in 1 swoop ? know what I mean?
Just means a bigger chance for air bubbles, but if your temps are what you expected, it's probably a non-issue.
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post #68 of 140
5/8/12 at 5:11pm
I used to spread TIM when I was a kid and before I had all these Internet resources. I think it feels natural to most people, since you know that it should cover the CPU heat spreader most people just naturally want to spread it out. The performance is still reasonable. Not to mention some installation guides for some coolers used to recommend spreading the TIM!

But now with the Internet we all know dot/pea (different terms, same concept) method is best. Except for direct touch heat-pipe, which in my experience is actually best with two small lines towards the center of the CPU running parallel to the heat-pipes.
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post #69 of 140
5/8/12 at 5:16pm
Because fingerpainting is fun?
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post #70 of 140
5/8/12 at 5:21pm
Quote:
Originally Posted by BinaryDemon View Post

Because fingerpainting is fun?

I like to smear a glob of TIM on my forehead then proceed to faceroll my CPU and heatsink to apply the TIM. HEY MAN, DON'T JUDGE ME!
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