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Why do 95% of people spread the TIM? - Page 8

post #71 of 140
Quote:
Originally Posted by Blameless View Post

The biggest issue I see with people adopting one method over another is people not thinking and not realizing that one method cannot cover all circumstances.
Someone tells a fool that the dot-in the center method is best (and it generally is for flat based heatsinks used on chips with IHSes) and the fool uses this method even with HDT coolers (leading to higher temperatures), or worse on GPUs or CPUs with bare dies (which often results in disaster as the die is not an IHS and if it's not completely covered parts of the chip are totally uncooled.
Best method is always dependent on situation.

For the most part the dot method fits every situation. The only time you should really need to spread compound is if your using some type of ceramic or another.
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post #72 of 140
Quote:
Originally Posted by SeanPoe View Post

I like to smear a glob of TIM on my forehead then proceed to faceroll my CPU and heatsink to apply the TIM. HEY MAN, DON'T JUDGE ME!

Sweet I should try this. Have any how to videos?
     
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post #73 of 140
from prolimatech.com:
Quote:
I would like to know which methods you recommend applying the pk -1 to CPU.
Please spread out evenly a layer of PK-1 onto the whole CPU and to the whole heatsink base bottom.
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post #74 of 140
Quote:
Originally Posted by EvgeniX View Post

from prolimatech.com:
Quote:
I would like to know which methods you recommend applying the pk -1 to CPU.
Please spread out evenly a layer of PK-1 onto the whole CPU and to the whole heatsink base bottom.

Every manufacture will suggest a different method. It doesn't really mean it's the best method though. In fact, from a business stand-point, it makes sense for a company to suggest the spread method because it uses 2-3 times as much TIM. More TIM used = More TIM bought = More revenue for the company. Simple. The reason there's nothing wrong with this advice is it doesn't actually impact performance on a noticeable level, we're talking +/- 0.5C temperature increase.

But the common trend among the most reputable companies is to use a thin vertical or horizontal line across the cores on the IHS. There's nothing shady about this advice because it actually uses the least amount of TIM and it's actually the most effective method.
post #75 of 140
Quote:
Originally Posted by SeanPoe View Post

I like to smear a glob of TIM on my forehead then proceed to faceroll my CPU and heatsink to apply the TIM. HEY MAN, DON'T JUDGE ME!

HAHAHAHAHAHAHAHAHAHAHa
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post #76 of 140
so intel method (3 strip)is actually the best method!dam did you see the amount of air when it is spread !and air is the worst conductor!no wonder so many have high temperature!
post #77 of 140
Ive always done the spread method with a credit card and always have comparable temps to other similar setups as mine. I think the reason did the spread method is that the TIM is spread nice and evenly on the bottom of the AMD stock heat sinks. I guess I figured an actual CPU manufacturer would know best.

But honestly I think theyre all about the same. With all the forums and the countless overclockers out there, you think somebody wouldve discovered by now if one method was really better than the other. So Ill just stick with my trusty Blockbusters Video membership card.
post #78 of 140
any tested to see if replacing tim with tin would be a great idea(not in the processor lol) (231 c melting point means you drop a drop on the ihs and fasten your cooler?)
post #79 of 140
i bet on average most are better off not putting anything
post #80 of 140
Quote:
Originally Posted by drbaltazar View Post

any tested to see if replacing tim with tin would be a great idea(not in the processor lol) (231 c melting point means you drop a drop on the ihs and fasten your cooler?)

It would harden the second it hit the IHS if you didn't also heat up the IHS and HSF first. I'm not sure what temperature you would need to preheat the IHS and HSF to in-order to get a good seal, but it'd probably be so hot that it would destroy the chip. So you'd have to remove the IHS from the cpu then attach the heatsink then reattach the IHS to the CPU once it cooled down. tongue.gif
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