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[VR-Zone] Ivy Bridge proven to suffer from poor thermal grease - Page 2

post #11 of 39
If this turns to be true, it'll be really interesting. It opens the possibility of a revision with soldered IHS improving thermal performance.
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post #12 of 39
yeah i thought too that some of the users here on ocn proved that it wasnt the TIM. soo confused. either way, if it's actually the TIM, this is seriously gonna make me rethink buying intel if they are just gonna use crap materials. i have no problem with companies trying to make a profit, but you gotta do it right.


i really was considering upgrading to 3770k for hyperthreading and pci 3.0...not so much now, at least not until there is some sort of revision.

no revision, no money for intel.
Edited by EM2J - 5/11/12 at 6:16am
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post #13 of 39
Quote:
Originally Posted by SkillzKillz View Post

1.55v on 22nm? haha. that's nowhere near safe. most people wouldn't go that high on 65nm.

It's possible finFETs have the durability.
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post #14 of 39
damn.. makes me want to hold off on Ivy bridge now hearign bout this
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post #15 of 39
I know Intel selects TIM for properties other than pure thermal performance (durability and longevity being major factors), but I still find these results hard to believe.

Not completely ruling out the potential of these results being accurate. I've always had issue with the other lidless tests (not using a lapped heatsink and not compensating for lost mounting pressure).
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post #16 of 39
hmm if true.. this is shocking!! that a company which made record breaking profits is abandoning its users on such a simple and scamming level...
post #17 of 39
Quote:
Originally Posted by Demondrumer View Post

hmm if true.. this is shocking!! that a company which made record breaking profits is abandoning its users on such a simple and scamming level...

I don't think you know what a scam is. This is not a scam. This is Intel cutting costs because they can... the people that use the product at its intended settings are not hurt at all by this.
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post #18 of 39
Quote:
Originally Posted by Blameless View Post

I know Intel selects TIM for properties other than pure thermal performance (durability and longevity being major factors), but I still find these results hard to believe.
Not completely ruling out the potential of these results being accurate. I've always had issue with the other lidless tests (not using a lapped heatsink and not compensating for lost mounting pressure).
I'm on the same boat, find them hard to believe but not impossible.
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post #19 of 39
If it turns out to be true (i.e another source proving similar results) I would bin some 3770k's and delid the best one.

"the pursuit of performance"

..Unless I find my golden 2600k and not bother =P
    
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post #20 of 39
Quote:
Originally Posted by Homeles View Post

I don't think you know what a scam is. This is not a scam. This is Intel cutting costs because they can... the people that use the product at its intended settings are not hurt at all by this.

Exactly. Did they put this new product out there for the mass public or for the select ocers? They put it out for the mass public. And at stock it has already proven to run cooler and with less power clock for clock. So their business mission of making a smaller die, faster running, greener chip was accomplished. They satisfied our market with SB (overclockers) now they are trying to tap into another market with IB (eco-friendly pc users). Because you can't oc like on SB, it does not mean that they failed with what they set out to do.

I'm not saying that they released this just for the eco-friendly minded people. But by being able to say that it consumes less energy while maintaining the same speeds, they grew their customer base to reach a portion of users that they may not have been interested before.
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