Cyclops said he was going to run stock tests first before he removes the TIM. But ditto on waiting until he has all the results in to post them.
So Cyclops, are you going to just change the TIM and put the IHS and lid back? Or are you going to mount a heat sink directly to the chip? If you use the direct mount, you do have to worry about cracking the chip if you use too much force because I believe the heat sink mounting points are not evenly spaced from the corners of the bare chip.
Of course this depends on your clamping system. You either have to use a mount with separate internal tightening points (designed to put an even pressure over the chip and not too much on the corners) or shims on each side of the chip to "square up" the chip. Of course the shims would have to be the same density and height as the chip.
I havent looked at the actual Japanese test yet to see what their setup looks like. I will do that now.