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[Video Added + Watercooling Results] Replacing the internal IHS TIM of an i7 3770K - Page 10

post #91 of 298
Very nice! Looked at your pics in the op and with the modded OC pic vs stock is see a 2c drop on the coolest idle core over the stock pic 23c vs 25c. I know it's hard to control ambient, but having 3c diff in ambient can show 5c diff at loads. Would be nice to see some testing in a controlled room as in a air conditioned office or something. Good effort tho, I'm impressed either way thumb.gif I know dropping my temps in my house from 71f to 69f will shave a few degrees redface.gif

+REP thumb.gif
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post #92 of 298
I'll probably do the same, i got some MX-4 left, is the difference that big compared to the Liquid Pro ?.
post #93 of 298
Quote:
Originally Posted by un-nefer View Post

Skip the mx-4, and use some Coollaboratory Liquid Pro instead on both sides of IHS for ultimate results.
Like others said, don't forget a bunch of before and after tests smile.gif
Quote:
Originally Posted by PontiacGTX View Post

I wouldnt use Coollaboratory liquid pro bcuz it doesnt make a BIG difference between all TIMs
405

You make no sense at all to me - are you high?

In your own reply to me you show results that show Coollaboratory Liquid Pro, the TIM I suggested, is 3C cooler at worst and 8C cooler at best - yet you say you wouldn;t use it because it doesn't make a big difference...


And just so you know, someone actually did give Coollaboratory Liquid Pro a go to replace the stock TIM that Intel used, and guess what - it lowered CPU temps by 11C at stock speeds and lowered the CPU temps by a whopping 20C when overclocked to 4.6Ghz.

465

Next time before you try and shoot down my suggestion, take a few moments to do some basic googling to see if what I have posted is actually a good suggestion or not.
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post #94 of 298
So, after i remove the IHS and replace the cheap TIM with Liquid Pro. Do i need to use some kind of glue to stick back the IHS or the retention method of the socket will keep it in place ?.
post #95 of 298
Quote:
Originally Posted by finalturismo View Post

no way solder will get you 10c better, no way in heck.
22nm ivy bridge with trigate is high leakage , thats it.
Sorry people no way around it, have you people even seen the temperature graphs?
Ivy bridge temp is even cooler in some cases stock vs stock against sandy bridge.
As soon as you raise the voltage, temps go insane.
THAT IS NOT THE IHS OR TIM
That is called High Leakage
Electricity starts to move in areas it should not move into, causing insane temps.
Usually it takes alot more voltage for Leakage to start
But on ivy bridge it happens much sooner.

I have to agree and say the early reports before it was released of fab problems sounds accurate. TIM alone, 20% die reduction alone or even those two together are not sufficient to explain the massive heat jumps while overclocking. While reading all the info over the past year and a half for using tri-gates and even intel's reasons they gave in press releases for the switch is tri-gate is supposed to reduce power consumption while performing the same or better than planar. You have to keep in mind tri-gate uses more current (measured in amps) than planar transistors. For example (and these numbers are purely arbitrary just to plug into the equations as an example), Let's say we have CPU A that uses planar and requires 1.5 V (volts) and draws 50 A (amps) for a total power consumption of 75 W (watts). W = A * V, 1.5 * 50 = 75, W=75. Now we take CPU B that uses trigate and because of that the CPU will draw 70 amps of current. For CPU B to use consume less power (and therefore produce less heat) than CPU A with a higher current, then the voltage must be lower. We can plug the numbers into the equation to see what voltage level is required to match power consumption of CPU A like this:
V = W / A
V = 75 / 70
V = 1.07 volts

As you can see to even be the same as CPU a it requires .43 V lower after even just a 20 amps bump in current draw. The theoretical advantage of trigate over planar is that it's supposed to be more effecient by requiring far lower voltages than planar does so even with increased current draw its supposed to consume less power (and by proxy produce less heat). If we compare the voltages that this revision of IB is using vs SB, to me I just don't see a very significant voltage drop except at stock speeds. I'd love for someone to post confirmed voltages for IB at 4.2 and higher compared with SB voltages to see the difference. I really think that they're having problems getting it to operate at the lower voltage spec that they've designed for which if I'm right that's good news for IB buyers in the future because a newer revision after they've worked out the fabrication problems will mean lower temps and faster processors and higher OC headroom. I don't have a clue why they would go from soldered IHS to TIM. There are only two reasons I can think of for that. A)Someone screwed up and cut corners and in doing so is excaserbating the existing heat problems or B)Intel knows that this revision of chips just isn't going to operate as designed and overclock well so they went the cheap TIM route to cut costs and time while they work out the fab problems (I'm thinking impurity problems). Either way it doesn't really make any sense at all.
post #96 of 298
Quote:
Originally Posted by leoxtxt View Post

So, after i remove the IHS and replace the cheap TIM with Liquid Pro. Do i need to use some kind of glue to stick back the IHS or the retention method of the socket will keep it in place ?.

retention plate/heatsink will hold it biggrin.gif
 
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post #97 of 298
Quote:
Originally Posted by finalturismo View Post

no way solder will get you 10c better, no way in heck.
22nm ivy bridge with trigate is high leakage , thats it.
Sorry people no way around it, have you people even seen the temperature graphs?
Ivy bridge temp is even cooler in some cases stock vs stock against sandy bridge.
As soon as you raise the voltage, temps go insane.
THAT IS NOT THE IHS OR TIM
That is called High Leakage
Electricity starts to move in areas it should not move into, causing insane temps.
Usually it takes alot more voltage for Leakage to start
But on ivy bridge it happens much sooner.
proof.gif

This is false. They don't have high leakage, the transistors are just very densely packed. As they go smaller it will continue to be more difficult to remove the heat, so even though they produce less heat than the previous generation, they will potentially have higher temperatures.

Here is a quote from INTEL.
Quote:
Intel's 3-D Tri-Gate transistors enable chips to operate at lower voltage with lower leakage

source

Here is a quote from the hardwarecanucks review.
Quote:
It’s pretty clear to us that Intel is using very low leakage transistors with IVB, and when you combine extremely high transistor density with a die that has half the surface area of Sandy Bridge, the temperature situation gets out of control quickly when overvolting.

source


With that said, having a better TIM like Liquid Pro should help decrease temperatures quite a bit because of the better heat transfer, which IB is having a hard time with at the moment because the transistors are so densely packed and there isn't a whole lot of surface area for the heat dissipation as there was with SB.
Edited by icehotshot - 5/13/12 at 10:19am
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post #100 of 298

I trust a fellow OCN'er over a foreign website results tongue.gif
Quote:
Originally Posted by samwiches View Post

-Rep.

^This lachen.gif: I think samwiches gets one tongue.gif
Edited by Schmuckley - 5/13/12 at 10:31am
 
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