Originally Posted by gdesmo
Did not quite understand the question about TIM and water, if you could expand on your idea it might help me grasp what you are trying to attain. Cheers
Here is a simple way to explain it.
Imagine a normal wayer block directly on the die with water flowing in and out of the block as usual.
But on top of that, I would like water flowing on the PCB and around the edges of the die. This would hopefully pick up some residual heat from the CPU's PCB and from the die too. It won't make a huge difference, maybe a couple of degrees like your silver plated block.
But the main problem I have is direct contact of the TIM with the water as the block/die contact area will be imnersed in water. I fear my idea would not work for long if I can't figure out a way to find a TIM that will not errode and/or dissolve in the water.