
Product Features
The TPC 812 uses 2 separate cooling technologies to transfer heat - heatpipes and vertical vapor chambers
Ready for overclocking, benchmarking and silent cooling
The first ever CPU heatsink to use vertical vapor chamber technology
100% pure polished copper base - combined with improved soldering technologies for the best thermal transfer
Special fin design - heatsink receives concentrated cold airflow
Compatible CPU Sockets - Intel: LGA 2011/1366/1156/1155/775 and AMD: FM1/AM3+/AM3/AM2+/AM2
Improved air pressure design and fan mounting system
http://www.amazon.com/Cooler-Master-Heatsink-Technology-RR-T812-24PK-R1/dp/B007WPHXIS/ref=sr_1_1?s=electronics&ie=UTF8&qid=1337545957&sr=1-1
with 2nd blade master could perform very good











