Quote:
Originally Posted by Malo 
Due to its 22nm size it also heats up alot when you OC.... SB is far better IMO if your considering intel, not to mention the whole non-soldered crappy TIM they used for the heat spreader....
Due to its 22nm size it also heats up alot when you OC.... SB is far better IMO if your considering intel, not to mention the whole non-soldered crappy TIM they used for the heat spreader....
It's not the die size or the TIM (although they do increase the temps just don't account for most of the increase which should actually have been a decrease compared to SB).
Remember, Intel cited "problems with the 22nm fabrication process" when they announced the delays for IB. All reports were that it would come out Q3 after that (including from friends who work up in Beaverton, not in the 22nm fab but it's hard to keep info from floating around inside the company) and then all of a sudden it gets released. Then the vast majority of retail chips (75+%) are at voltages just under or the same as SB using a design that has a higher drive current and is supposed to be at a much lower voltage. These same chips with those voltage levels have high temperatures (yet the chips with much lower voltages have either similar or lower temperatures than the equivalent SB at the same clock). It doesn't take a rocket scientist to see what's going on and yet I and a few others seem to be flamed when mentioning it. But anyways, IMHO I think it's better to sit out and wait this IB round especially when comparing the cost to SB now that it's dropping.
Oh and another note, in Ireland they were supposed to switch one of the fabs straight from 90 to 22nm this year which would have resulted in new jobs etc. Now all of a sudden Intel has put those plans on hold.
Bubba's Bulldozer
(18 items) |
|
Bubba's Bulldozer
(18 items) |
