Of course. Im not upgrading until the 22 nm days (about 5 years ahead according to Intels roadmap). It'll save me a lot of money in the long run. Just let the companies have at it for a bit, no need to be cutting edge when you don't need to be.
On a side note, I just had a thought... Since AMD is leveraging cHT to get 4x4 to work, why can't they just do what Intel is doing by putting two dies in the same packaging, execpt joining the two dies with cHT links? Wouldn't that solve the problems with the inter core communications? The individual dual-cores will be able to communicate much faster than the fsb approach. I'm guessing there would be a bit more latency than native quad-core, but would be way faster than using the fsb. Also, this would greatly increase the yields as they can join any two dual-core dies. They could probably even make dual-cores this way by joining two single core dies. Could label them as Sempron X2 since it's not native dual-core.
Does this sound too farfetched? I wonder why AMD hasn't gone this route. I'm sure they have weighed this option before as they are not stupid but I'm curious why this doesn't work.