Personally I use only Dragonskin. I have used eraser and LET but find Dragonskin so easy it appeals to my inner lazy self. Not only that it peels off without any residue and haven't ruined anything in removal of it yet (pulling off components/resistors/caps, etc). I have found that some sockets (FM1/AM2/AM3, etc) and the PCIe/RAM slots can be tough to get it all from underneath, so I eraser or LET the very edge of the socket/slot (the edge between the board and slot/socket) just to keep the Dragonskin from flowing under the socket. Of course only if I fear that I might have RMA the board or something, if its an older board I just pour away. It sets up in half hour or so and your are good to go. For added insurance I usually eraser or cut a foam/neoprene gasket for around the chip, filling the pockets where air or moisture could reside.
Now again my LN2 experience is somewhat limited but I've never had trouble under DICE or phase and it can stay on for air cooling. It all peels off in under a minute and there is no trace at all of it being there.
Now again my LN2 experience is somewhat limited but I've never had trouble under DICE or phase and it can stay on for air cooling. It all peels off in under a minute and there is no trace at all of it being there.













Unless the op is just looking at DICE for the time being.





