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my first gpu prep ... Getting ready to bench - Page 3

post #21 of 126
7/9/12 at 1:25am
That looks awesome and very neat biggrin.gif

Yea, if you bench something totally different, you'll have to remove some tape, but the mount spacing of the 8800GT is the most common spacing by MILES

Lookin forward to seeing pics of the mounting smile.gif

Here's a tip.... when you attach the pot to the card, do so until you think it's right, then remove it to check the contact. You should IDEALLY have a perfect square of thermal paste on the pot that matches the GPU core. Then, remount, attach it to the mobo etc, then boot to windows and watch the temps in Rivatuner or nVInspector. For every degree rise in software, you should have + 1 degree on your thermometer. There could be anything from 5 to 20 degrees difference between the two, but they should rise at an equal rate. Let the core get to +50 or so, then power down and let it cool (that will save you a bit of LN2)

It could take 5-10 minutes. You're using a good pot smile.gif
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post #22 of 126
7/9/12 at 3:01pm
Thread Starter 
so ive moved on to trying to prep the board, but ive run into a logistical problem...
the thing is, I wamma bench this board now, but want to sell it in the next few weeks. As such, I decided I would just use grease and towels. I thought I could remove the heatsinks and just spread grease all over. The cold from the pot would be enough to cool the VRMs/PWMs, but im not sure if i should run the northbridge w/o a sink on it. But since the NB and VRMs are all cooled by one large heatsink, its either heatsink on all or heatsink on nothing. All i have are a few small ramsinks.. i could fit two of them on the NB core if it would help and then maybe put a fan on them..

448

i dunno.. im just really trying to avoid LET for the motherboard if possible. thoughts?
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post #23 of 126
7/9/12 at 3:06pm
Use LET, especially if you're gonna run -190. Some guys swear that grease doesn't like extreme cold. I've never used grease for more than PCI-E slots and CF/SLI fingers.

Keep the heatsinks on. As long as there's insulation, it won't matter if you get some condensation in there.

I always defrost my gear in a warm oven- half an hour at +50 and things are fine. Can always take it out to cool for 20 minutes, then put it back in.

It's never let me down
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post #24 of 126
7/9/12 at 3:19pm
Thread Starter 
Quote:
Originally Posted by K404 View Post

Use LET, especially if you're gonna run -190. Some guys swear that grease doesn't like extreme cold. I've never used grease for more than PCI-E slots and CF/SLI fingers.
Keep the heatsinks on. As long as there's insulation, it won't matter if you get some condensation in there.
I always defrost my gear in a warm oven- half an hour at +50 and things are fine. Can always take it out to cool for 20 minutes, then put it back in.
It's never let me down

i dunno, last time i used LET it got underneath the chokes, dimm/pcie slots and i couldn't get it all out. I suppose if i use eraser around the edges of all those things then apply the LET it should be fine, but i was really hoping to avoid LET altogether this time (for the motherboard at least)
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post #25 of 126
7/9/12 at 3:25pm
Yea, removing it can be tricky. For awkward leftover bits, I apply some more over the top, let it dry, then peel it off smile.gif The more layers you add, the easier it is to peel. It sticks to putty like crazy, so putting some of that around chokes should make removal easy for sure
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post #26 of 126
7/9/12 at 3:28pm
Thread Starter 
yeah i dunno. i dont really wanna go to home depot right now for more LET, but i guess i could... maybe ill just eraser the entire board..

When you use LET on your boards do you remove the heatsinks to cover the SMDs in between the PWMs?
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post #27 of 126
7/9/12 at 3:36pm
Yea, I remove the heatsinks, paint everything, wipe it off the top of FETs and controllers when it's still wet, let it dry, then re-attach the heatsinks.

I imagine it does make the thermal path easier- removing it from the top- but I do it because I always got the feeling that it made it easier to remove. Weird, I know.


Under LN2, some PWM gets flaky when it's too cold. Maybe we SHOULD be trapping the heat a bit. I'm thinking out loud though.



One can of LET costs a lot less than a dead mobo smile.gif
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post #28 of 126
7/9/12 at 3:57pm
Paint on the LET much thicker than you did on the card (multiple layers, not just one big glob). Be sure to tape off anything that it could get under. A thick layer with nothing to go under will peel off in one flawless piece, leaving the board looking brand new.
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post #29 of 126
7/9/12 at 4:22pm
Thread Starter 
Quote:
Originally Posted by K404 View Post

Yea, I remove the heatsinks, paint everything, wipe it off the top of FETs and controllers when it's still wet, let it dry, then re-attach the heatsinks.
I imagine it does make the thermal path easier- removing it from the top- but I do it because I always got the feeling that it made it easier to remove. Weird, I know.
Under LN2, some PWM gets flaky when it's too cold. Maybe we SHOULD be trapping the heat a bit. I'm thinking out loud though.
One can of LET costs a lot less than a dead mobo smile.gif

yeah that basically how i did the mems on the card yesterday! it worked pretty well.
Quote:
Originally Posted by xxbassplayerxx View Post

Paint on the LET much thicker than you did on the card (multiple layers, not just one big glob). Be sure to tape off anything that it could get under. A thick layer with nothing to go under will peel off in one flawless piece, leaving the board looking brand new.

yeah i guess i can use painters tape to seal the gap between the board and the chokes, theres not enough room to block the gaps ith eraser. I can block the gaps under the pcie/dimm slots with eraser if i wanted because there is more room (or i can just tape it like im going to do the chokes)

Thanks guys. home depot i hope is open til 8.
be back soon
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post #30 of 126
7/9/12 at 6:25pm
Thread Starter 
Quote:
Originally Posted by xxbassplayerxx View Post

Paint on the LET much thicker than you did on the card (multiple layers, not just one big glob). Be sure to tape off anything that it could get under. A thick layer with nothing to go under will peel off in one flawless piece, leaving the board looking brand new.

so ive got the edge of the chokes taped up but not sure if i should tape the ICs too or just brush on some thick layers and then wipe any LET off of the topes of each IC...
thoughts?

640
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