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Ivy Bridge 3770k De-lid, Liquid Pro & AS 5 Tested. Amazing Results!!!....... - Page 5

post #41 of 47
Very nice gains! holy crap.... you think I would gain this much from my 2500k? I can run over 5ghz, but for air cooling it is a little risky running on the high end of the max temps.
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post #42 of 47
Quote:
Originally Posted by Zcypot View Post

Very nice gains! holy crap.... you think I would gain this much from my 2500k? I can run over 5ghz, but for air cooling it is a little risky running on the high end of the max temps.

bet you would see a difference ...1 small problem tho,
The 3570k and 3770k have Tim between Die and IHS while 2500k is soldered to the IHS,
which is way more optimal..
so even if you could get it off, im not sure howmuch more improvement you would see
if you changed the tim to liquid pro, or ultra. smile.gif
prolly less then the sometimes great results we see with ours..
Edited by VonDutch - 10/17/12 at 4:39am
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post #43 of 47
Quote:
Originally Posted by VonDutch View Post

bet you would ...1 small problem tho,
The 3570k and 3770k have Tim between Die and IHS while 2500k is soldered to the IHS,
which is way more optimal..
so even if you could get it off, im not sure howmuch more improvement you would see
if you changed the tim to liquid pro, or ultra. smile.gif
prolly less then the sometimes great results we see with ours..

doh.gif maybe I should not mess with it then hahah. I dont have THAT much experience in that type of stuff yet.
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post #44 of 47
I Quote

Solders can be used between metals (if they are solderable) and on metallized Peltier module faces. See TEC Mounting Methods.
Solder is a superior TIM since the thermal conductivity of most solders is around 30 to 60 W/m-K.
In addition, solder is a mechanical mounting means that eliminates external fasteners.
Care must be taken to avoid creating voids (air or flux pockets) within the solder.
The most common solder is Sn63/Pb37 which has a thermal conductivity of 50.9 W/m-K and a eutectic melt point of 183°C.
http://www.customthermoelectric.com/TIMs.html

end Quote

Interesting, i didnt know the w/mk of solder, between 30 and 60w/mk..
so if you compare it with the liquid pro/ultra, 82 w/mk..
and what we know now about the importance of compound used on the Die, related to w/mk,
liquid pro/ultra would even outperform soldered cpu's..
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post #45 of 47
These are my results after I delided my 3770k. 11hrs of Prime95 4.5GHz @ 1.24v
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post #46 of 47
Quote:
Originally Posted by VonDutch View Post

I Quote
Solders can be used between metals (if they are solderable) and on metallized Peltier module faces. See TEC Mounting Methods.
Solder is a superior TIM since the thermal conductivity of most solders is around 30 to 60 W/m-K.
In addition, solder is a mechanical mounting means that eliminates external fasteners.
Care must be taken to avoid creating voids (air or flux pockets) within the solder.
The most common solder is Sn63/Pb37 which has a thermal conductivity of 50.9 W/m-K and a eutectic melt point of 183°C.
http://www.customthermoelectric.com/TIMs.html
end Quote
Interesting, i didnt know the w/mk of solder, between 30 and 60w/mk..
so if you compare it with the liquid pro/ultra, 82 w/mk..
and what we know now about the importance of compound used on the Die, related to w/mk,
liquid pro/ultra would even outperform soldered cpu's..


Very interesting info there VonDutch, thanks for presenting it. wink.gif +1 SN62 tends to be a bit more prevalent on this side of the pond.

I am curious, because I have some high purity eutectic silver solder (WBT-0800 4% silver) of the leaded persuasion. NOT that I intend to try this myself, because I have neither the equipment to measure thermal conductance, nor a finely temp controlled reflow station suitable for such work. My Hakko won't cut it for this. wink.gif


Typically used for high end audio component assembly, and quite expensive. Melting temp: 178-180°. Finding an MSDS sheet on it is near to impossible (if one exists at all, I'm not aware of it), and it's just as guarded a proprietary mixture as Cardas's Quad Eutectic. Still, curiosity leads me to wonder about the W/m K. rating effects of high purity mixtures. For example, I do know that both Cardas & WBT both use 5n-6n (99.999% - 99.9999%) purity silver in their proprietary blends, one could extrapolate that in all likelihood, the chemical makeup of the rest (lead/antimony/tin/etc) are likely just as highly refined.


The following is purely conjecture for the sake of wondering aloud, so to speak:


Obviously, even with the greater thermal conductivity of standard 3n purity silver (3n = Three nines = 99.925% =Sterling/Bullion, for those not familiar w/ metallurgy), the the content percentage would be to low to have a drastic effect. Even with the W/m K rating of 406.0 with 3n Silver, and ofc higher w/ 5 or 6n purity. How great of an effect of the other high purity components? By that I refer to the tin/lead/antimony/etc.


Just to share, the current highest refining purity state is 8n (99.999999%), afaik. 9n purity is claimed by a few, but I have seen no outside confirmations by reliable sources to prove it's authenticity. All metals are an alloy, absolute purity is not yet technically feasible...if ever. They are getting very close though. smile.gif


Regardless, I'd love to see some testing done on the high quality solders available just to see the difference's in thermal conductivity. Not to mention on the more highly refined metals themselves individually tested to compare against the more common, and commonly known lesser purity versions. Just a thought... tongue.gif
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post #47 of 47
im thinking about this, after reading your post,

IC Diamond 7 Carat Thermal Compound - 1.5 gram

IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond’s superior thermal conductivity. Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver. Diamond’s are five times better thermal conductors compared to silver which makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.

i remember someone got all hyped about it, saying it had a much higher w/mk then liquid pro or ultra ..lol
so i tried to get some clear answer, did some searching and found this about IC7's w/mk

Key Specifications:

Thermal Conductance: 4.5 W/m-K (data acquired with an ASTM D – 5470 thermal interface test instrument)
Thermal Resistance: 0.25oC-cm2/W@ 100 ì BLT
Average Particle Size: <40 ì maximum particle diameter
Compliancy: RoHS Compliant.

liquid pro wins..lol thumb.gif
so yea, other materials in the "mix", do have influance on its behavior,
its not only gallium that makes pro good,
pure gallium has a 29-41 w/mk, so there must be something else in liquid pro that makes the w/mk so high..

the rest of your post is hard to understand for me, im not that technical..lol biggrin.gif

o, i made one little mistake in my post i just noticed,
saying pro and ultra have a w/mk of 82,
only pro has that high 82 w/mk, ultra is about 32w/mk,
if you use them on the die, the temp difference isnt as big as the w/mk diff,
if you could use a lets say, 160 w/mk tim, i dont expect its gonna make a huge difference in temps,
theres other factors to keep in mind ..


just found this, whats in ultra,

COMPOSITION/INFORMATION ON CONSTITUENTS
2.1 Chemical characterization:
Alloy of the metal components gallium, indium, rhodium, silver, zinc and stannous, bismuth;
suspended in a graphite-copper matrix
http://www.coollaboratory.com/pdf/safetydatasheet_liquid_ultra_englisch.pdf
Edited by VonDutch - 1/6/13 at 1:17am
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