im thinking about this, after reading your post,
IC Diamond 7 Carat Thermal Compound - 1.5 gram
IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond’s superior thermal conductivity. Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK
compared to 406-429 W/mK for pure silver. Diamond’s are five times better thermal conductors compared to silver which makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.
i remember someone got all hyped about it, saying it had a much higher w/mk then liquid pro or ultra ..lol
so i tried to get some clear answer, did some searching and found this about IC7's w/mk
Thermal Conductance: 4.5 W/m-K
(data acquired with an ASTM D – 5470 thermal interface test instrument)
Thermal Resistance: 0.25oC-cm2/W@ 100 ì BLT
Average Particle Size: <40 ì maximum particle diameter
Compliancy: RoHS Compliant.
liquid pro wins..lol
so yea, other materials in the "mix", do have influance on its behavior,
its not only gallium that makes pro good,
pure gallium has a 29-41 w/mk, so there must be something else in liquid pro that makes the w/mk so high..
the rest of your post is hard to understand for me, im not that technical..lol
o, i made one little mistake in my post i just noticed,
saying pro and ultra have a w/mk of 82,
only pro has that high 82 w/mk, ultra is about 32w/mk,
if you use them on the die, the temp difference isnt as big as the w/mk diff,
if you could use a lets say, 160 w/mk tim, i dont expect its gonna make a huge difference in temps,
theres other factors to keep in mind ..
just found this, whats in ultra,
COMPOSITION/INFORMATION ON CONSTITUENTS
2.1 Chemical characterization:
Alloy of the metal components gallium, indium, rhodium, silver, zinc and stannous, bismuth;
suspended in a graphite-copper matrix
http://www.coollaboratory.com/pdf/safetydatasheet_liquid_ultra_englisch.pdfEdited by VonDutch - 1/6/13 at 1:17am