Originally Posted by DzillaXx
Maybe if you water cool it or cutting a hole in the bottom and attaching an extra 120mm fan. Though solder joint could have just became to weak or just unreliable without reballing. The only true fix would be to reball with a better type of solder.
It's unfortunate that these consoles were designed like this (same goes for the Xbox 360) where the solder cracks like that from the overbearing heat. Lead-free solder is to blame though even normal leaded solder would corrode and flake over time from temperatures approaching 100C during normal usage. The PS3 had a better heatsink than the Xbox 360 (fat versions) and so this was probably why it was a lot less common than the RROD. Then again it makes me wonder why graphics cards which have BGA's and can reach similar temperatures don't run into these problems.
At this point reballing would be the best solution for what should be the longest-lasting fix (it may be few more years before the solder flakes and cracks again and the reballing would have to be done again). Unfortunately that can only be done at special shops since a balling machine is required to place every solder ball in the correct spot before melting them to bond the CPU/GPU with the motherboard.