I figured if anybody knows, it's probably you guys.
So I have this fanless notebook, the Dell X1. And it overheats like a ***** due to the heatsink actually being a 0.6mm sheet of aluminium with a puny excuse for a heatpipe bodged onto it by the trained monkeys at Dell.
The stock heatsink has a dissipation surface of 50cm^3 or thereabouts, NOT taking into account the heatpipe.
There is enough room in there for a 100mm*70mm*2.5mm copper block, which would have a dissipation surface area of 175cm^3 or thereabouts, not to mention better conductivity.
Reckon I should give this a go? I'm thinking epoxy it to the CPU/GPU since obviously there won't be any way of securing it through screw holes.
The CPU is a Pentium M 733 ULV 1.1GHz which puts out 6W maximum, and the GPU is a lowly GMA 900.
Cheers
Edited by spleenharvester - 8/11/12 at 8:51am
So I have this fanless notebook, the Dell X1. And it overheats like a ***** due to the heatsink actually being a 0.6mm sheet of aluminium with a puny excuse for a heatpipe bodged onto it by the trained monkeys at Dell.
The stock heatsink has a dissipation surface of 50cm^3 or thereabouts, NOT taking into account the heatpipe.
There is enough room in there for a 100mm*70mm*2.5mm copper block, which would have a dissipation surface area of 175cm^3 or thereabouts, not to mention better conductivity.
Reckon I should give this a go? I'm thinking epoxy it to the CPU/GPU since obviously there won't be any way of securing it through screw holes.
The CPU is a Pentium M 733 ULV 1.1GHz which puts out 6W maximum, and the GPU is a lowly GMA 900.
Cheers
Edited by spleenharvester - 8/11/12 at 8:51am
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