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Flow order - (4 Block + 2 Rads - No res)

post #1 of 10
Thread Starter 
Hi

Is close to order the last parts of my build, and is really fightning to get the flow right - Its a mITX build with NO space ...

The components:

1x Pump (DDC 10Watt)
2x RAD
4x Block (CPU, Chipset, Memory, Graphic)
No res - Only fillport

This is what im thinking of - Can the fillport (T-Fitting) be before CPU ?

Pump - CPU - Memory - Chipset - Graphic - RAD1 - RAD2 - Pump ......

Got my paper and pencil right in front of my, really trying to get this right biggrin.gif

The CPU should be nr.1 but does it make a big different that the Graphic is nr. 2 ? (Two main parts)
Edited by Fonne - 8/25/12 at 4:49am
post #2 of 10
Well using a res is always better.
Pump - CPU - Memory - Chipset - Graphic - RAD1 - RAD2 - Pump

I'd say

Pump - Graphic - CPU -...
Pump - CPU - Graphic - ...

So I mean chipset memory and rads should have the least priority
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post #3 of 10
Quote:
Originally Posted by Devran View Post

Well using a res is always better.
Pump - CPU - Memory - Chipset - Graphic - RAD1 - RAD2 - Pump
I'd say
Pump - Graphic - CPU -...
Pump - CPU - Graphic - ...
So I mean chipset memory and rads should have the least priority

Please explain why a res is "always" better... It only helps for bleeding the loop and maybe some aesthetics.

Loop order doesn't matter at all (normally they say res before pump, in your case T-line before pump). Just make it as short and clean as you can. Use anti-kink if you need to, as the bends of the tubes in an itx case will be tight (kinks reduce flow). You're loop order looks good though.
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post #4 of 10
Quote:
Originally Posted by Rognin View Post

Please explain why a res is "always" better... It only helps for bleeding the loop and maybe some aesthetics.
Loop order doesn't matter at all (normally they say res before pump, in your case T-line before pump). Just make it as short and clean as you can.

With a res water heats up harder and in longer time. Since the amount of water in the system is increases, therefore the thermal capacity. So a larger res is even better.
With a res you can monitor the amount of water in the loop. Filling and bleeding is also easier.
A res which is placed before the pumps can help reduce NPSH (Net Positive Suction Head) of the pump.


My PC's loop order is as follows:

Res - Pumps - Cpu - Gpus - Chipset - Rads - Res

So the water cools down from the rads and goes to the res. From the res the coolest part of the water in the loop enters into my Cpu and Gpus because they are the parts that create the most heat and that has to be cooled the most. Specially the gpus.

Therefore the loop order does matter
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post #5 of 10
Quote:
Originally Posted by Devran View Post

With a res water heats up harder and in longer time. Since the amount of water in the system is increases, therefore the thermal capacity. So a larger res is even better.
With a res you can monitor the amount of water in the loop. Filling and bleeding is also easier.
A res which is placed before the pumps can help reduce NPSH (Net Positive Suction Head) of the pump.
My PC's loop order is as follows:
Res - Pumps - Cpu - Gpus - Chipset - Rads - Res
So the water cools down from the rads and goes to the res. From the res the coolest part of the water in the loop enters into my Cpu and Gpus because they are the parts that create the most heat and that has to be cooled the most. Specially the gpus.
Therefore the loop order does matter

Yup, that I agree with. Though you ommitted the fact that it takes a lot of water to increase thermal capacity. The reservoirs we use have between 100 and 400ml of water. That isn't a very big buffer in thermal capacity (4 or 5 liters might though).

As for bleeding, using a t-line is almost as easy. And for water levels, well if your t-line is clear tube you can use that as a reservoir (albeit a very small one).

So for all intents and purposes, a reservoir isn't as important as a good pump or blocks; you can easily do without. In the OP's case, an ITX sized case might not accommodate the space requirements for a reservoir either.
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post #6 of 10
Thread Starter 
Some great answer, thanks thumb.gif

The case is custom, and there is no room to fit a res, so is hoping that a T-Fitting + a small piece of clear tube will work ...

The 2 main parts + blocks is:

Intel i7-3770k - HEATKILLER® CPU Rev3.0 1155/1156
EVGA GTX670 - HEATKILLER® GPU-X³ GTX 670

The chipset is Z77 and dont make a lot of heat, and the memory is G.Skill 2400 Mhz - They are only cooled because I can and the look redface.gif
post #7 of 10
Quote:
Originally Posted by Fonne View Post

Some great answer, thanks thumb.gif
The case is custom, and there is no room to fit a res, so is hoping that a T-Fitting + a small piece of clear tube will work ...
The 2 main parts + blocks is:
Intel i7-3770k - HEATKILLER® CPU Rev3.0 1155/1156
EVGA GTX670 - HEATKILLER® GPU-X³ GTX 670
The chipset is Z77 and dont make a lot of heat, and the memory is G.Skill 2400 Mhz - They are only cooled because I can and the look redface.gif

Nice, so yeah a t-line will work great for what you're intending on doing.

Use the KISS principle, the less clutter you'll have the better. It's never failed me... wink.gif
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post #8 of 10
Thread Starter 
The main thing im thinking about is to place Graphic before CPU ... Just think that people always places the CPU first because the waterblock perform the best with the higest flow - But how much will it mean to place the CPU after Graphic ?
post #9 of 10
Quote:
Originally Posted by Fonne View Post

The main thing im thinking about is to place Graphic before CPU ... Just think that people always places the CPU first because the waterblock perform the best with the higest flow - But how much will it mean to place the CPU after Graphic ?

I've done it before. I saw a 5c decrease in temps on the CPU by placing it before the GPU's. I had three GTX 580's @ 951 and 1.15 volts though. You might see a 1 or maybe 2 c increase on the cpu. So if you're not fighting the thermal barriers on your CPU with the OC's (say 75 to 80c) then it shouldn't be a very big problem. If however you are near the max and need every degree, then you might want to change it around.

Again, it won't be a very big difference. To raise the water temp by 1c you need 264w of heat at 1gpm. That vid card stock is rated 170w right? So lets say 225w for the vid card OC'd and folding or benching. Still not a 1c increase on your CPU.
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post #10 of 10
Thread Starter 
Quote:
Originally Posted by Rognin View Post

I've done it before. I saw a 5c decrease in temps on the CPU by placing it before the GPU's. I had three GTX 580's @ 951 and 1.15 volts though. You might see a 1 or maybe 2 c increase on the cpu. So if you're not fighting the thermal barriers on your CPU with the OC's (say 75 to 80c) then it shouldn't be a very big problem. If however you are near the max and need every degree, then you might want to change it around.
Again, it won't be a very big difference. To raise the water temp by 1c you need 264w of heat at 1gpm. That vid card stock is rated 170w right? So lets say 225w for the vid card OC'd and folding or benching. Still not a 1c increase on your CPU.

Thanks, great answer thumb.gif

Is trying to see what order that will be the most "clean" and easy to make - 1 or 2c dont make a different anyway ...
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