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DT Direct 2011 waterblock - Page 3

post #21 of 64
Quote:
Originally Posted by somebadlemonade View Post

just make sure you don't go too deep, since the IHS isn't all that thick, and you'd still want the edges to seal so they'd have to stay smooth, if you can block that area off from getting hit you'd be set

A little masking tape were the o ring sits and a light blast!!
post #22 of 64
you'd probably only need to do it over where the cores are, where it's going to be the hottest
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post #23 of 64
Ahh OCN.

If you were to try and convince anyone else that it was a good idea to buy a $600 CPU, sand blast it then strap a water block directly to the IHS they would probably try to have you committed...
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post #24 of 64
yea, we are the home of the goofballs that overclock with liquid helium
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post #25 of 64
This was done years (1999-2001) ago by a guy named Lufkin. It didn't go well:)
Stick that cpu in a mill machine and take the face down a little then "direct die" cool it.

Direct die was the term used well over ten years ago.

Sandblasting the CPU would increase surface area.
Edited by linuxfueled - 8/28/12 at 4:36pm
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post #26 of 64
This is pretty crazy they should have double O-rings though or even triple. If it had triple O-rings I would stick it on my CPU no question asked. But one O-ring ? worriedsmiley.gif
 
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post #27 of 64
Quote:
Originally Posted by UNOE View Post

This is pretty crazy they should have double O-rings though or even triple. If it had triple O-rings I would stick it on my CPU no question asked. But one O-ring ? worriedsmiley.gif
If you're talking about stacking 3 o-rings then that would make the seal worse actually. If you're talking about o-rings with different diameters that all help to seal than yes, that would help. We basically trust a single o-ring to keep our water blocks from leaking as it is so I don't see this as being any less safe.
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post #28 of 64
Quote:
Originally Posted by DetroitAC View Post

The IHS does not come off, it seals directly to the IHS. I've only had leaks when I forgot to install the Oring. biggrin.gif
On my test rig, the 1366 version is better than Sniper with PK-1. We'll have to see how this 2011 version performs, I don't have a 2011 test rig, but I'm using the same geometry as my 1366 version. 1366 version was developed for about 3 months, many many iterations.

I'll test one for you biggrin.gif
post #29 of 64
Quote:
Originally Posted by DetroitAC View Post

This is the next new waterblock from DT Waterblocks, this one is called DT Direct 2011.
The block seals directly to the LGA2011 processor IHS.



Damn, they got balls. This ladies and gentlemen is the best way to cool, DIRECT TO WATER transfer. Go ask your local CFD (computational fluid dynamics) expert.
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post #30 of 64
Great idea. I remember swiftech doing something similar with a peltier/GPU block, but this sounds promising also. As mentioned before, a double, or triple gasket design would be great. Or maybe even a liquid gasket solution.
    
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