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[eTeknix] Ivy Bridge and changing the Thermal Interface Material - Page 3  

post #21 of 51
Quote:
Originally Posted by Blameless View Post

No.
This is oft quoted, but erroneous. Without tri-gate transistors leakage would be greater, and temperatures higher.
Intel may well have not reached the target performance (regarding leakage and power density) with the new transistors, but it's still an improvement.
No, this is actually quite true. It works great for the normal operating voltages that Ivy Bridge uses, but the process is very much tweaked for low power, causing overclocks to suffer. A standard 22nm process would have fared better.

Still, the TIM/Solder issue is the main problem. The forum admin over at AnandTech dropped his temps by 20c by delidding.
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post #22 of 51
You'd think that after all the trouble of taking their CPU apart and testing all those different scenarios they'd at least give it a run without an IHS at all.
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post #23 of 51
Quote:
Originally Posted by Homeles View Post

A standard 22nm process would have fared better.

This goes directly against everything that has been said about the advantages of the tri-gate transistors.

Not that we have a 22nm bulk process to compare it to.
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post #24 of 51
Quote:
Originally Posted by Manyak View Post

You'd think that after all the trouble of taking their CPU apart and testing all those different scenarios they'd at least give it a run without an IHS at all.

Don't you need the heatsink to even get the cpu into the socket corrently? And the cooler wouldn't touch the cpu at all.
 
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post #25 of 51
is it ok to install a cooler without the IHS?
post #26 of 51
Quote:
Originally Posted by Blameless View Post

This goes directly against everything that has been said about the advantages of the tri-gate transistors.
Not that we have a 22nm bulk process to compare it to.
Warning: Spoiler! (Click to show)
bohr-20110503-slide20-ann.png

With the orange lines and text in between being an alteration of the original slide.

The theory is something like this (credit to both images to mrob27 at AT): Warning: Spoiler! (Click to show)
munafo-20120820-we-are-here.png

Crudely drawn and not to scale, but it represents the point. No matter how you look at it, the clock delay decreases more slowly on tri-gate vs. planar. That's Intel's own data.

Anand Shimpi and Ryan Smith at AnandTech also back up this assertion:
Quote:
The process is still young and likely biased a bit towards the lower leakage characteristics of lower voltage/lower wattage CPUs, such as those that would be used in Ultrabooks. These two factors combined with some architectural decisions focused on increasing power efficiency result in what many of you may have heard by now: Ivy Bridge won't typically overclock as high as Sandy Bridge on air.

Edited by Homeles - 9/9/12 at 2:23pm
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post #27 of 51
Quote:
Originally Posted by Hukkel View Post

Don't you need the heatsink to even get the cpu into the socket corrently? And the cooler wouldn't touch the cpu at all.

Quote:
Originally Posted by ghostrider85 View Post

is it ok to install a cooler without the IHS?



You need to remove the metal latch that normally clamps the cpu down. If you remove that, most heatsinks will contact the die. You have to be careful not to crush the die though.
 
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post #28 of 51
Quote:
Originally Posted by G3RG View Post

You need to remove the metal latch that normally clamps the cpu down. If you remove that, most heatsinks will contact the die. You have to be careful not to crush the die though.

is the die brittle? i can't tighten the cooler normally? please answer, i am really going to do this.
my cooler is gemin ii s524.
post #29 of 51
where can i get a razorblade locally that is suitable for this job? i have a cutter but the blade is too thick
post #30 of 51
8c under overclocked load, not bad.
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