Originally Posted by Derpinheimer
Yes separate design is superior, if only slightly.. unless the memory were making a lot of heat [like 1.7v/2000], then maybe it cools the memory better than split cooling.. although of course the core gets the extra heat then too.
I think the biggest problem with this cooler is that the vapor chamber is massive and blocks a huge chunk of the exhaust air.
How come no manufacturers have gone with HDT yet? Hasnt that become commonplace for CPU heatsinks by now?
I think you are somewhat right here. You need good airflow to achieve good temperatures with this card. However, i am not certain this has to do with just this card and its design. I think the Windforce from Gigabyte also would benefit from good airflow. Which card wouldn't? A reference perhaps.
Anyway i recently switched from a NZXT H2 to a Antec P280. And i have noticed lower temperatures.
On my NZXT i had 2 front fan(120mm) and 1 rear(120mm), and a special modified side with a 140mm fan, blowing over the side of the card.
Now in my Antec i have the standard fans. 1 rear and 2 top. I also have added 2 more 120mm fans, one in front and another one "in the middle" blowing towards the card. If you are familiar with the P280 you would know what i mean with "in the middle". If not google a picture of it.
I think that middle fan is doing some really
good work, temperature drops as high as 10°c on the VRMs is something i have noticed.
So a good case with good airflow is really something that you would like to have, especially with this kind of cooling solutions. I think this goes for the Windforce and MSI solution aswell. Not just this card.
80-85°c is no temperatures for this kind of electronics, in my opinion.