Made my account today just to say thanks to everyone in this forum. Well I had quite an adventure with my de-lidding process.
Started off by purely following WhiteDragons guide in Youtube. It was a good guide that showed me how to delid the cpu and what to do after. However, I got lost when it came to reapplying the thermal paste. From there on I was lost, I didn't know if I should apply pressure on the ihs after reconnecting it (that is what I did). Booted up my pc and to my surprise, temperatures were much higher. So I had to redo the thermal paste process, I redid the thermal paste about 6 times and all attempts were failures, some being epic failures (wouldn't even get past Window's welcome screen).
I've tried the pea method and spreading the thermal paste evenly around the die. I tried those two methods while applying pressure to do ihs before inserting it to my mobo socket (which I later on found out is a BIG no no). After my 6th attempt and temperatures were the best out of all 6 tries I decided to give it a rest and even thought I broke my CPU. Throughout the night (thank goodness I'm on spring break) I couldn't stop thinking about my recent screw up with my $300 cpu, so I decided to make a google search and read forums about delidding...and that is where I saw this thread.
I found out that you shouldn't apply pressure to the ihs, I found out about the "half-grain" method that the OP used. And best of all, it encouraged me to give it another try (which I did the next day, since I came across this thread at around 3am).
Before giving it another try, I decided to get new Thermal Paste, I was starting to think that AS-5 was to blame for my failed attempts at delidding. I ordered CLP last night, and while waiting for my CLP, I decided to go with MX-4. I then proceeded with another attempt and followed this guide and took advice from other people from this thread. The results: Initially, I thought my delid was half-successful since I had one core having 12 - 15c warmer. After a few hours of normal use, a bit of stress testing, and gaming....a successful delid! Cores temps are consistent with each other when idle, and lower temps. Although I haven't tried a real overclock test, I tried doing stress tests while increasing vcore (which I think should be the same as overclocking, since I'm just looking to monitor the temps).
My previous oc was 1.34v @ 4.7ghz. Hottest core reaches almost 100c, while the 3 others are low 90's w/ my H80i at Max. I'm currently testing at 1.395v, 4.5ghz (as I mentioned above, just testing the voltages since I'm only monitoring temps atm). 3 cores are high 90's, while one core is around 89 - 91c w/ my H80i at quiet. I know those are really high temps but for me, those temps are acceptable since I rarely, if not never, go above 60% cpu usage. My temps @ real time loads is, more often than not, 45c - 65c. Also, people will argue that this will lessen the life-span of my cpu, but I don't think this will cause it to last less than 3 years, which is my minimum life-span target. I think 3 years is a lifetime for processors, especially with how innovative the world is right now.
Just a couple of questions:
1) Like I mentioned earlier, one core is significantly lower than the others (almost 10c lower) during stress tests, does this mean there is still room for improvement in my delid (thermal paste application on the dye)?
2) When my system is idle, I notice temps jump 8 - 10c higher occasionally. It only stays like that for a split-second, is this a symptom of bad thermal paste application on the heat sink? If not, what can be the cause?
Again, thank you so much OCN, and to the people who posted above me! Couldn't have done a successful delid without you guys!
P.S. Sorry I don't have images to post.