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Ah ha - my IHS is concave

post #1 of 31
Thread Starter 
Ok, well i found the cause of my ****ty temps, with stock HS and the BT.

My IHS is concaved!

It seems so slight, i can't actually see it, although i might have been able to if i had taken the CPU out of mobo and shone a light on it.

But basically my temps where crap so i decicded to remove the BT, and try replacing the AS5 and reseating. This time i spread the AS5 out with my finger through a plastic bag, rather than just putting a bb sized amount and letting the HS spread it out.

Upon booting and running prime my temps hit 70c quickly and carried on climbing upto about 75c, so i shut it down.

Removed the BT... Look at the base of the BT, and there were only 2 thin strips of AS5 on it, around the edges.

Seems the centre of the IHS is slightly dipped in, and doesnt make good contact with the base of the BT.

So putting a blob in the middle of the IHS and letting the HS spread it works better, because the AS5 has to be incontact with HS and IHS before it gets squidged outwards.

This makes me kinda happy, as i now know why my temps are worse than they should be.

46c idle and 60c load. Not really much better than stock.

So hopefully when i build a new rih my temps wil be nice and cool with the BT and my case airflow

NOTE: ArtiClean 1 smells like lemons... Like... REALLY strongly of lemons. Now my room smells like a lemon.
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post #2 of 31
Hmmm.... Perhaps cut the IHS out of the scene?
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post #3 of 31
Quote:
Originally Posted by noxious89123 View Post
Ok, well i found the cause of my ****ty temps, with stock HS and the BT.

My IHS is concaved!

It seems so slight, i can't actually see it, although i might have been able to if i had taken the CPU out of mobo and shone a light on it.

But basically my temps where crap so i decicded to remove the BT, and try replacing the AS5 and reseating. This time i spread the AS5 out with my finger through a plastic bag, rather than just putting a bb sized amount and letting the HS spread it out.

Upon booting and running prime my temps hit 70c quickly and carried on climbing upto about 75c, so i shut it down.

Removed the BT... Look at the base of the BT, and there were only 2 thin strips of AS5 on it, around the edges.

Seems the centre of the IHS is slightly dipped in, and doesnt make good contact with the base of the BT.

So putting a blob in the middle of the IHS and letting the HS spread it works better, because the AS5 has to be incontact with HS and IHS before it gets squidged outwards.

This makes me kinda happy, as i now know why my temps are worse than they should be.

46c idle and 60c load. Not really much better than stock.

So hopefully when i build a new rih my temps wil be nice and cool with the BT and my case airflow

NOTE: ArtiClean 1 smells like lemons... Like... REALLY strongly of lemons. Now my room smells like a lemon.

Articlean smells like new computer smell.
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post #4 of 31
Now you know why they say put a dab in the middle, not just because it spreads more evenly, but because it fills in the gaps between the IHS and HS.

Quote:
Originally Posted by The Bartender Paradox View Post
Hmmm.... Perhaps cut the IHS out of the scene?
Yeah and take the core with it LOL. Ontop of that, if you actualy did it without damaging the core, you would still have to modify the hold down strap on the board by removing it completely, which is ok when you have your system on the side, but when you remove the heat sink the CPU will come right up with it.
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post #5 of 31
Quote:
Originally Posted by Adeoliver View Post


Yeah and take the core with it LOL. Ontop of that, if you actualy did it without damaging the core, you would still have to modify the hold down strap on the board by removing it completely, which is ok when you have your system on the side, but when you remove the heat sink the CPU will come right up with it.

My bad, I didn't see that it was a P4. P4s have the IHS epoxied onto the core, so disregard my removal comment.
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post #6 of 31
How about lapping? unless you're afraid of the warranty part(like myself)
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post #7 of 31
Thread Starter 
I can't be doing with the hassle/risk/etc on lapping.

And removing the IHS is a nono... Bt vs cpu core = omg. Thats just scary.

I'm saving for a C2D upgrade, so should be able to afford that in 2~4 weeks
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post #8 of 31
well really lapping is prob the least dangerouse route to go and with your c2d's ive been reading that alot of those are really concave (which i had doen mine before i put it under phase) so its a good idea to do it anyways, ofcourse unless yoyu want the warranty but ehh
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post #9 of 31
Thread Starter 
When i get a C2D i DEFINITELY wont be lapping it. **** that.

Warranties ftw.
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post #10 of 31
Eh. Lapping is way safer to do then removing your IHS. Thats what I plan to do anyways.
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