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What is IB 3570k die offset distance from PCB (Cooling mod Idea help....) - Page 2

post #11 of 17
Thread Starter 
Quote:
Originally Posted by snitchkilla11 View Post

did you do the old knife trick to get the heat plate off?

Not sure what that is.


I used a stanley utility knife blade.



I held the blade between my thumb and index finger and carefully wiggled the blade at the corners first and then the sides. I have a good feel for cutting and as I wiggled it in I could feel pressure then a slight release when I cut through the glue. I was very careful and in control of the blade so that when I felt the glue give way let back on pressure. Have to be in control and know that if you go to far you will cut the die and kill the cpu.
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post #12 of 17
Thread Starter 
According to measurements taken by Idontcare at Anandtech forums the CPU silicon die is offset a mere 0.53 mm from the pcb.

So it looks like my best bet is to get the 1mm thickness Thermalpad and then hope that it will compress under pressure to .53mm thickness. biggrin.gif I think it is possible since most thermal pads do give way. 1mm may be the perfect size.


Once I do this mod I will post results. smile.gif
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post #13 of 17
Quote:
Originally Posted by VonDutch View Post

a 11.0 watt/mk thermal conductivity isnt much tho, just saying..

11 W/mK is extremely high for a non-metalic TIM, and is near the top end of any gap filling pad you can find.

Most thermal pads are between 1 and 3 W/mk, good ones are 4-7, and the highest I have ever seen was 17.
Quote:
Originally Posted by SonDa5 View Post

Sanding down IHS to match height of die to me is just extra metal in the way. I want direct contact from die and PCB wihout the IHS.

The substrate (PCB) doesn't produce any heat itself. Improving thermal conductivity between two parts already at similar temperatures won't do anything.
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post #14 of 17
Quote:
Originally Posted by Blameless View Post

11 W/mK is extremely high for a non-metalic TIM, and is near the top end of any gap filling pad you can find.
Most thermal pads are between 1 and 3 W/mk, good ones are 4-7, and the highest I have ever seen was 17.
The substrate (PCB) doesn't produce any heat itself. Improving thermal conductivity between two parts already at similar temperatures won't do anything.

im not saying its bad, youre probably right about the m/wk's with pads, its hard to get that gap filled,
guess i had this in my mind, but all or any of them would be enough for that,

LM Pro = 82w/mK (according to a HWBOT 2008 TIM roundup)
LM Ultra = 32 or 38w/mK (several web sources and post #216 in this thread)
IX = 20w/mK (IX literature)
PK-1 = 10.2w/m -c (frozencpu)
everything else is less

but those are a different story ..lol smile.gif
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post #15 of 17
Quote:
Originally Posted by VonDutch View Post

guess i had this in my mind, but all or any of them would be enough for that,
LM Pro = 82w/mK (according to a HWBOT 2008 TIM roundup)
LM Ultra = 32 or 38w/mK (several web sources and post #216 in this thread)
IX = 20w/mK (IX literature)
PK-1 = 10.2w/m -c (frozencpu)

I've used all of these except for Indigo Xtreme, and still occasionally use Liquid Ultra and PK-1.

The first three are all pure metal (and the first two are liquid metal at room and operating temp), while PK-1 is low viscosity and has metallic aluminum as one of it's fillers which, if allowed to get where it shouldn't be, can cause problems (I have a 250 dollar board behind me that has a shorted out LGA socket because I was overly sloppy with my PK-1 experiments...50 dollars of powerful solvents and a trip through the dishwasher later and I still haven't got all the aluminum dust out).

Low viscosity TIMs are wholly unsuited for filling a 0.56mm gap, especially if they are conductive or capacitive.
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post #16 of 17
Quote:
Originally Posted by Blameless View Post

I've used all of these except for Indigo Xtreme, and still occasionally use Liquid Ultra and PK-1.
The first three are all pure metal (and the first two are liquid metal at room and operating temp), while PK-1 is low viscosity and has metallic aluminum as one of it's fillers which, if allowed to get where it shouldn't be, can cause problems (I have a 250 dollar board behind me that has a shorted out LGA socket because I was overly sloppy with my PK-1 experiments...50 dollars of powerful solvents and a trip through the dishwasher later and I still haven't got all the aluminum dust out).
Low viscosity TIMs are wholly unsuited for filling a 0.56mm gap, especially if they are conductive or capacitive.

yeah, thats to much, i understand that now,
i have to read posts like 10x, before i understand it ..lol(english not my native language)
guess i was to fast with my response, being busy finding best/good tim
to use on Die and ihs smile.gif
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post #17 of 17
Thread Starter 
Quote:
Originally Posted by Blameless View Post

The substrate (PCB) doesn't produce any heat itself. Improving thermal conductivity between two parts already at similar temperatures won't do anything.

Seems like it would create some type of heat when the CPU over clocked. The contact surface area of the die is much smaller than the total size of the PCB.

Also I think that if I cut the pad just right the sides of the die with be in contact with the thermal pad and that could increase surface area contact of the die for heat transfer.

Once I do this mod any performance increase in thermal cooling or glop out put will be seen in the LinX before and after run. Looking forward to doing this.

Who sells the 17w Thermal PAd?

The thermal pads are expensive. I want to re do my thermal pads on my mother board and video card as well.
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