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[Official] Delidded Club / Guide - Page 11

post #101 of 33576
Quote:
Originally Posted by SonDa5 View Post

Quote:
Originally Posted by Swag View Post

I have said that many times but some people are just too reluctant to listen. Just have their CPU's develop problems and they'll start to learn how to listen.

I've been using it for almost 2 years and I only had one problem and I really think it was because I got a bad batch with a larger diamond crystal than normal.

Did you see the photos of the damage?


Again in case you missed the photos.


IC Diamond problem.
Warning: Spoiler! (Click to show)




Other thani that I haven't had any problems and it has been smooth sailing with good temps.

I do think IC Diamond needs a revision in its formula to make it less thick and more liquid like.

I'm taking a break from IC Diamond till they fix the formula and going to try liquid Pro. I think I have to be more careful with Liquid Pro because when I make contact with die it will be less forgiving as I sqeeze down the mount. I think some people that are having problems doing the delid are having problems when they do the mount.

I saw those pictures and even though in that case, it may not be a problem, but if my IHS on my other CPU's got scratched, I think silicon won't be too far away. Liquid Pro isn't too hard to worry about, just make sure you apply a tiny bit in the center and just work it away around with the brush. Shouldn't have a problem after that.

To people who say they have had no change in temp: I have delidded multiple Ivy Bridges (mine, friends', and clients') from different batches and they all survived for one, and they all had really bad TIM (dry even if it was new). Unless the TIM you put on was really bad, you will see a temperature change. Just keep re-seating and trying again and you won't have a problem. Also, before I got my Coollaboratory Liquid Pro, I used my Noctua NT-H1. Apply a half-a-rice-grain in the center of the die and just apply the IHS, do not spread it. The pressure from the IHS and the block will do the spreading like how the TIM on the IHS is spread!
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post #102 of 33576
Thread Starter 
Quote:
Originally Posted by SonDa5 View Post

The spread sheet is looking good! cool.gif
I'd like to see a field for max OC Valid CPU-Z, one field for stability test such as Prime95 with AVX or LinX with AVX for an hour or so, A 32m score field would be cherry as well. smile.gif
This is my favorite club so far! cheers.gif

Quote:
Originally Posted by PCWargamer View Post

Hey Valgaur, on the warning link, it may be nice to note that the end of the story was that he did not kill his 3770K! Even with the giant pcb nicks, it still booted! Still a good warning about what could have happened and the dude's fears and the real risk. But the chip made it through it all - tough chips!
"Now, I hate to say this but we have had chips die in the past and this is what can happen if you aren't ready and fully prepared!
Warning: Spoiler! (Click to hide)
http://www.overclock.net/t/1309536/did-i-kill-my-3770k-trying-to-delid-it"

Changes have been added to the page. for the spot on the max oc (was already there lol) with the testing and such I'm trying to figure out a spot to put it in...it's already crunched in their lol tongue.gif keep the ideas coming guys we might have to make this just the delidded club eventually lol.
post #103 of 33576
Here is photo of the application of IC Diamond I put on my my die for direct contact with water block. No IHS.

Warning: Spoiler! (Click to show)
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post #104 of 33576
Thread Starter 
Quote:
Originally Posted by SonDa5 View Post

I have a vision of a brilliant master mind Ivy Bridge Intel engineer smiling when an IB is delidded in the pursuit of performance. Having access to the bare die of IB is a special gift and if the IB IHS would have used fluxless solder like SB we would not have been given the opportunity to easily access the bare die of IB.
The benefits to have freedom to cool the bare die of IB may be greater than the design of the SB IHS with fluxless solder.
This is real modding and it is very rewarding. smile.gif

borrowed this for the motto......tell me what you guys think. I like it.
post #105 of 33576
Quote:
Originally Posted by Valgaur View Post

borrowed this for the motto......tell me what you guys think. I like it.

Its great. Captures the spirit of doing this mod and all that is good about it.


Sad part is fluxless solder works way better than any other TIM that is available to easily put on a de-lidded IB. biggrin.gif
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post #106 of 33576
Quote:
Originally Posted by Valgaur View Post

borrowed this for the motto......tell me what you guys think. I like it.

Quote:
Originally Posted by SonDa5 View Post

Its great. Captures the spirit of doing this mod and all that is good about it.
Sad part is fluxless solder works way better than any other TIM that is available to easily put on a de-lidded IB. biggrin.gif

Good motto, and it does capture the spirit of it all...
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post #107 of 33576
Quote:
Originally Posted by SonDa5 View Post

I do think IC Diamond is too abrasive for bare die contact. Diamonds can cut through glass and silicon is a form of glass.
However it does work well and I think IC needs to revise the formula and make it into a much more finer more liquid type of application for better thermal transfer and less abrasive.
The only reason I have scratches on my die is because I rubbed it off instead of dabbing it off with a wet clothe.
I am going to get some Liquid Pro soon and when I remove the IC Diamond I will take photos so everyone can see the damage to my die and block if any. I don't think there will be any damage.

Why PRO over ULTRA? I hear they have similar cooling properties and results, but that ultra is easier to apply. Do we have any sources/data to show that one is better than the other through actual use?

I am interested as I am thinking of getting the ultra. I think the anandtech forum felt that both pro amd ultra were both great, but that ultra was easier to apply.
3770K Gaming Sys
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3770K Gaming Sys
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120GB SanDisk Extreme SSD  1TB WD Black Caviar  2TB Seagate Barracuda TSSTcorp cd/dvd/bd 
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post #108 of 33576
Quote:
Originally Posted by PCWargamer View Post

Quote:
Originally Posted by SonDa5 View Post

I do think IC Diamond is too abrasive for bare die contact. Diamonds can cut through glass and silicon is a form of glass.
However it does work well and I think IC needs to revise the formula and make it into a much more finer more liquid type of application for better thermal transfer and less abrasive.
The only reason I have scratches on my die is because I rubbed it off instead of dabbing it off with a wet clothe.
I am going to get some Liquid Pro soon and when I remove the IC Diamond I will take photos so everyone can see the damage to my die and block if any. I don't think there will be any damage.

Why PRO over ULTRA? I hear they have similar cooling properties and results, but that ultra is easier to apply. Do we have any sources/data to show that one is better than the other through actual use?

I am interested as I am thinking of getting the ultra. I think the anandtech forum felt that both pro amd ultra were both great, but that ultra was easier to apply.

I like Pro better but Ultra is easier to apply because it has higher viscosity. The temps are going to be exactly the same. One is NOT better than the other as some people say. It is not. Ultra is just thicker and pastier and easier to put on. Pro takes a bit of practice because it is more fluid like and you can easily spill it over the die and you kinda don't want that. tongue.gif
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post #109 of 33576
Quote:
Originally Posted by Swag View Post

Pro takes a bit of practice because it is more fluid like and you can easily spill it over the die and you kinda don't want that. tongue.gif

Will it eat a hole through the PCB? What is the problem if it does?
B.K.T.
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B.K.T.
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post #110 of 33576
Quote:
Originally Posted by SonDa5 View Post

Quote:
Originally Posted by Swag View Post

Pro takes a bit of practice because it is more fluid like and you can easily spill it over the die and you kinda don't want that. tongue.gif

Will it eat a hole through the PCB? What is the problem if it does?

Won't eat a hole, but since it's electrically conductive (very much), if you hit the gold parts of the PCB, it may cause some issues. Electric current + electric conductivity isn't too well digested in the PC world.
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