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[Official] Delidded Club / Guide - Page 1126

post #11251 of 33574
Quote:
Originally Posted by MikeG View Post

Was it worth it? That's a very subjective question and I'm sure everyone will have a different opinion. The risks are high, but also the rewards. For someone doing it for the first time, be prepared that you may damage your chip and/or your motherboard. Keep in mind, that I had a very good chip to begin with.

direct die vs. delidded:
  • Did I see a performance difference at 0°C? No
  • Did I see a gain in MHz with ambient room temperatures of 20°C? Not really--not with VCore values that I feel comfortable with. Understand that I was already somewhat stable (I could run 10 passes of IBT) at 5.0GHz and 1.415V delidded.
  • Did I see a reduction in temperatures? Yes, My temperatures were reduced by about 7 to 8°C from my hottest core.
  • Was I able to reduce my VCore? Yes I was able to lower my VCore by 0.02V (5.0GHz with 1.395V)
  • So what is the benefit for me? SILENT COMPUTING! I'm sitting here typing this and all the while my processor is running at 5.0GHz. My fans are set to 6.7V and will only lift a sheet of paper by about 1/2 inch when laid over the radiator. AIDA 64 stability test has been running the last 10.5 hours and my average core temps are 56°C.
  • Was I worried about too much or too little pressure on the die? Absolutely, with no way to measure how much pressure I was putting on the die, I just had to guess and hope I didn't break something. My first boot attempt resulted in post code 55. I loosened my water block a little and this time the motherboard would not stay powered on. It turned out that I was being too conservative with the pressure I was putting on the die. I increased the amount of pressure until finally I could boot. Now that I know exactly how far to tighten my block, I am extremely comfortable removing and remounting the block. I have done this half a dozen times already.
  • Does it take nerves of steel? Yes

If you want my take on it as a well trained scientist, I don't think there is any difference between leaving the heatspreader and not. People are getting a placebo effect and thinking that going direct die is really making a difference. Technically the entire bottleneck to your heat dissapation would be from the die through that first layer of TIM as the area of contact is the smallest making the heat transfered per unit area the highest of any interface. So whether that heat is going directly to a cpu heatsink/waterblock or into the CPU heat spreader and then through the same TIM interface spread over a larger area thereby reducing the heat transfer requirements (heat per unit area) dramatically and then into the cpu heatsink/waterblock doesn't matter at that point. The only time it could matter is if your heatspreader does not make good contact with the die surface from being concave/convex, but you can have a concave/convex water block too and get bad results. So if you want my final feeling on direct die, it just doesn't make any scientific sense. Sorry guys you're just risking a cracked die. IMHO
post #11252 of 33574
Quote:
Originally Posted by chronicfx View Post

Warning: Spoiler! (Click to show)
Quote:
Originally Posted by MikeG View Post

Was it worth it? That's a very subjective question and I'm sure everyone will have a different opinion. The risks are high, but also the rewards. For someone doing it for the first time, be prepared that you may damage your chip and/or your motherboard. Keep in mind, that I had a very good chip to begin with.

direct die vs. delidded:
  • Did I see a performance difference at 0°C? No
  • Did I see a gain in MHz with ambient room temperatures of 20°C? Not really--not with VCore values that I feel comfortable with. Understand that I was already somewhat stable (I could run 10 passes of IBT) at 5.0GHz and 1.415V delidded.
  • Did I see a reduction in temperatures? Yes, My temperatures were reduced by about 7 to 8°C from my hottest core.
  • Was I able to reduce my VCore? Yes I was able to lower my VCore by 0.02V (5.0GHz with 1.395V)
  • So what is the benefit for me? SILENT COMPUTING! I'm sitting here typing this and all the while my processor is running at 5.0GHz. My fans are set to 6.7V and will only lift a sheet of paper by about 1/2 inch when laid over the radiator. AIDA 64 stability test has been running the last 10.5 hours and my average core temps are 56°C.
  • Was I worried about too much or too little pressure on the die? Absolutely, with no way to measure how much pressure I was putting on the die, I just had to guess and hope I didn't break something. My first boot attempt resulted in post code 55. I loosened my water block a little and this time the motherboard would not stay powered on. It turned out that I was being too conservative with the pressure I was putting on the die. I increased the amount of pressure until finally I could boot. Now that I know exactly how far to tighten my block, I am extremely comfortable removing and remounting the block. I have done this half a dozen times already.
  • Does it take nerves of steel? Yes

If you want my take on it as a well trained scientist, I don't think there is any difference between leaving the heatspreader and not. People are getting a placebo effect and thinking that going direct die is really making a difference. Technically the entire bottleneck to your heat dissapation would be from the die through that first layer of TIM as the area of contact is the smallest making the heat transfered per unit area the highest of any interface. So whether that heat is going directly to a cpu heatsink/waterblock or into the CPU heat spreader and then through the same TIM interface spread over a larger area thereby reducing the heat transfer requirements (heat per unit area) dramatically and then into the cpu heatsink/waterblock doesn't matter at that point. The only time it could matter is if your heatspreader does not make good contact with the die surface from being concave/convex, but you can have a concave/convex water block too and get bad results. So if you want my final feeling on direct die, it just doesn't make any scientific sense. Sorry guys you're just risking a cracked die. IMHO

Completely agree with this. tongue.gif Also, to add a point, if you really want to get down and dirty with all those things, remove the glass pane on top of the die and add you own liquid metal on that and increase the die SA. tongue.gif
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post #11253 of 33574
I dont think there is any difference as long as you have good contact with the ihs to the die and block to ihs. Even if there is a few degree difference its probably not worth potentially crushing the die or possible dust build up on the PCB which would just be irritating to clean
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post #11254 of 33574
new member alert lol
heres my 377k de-lidded , direct die "proper" mount .
my temps @5g are a joke lol .





suicede runs

post #11255 of 33574
Has anyone actually crushed the die? I don't see the risk of direct die mounting (if anything, I would think higher temps if your cooling doesn't contact it well by going down that low). I don't really see a gain in it either, doesn't seem like people are getting temp drops from direct die mounting, as far as I've seen.
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post #11256 of 33574
there we go my new passmark score lol
http://www.passmark.com/baselines/V8/display.php?id=4689745287
cpu hit 12798 at 4.9 ghz in case your to lazy to click the link tongue.gif
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post #11257 of 33574
Sstephen what is that thing on top of the CPU block? Also 63c at 1.47v is amazing temps.
post #11258 of 33574
Quote:
Originally Posted by $ilent View Post

Are those stable volts or just bootable?
I think im gonna go with the ud3h, considering its got decent VRM, mosfets onboard.

Back to delidded club ive not been added I see; I bought a cpu lapping kit few days ago right up to 2500 grit sandpaper so Ill have a new picture and proper submission in couple days.

Val gets pretty busy sometimes. He took more than a month and a reminder to get me on the list. This thread moves several pages a day and keeping up with every post while participating in other parts of the community and hopefully maintaining n active "life" is probably tough.
post #11259 of 33574
UK guys should go this event: http://www.overclock.net/t/1357015/50-person-ocn-uk-ln2-lan-48hr-event

I'm not even in the team and I would go grab a cold one and some ln2 for free lol
post #11260 of 33574
already expressed an interest in that uk lan meet wink.gif
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