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[Official] Delidded Club / Guide - Page 1135

post #11341 of 33641
Quote:
Originally Posted by justanoldman View Post

What voltage did you need to get 5.2 stable?

1.54V. I wouldn't exactly call it stable, but enough to run the benchmark.

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Smoke and Mirrors
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post #11342 of 33641
Thread Starter 
Quote:
Originally Posted by chann3l View Post

I mean that it says on ocn in my profile that my hwbot name submission was moderator deleted apparently someone said its because my hwbot points haven't shown up yet and they won't add you without points

you don;t have enough points... you need around 7 I believe. rolleyes.gif
post #11343 of 33641
Quote:
Originally Posted by Valgaur View Post

you don;t have enough points... you need around 7 I believe. rolleyes.gif
Got 11 points for entering msi direstrike comp they just have not shown up yet smile.gif
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post #11344 of 33641
I'm receiving my Asus RMA board on Monday, I've been getting interested in trying out different TIM applications and I think I'm going to use the spread smoothly method this time and see how the temps go. Any thoughts on the matter of TIM application?
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post #11345 of 33641
Quote:
Originally Posted by Swag View Post

I'm receiving my Asus RMA board on Monday, I've been getting interested in trying out different TIM applications and I think I'm going to use the spread smoothly method this time and see how the temps go. Any thoughts on the matter of TIM application?

ON the IHS or ON the die?

I personally feel that the LINE METHOD is 10x better for spread than the pea sized method for ON THE IHS, when I install my i3 to my mum's PC and re-install my i7 -> they will be line methods used.
People raved about the use of pea sized and critique me "using too much TIM" when I found that the Antec stock cooler paste was crap...they were wrong - simply put.
post #11346 of 33641
Quote:
Originally Posted by Totally Dubbed View Post

Quote:
Originally Posted by Swag View Post

I'm receiving my Asus RMA board on Monday, I've been getting interested in trying out different TIM applications and I think I'm going to use the spread smoothly method this time and see how the temps go. Any thoughts on the matter of TIM application?

ON the IHS or ON the die?

I personally feel that the LINE METHOD is 10x better for spread than the pea sized method for ON THE IHS, when I install my i3 to my mum's PC and re-install my i7 -> they will be line methods used.
People raved about the use of pea sized and critique me "using too much TIM" when I found that the Antec stock cooler paste was crap...they were wrong - simply put.

On the IHS, not on the die, the die has to be spread if you want to use the CLP/CLU. tongue.gif
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post #11347 of 33641
Quote:
Originally Posted by Swag View Post

On the IHS, not on the die, the die has to be spread if you want to use the CLP/CLU. tongue.gif

Exactly, but my favorite method is line method. not randomly line btw . it must be aligned with the cpu or gpu die
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post #11348 of 33641
I use pea dot in the middle...same as Martin from martins liquid lab. wink.gif
post #11349 of 33641
Quote:
Originally Posted by Swag View Post

I'm receiving my Asus RMA board on Monday, I've been getting interested in trying out different TIM applications and I think I'm going to use the spread smoothly method this time and see how the temps go. Any thoughts on the matter of TIM application?

I used it for the first time on my most recent mount after reassembling my rig a few days ago actually. Using Phobya HEGrease and I'm not really seeing any temperature difference, albeit I may have a 1-2*C tighter grouping on my cores. Have always used the pea method before but had so recently done the die of my i7 with pro and a spread that I just kinda started spreading it out before I knew what I was doing.

Albeit for an IHS-Block TIM the Phobya is exceptional, spreads amazingly easy and gives far better temps than anything else I have used. Tried an application of Pro for IHS and Block and my coolest core was a degree lower but the spread was almost 10*C between the 4.

Just what I've experienced so far, and certainly not a very scientific test.
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post #11350 of 33641
Quote:
Originally Posted by I_shot View Post

Quote:
Originally Posted by Swag View Post

On the IHS, not on the die, the die has to be spread if you want to use the CLP/CLU. tongue.gif

Exactly, but my favorite method is line method. not randomly line btw . it must be aligned with the cpu or gpu die

So you just put a line on the middle for the Ivys?
Quote:
Originally Posted by ivanlabrie View Post

I use pea dot in the middle...same as Martin from martins liquid lab. wink.gif

Martins liquid lab?
Quote:
Originally Posted by teamrushpntball View Post

Warning: Spoiler! (Click to show)
Quote:
Originally Posted by Swag View Post

I'm receiving my Asus RMA board on Monday, I've been getting interested in trying out different TIM applications and I think I'm going to use the spread smoothly method this time and see how the temps go. Any thoughts on the matter of TIM application?

I used it for the first time on my most recent mount after reassembling my rig a few days ago actually. Using Phobya HEGrease and I'm not really seeing any temperature difference, albeit I may have a 1-2*C tighter grouping on my cores. Have always used the pea method before but had so recently done the die of my i7 with pro and a spread that I just kinda started spreading it out before I knew what I was doing.

Albeit for an IHS-Block TIM the Phobya is exceptional, spreads amazingly easy and gives far better temps than anything else I have used. Tried an application of Pro for IHS and Block and my coolest core was a degree lower but the spread was almost 10*C between the 4.

Just what I've experienced so far, and certainly not a very scientific test.

So you're using the smooth spread application?
Swag's Venus
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Swag's Venus
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