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[Official] Delidded Club / Guide - Page 13

post #121 of 33559
I also just put the IHS straight on without any spacer, those cores are tough.. remember those athlon xp's and PIII's? Those cores also took quite a bit of abuse, if the mount is level i see no problem with it tbh.
Back in 2000 i had one of those slot A Athlon's where i removed the case and mounted one of those Alpha coolers directly on the core, not sure but i think i had to drill some holes in the cooler for that. And that went great i think it was either a 600 or 650 but i managed to get 1ghz out of it, was pretty proud about that biggrin.gif
post #122 of 33559
Quote:
Originally Posted by Swag View Post

Well, as long as you use the bracket or you put the heatsink on fairly tight, you won't have any problems. What happens if you make a mistake in applying the paste in the die and you glue it on? You'd have to re-delid it which would be scary. Also, the glue that you are looking for is a Black Epoxy Adhesive like I said before. I have used it on my other things like my GPU in some cases. It's the closest thing you can get to what the PC component manufacturers use.

Well I was thinking something like 2 drops, 1 on the top right, and one on the bottom left just to hold it down a little more. I know its okay without glue but I dont like the idea.
 
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post #123 of 33559
Quote:
Originally Posted by HPE1000 View Post

Quote:
Originally Posted by Swag View Post

Well, as long as you use the bracket or you put the heatsink on fairly tight, you won't have any problems. What happens if you make a mistake in applying the paste in the die and you glue it on? You'd have to re-delid it which would be scary. Also, the glue that you are looking for is a Black Epoxy Adhesive like I said before. I have used it on my other things like my GPU in some cases. It's the closest thing you can get to what the PC component manufacturers use.

Well I was thinking something like 2 drops, 1 on the top right, and one on the bottom left just to hold it down a little more. I know its okay without glue but I dont like the idea.

Doesn't do as much as you'd think. To be honest, not having glue would probably be the best. First, the paste is actually able to freely spread unlike if the glue is there and the spread would be stopped either because it can't be pressed anymore or the IHS doesn't have that moving left and right to actually squeeze the paste to spread thinly and properly. All in all, no glue would probably be 2nd best to a soldered die.
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post #124 of 33559
So interested in deliding my 3770k...great info guys thanks!
post #125 of 33559
Quote:
Originally Posted by SonDa5 View Post

Main reason is because its specification list it has higher thermal conductivity rating. The other reason is because I like how it applies.
Quote:
Originally Posted by ivanlabrie View Post

That looks mighty impressive! Instant mirror-like finish tongue.gif
Wonder how the Ultra will look like...Gonna search for a similar vid.
After seeing this, wouldn't it be a bit too much for just the die if we used a similar sized drop on it and then spread it with the mounting pressure? I mean, it covers the whole ihs with that application.

Both of those were great to see SonDa5 and ivanlabrie. Makes more excited about using either, although I am now leaning to the PRO a bit. Thanks for finding and posting those.
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3770K Gaming Sys
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3770K 4.5GHz Asus Sabertooth Z77 EVGA Gtx560ti 448 FTW (2x SLI) 16GB Crucial Ballistic Tactical 1866 9-9-9-24 1T 
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120GB SanDisk Extreme SSD  1TB WD Black Caviar  2TB Seagate Barracuda TSSTcorp cd/dvd/bd 
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2500K 4.5GHZ 24/7 Ausu P8Z68-M Pro ATI 5770 Kingston Blue 1333 16GB 
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post #126 of 33559
Quote:
Originally Posted by HPE1000 View Post

Someone should find some glue similar to the one that was originally used on the ihs so people aren't just setting the ihs on the die. I watched a video of someone who didnt use any glue to stick it to the PCB and it looks very sketchy attaching it.

From what I have read, having the IHS sitting directly on the die, without the gule, has removed a gap that was stopping the efficeint transfer of heat. Part of the improved temps from deliding seems to be from a better TIM and the removal of that gap. So, it is an advantage to have the IHS resting directly on top of the die and what one should attempt to achive when deliding for optimized heat transfer away from the die - barring a proper HFS that can make direct contact to the die that is. Not all HFS can opperate without the IHS.
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120GB SanDisk Extreme SSD  1TB WD Black Caviar  2TB Seagate Barracuda TSSTcorp cd/dvd/bd 
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2500K 4.5GHZ 24/7 Ausu P8Z68-M Pro ATI 5770 Kingston Blue 1333 16GB 
Hard DriveHard DriveOptical DriveCooling
Sandisk Extream 120GB SSD 750GB HDD CD/DVD Cooler Master 212 EVO 
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3770K Gaming Sys
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3770K 4.5GHz Asus Sabertooth Z77 EVGA Gtx560ti 448 FTW (2x SLI) 16GB Crucial Ballistic Tactical 1866 9-9-9-24 1T 
Hard DriveHard DriveHard DriveOptical Drive
120GB SanDisk Extreme SSD  1TB WD Black Caviar  2TB Seagate Barracuda TSSTcorp cd/dvd/bd 
CoolingOSMonitorKeyboard
Coursair H80 Win7 64 Acer 27" Wide LCD HD Logitech Black Illuminated 
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Xonar DX 7.1 PCIe Logitech Z906 5.1 
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2500K 4.5GHZ 24/7 Ausu P8Z68-M Pro ATI 5770 Kingston Blue 1333 16GB 
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Sandisk Extream 120GB SSD 750GB HDD CD/DVD Cooler Master 212 EVO 
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post #127 of 33559
Thread Starter 
Also when you put that glue back on their and you put your heatsink back on....it won't be straigh anymore unless you leave you CPU out overnight to dry (um no, not in college anyways) And that glue will heat up again when you do high OC benches. it could possibly get soft and shift. The bare IHS is much ebtter for the contact as Gamer has said it gets rid of the gap their. Even when you delid and look at the stock TIM it may look like it's a very close grip but I had a good chunk of stuff on the under side of the IHS bewteen my temps are the best yet (still tweaking) because I didn't get rid of all of the glue yet (didn't have time mainly) and I will be getting rid of the rest next time I open this baby up. Can't wait to get my indigo xtreme back on ym IHS again...I miss it...a lot........that stuff rocked.
Quote:
Originally Posted by kgtuning View Post

So interested in deliding my 3770k...great info guys thanks!

No problem and that's our goal is to inform people! tongue.gif
Edited by Valgaur - 10/7/12 at 5:29pm
post #128 of 33559
would love to see my chip at 5ghz...right now it's 4.8ghz @ 1.248, 24 hour prime95 blend "stable"...but my temps are wicked high, max temps is 95 c. I will be ordering liquid pro this week and hopefully I can join the club. biggrin.gif
post #129 of 33559
Quote:
Originally Posted by kgtuning View Post

would love to see my chip at 5ghz...right now it's 4.8ghz @ 1.248, 24 hour prime95 blend "stable"...but my temps are wicked high, max temps is 95 c. I will be ordering liquid pro this week and hopefully I can join the club. biggrin.gif

I noticed you're using an Asrock board.

FYI ... That chip is getting alot more V-core than 1.248v

http://www.overclock.net/t/1310519/maximus-v-formula-vs-fatal1ty-z77-higher-v-core/0_30

ASRock are dropping their offsets to give lower readings through the sensors.
Asrock are a joke mate.

On my old Z77 Fatal1ty, it was reporting 1.29v for 4.8Ghz..
Now that i'm on a more truthful board... the v-core required for the same OC and same Chip is 1.35v
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post #130 of 33559
OCN name:Schmuckley
CPU:i5 3570K
on die-TIM:AS5
ihs-TIM:AS5
Mhz gained:0 (just did it for the temps) It would do 4.7 before PROCHOT on water.
OC after delid:4.5Ghz
Temp drops:4-12c

I sold it shortly thereafter..and bought a nice 2500K ninja.gif

link to temp screenshots n whatnot http://www.overclock.net/t/1286994/schmuckleys-delidding-of-3570k
 
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