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[Official] Delidded Club / Guide - Page 125

post #1241 of 33696
Quote:
Originally Posted by Hokies83 View Post

Meh you got the red light dist tho man all of us other guys only dream of having women like that in the windows when we walk down town lol..

LOL biggrin.gif

my avatar pic was taken when i was walking down that street hehe... wink.gif
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post #1242 of 33696
OK, so I have delidded this chip and have a high temp to high temp reduction of 17C using CL Ultra. Good, but not as good as others using both CL PRO and CL Ultra. So I will try remounting again to see if that helps, and I have also ordered some CL PRO to try soon.

But, I also wanted to try lapping the IHS to see if that could help - and when doing so I noticed that it was very concave, with the center of the top sinking in. More than I would have thought until the sanding brought the problem to light. No wonder I had temp problems! I bet the H80 could never make good contact with that thing!

I bet my IHS is not the only one either....but anyway, I have one un-lapped IHS on my system, and the other lapped one ready for testing when I can, and some CL PRO on the way! Hope my temps improve some more....biggrin.gif

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post #1243 of 33696
Quote:
Originally Posted by feniks View Post

well, I know at least 1 person, who achieved 30C drop in temps by using CLL Ultra ... so ... maybe Pro is better maybe not (considering downsides and CoolLaboratory statement that it's designed for copper only and NOT aluminum), but in real world comparison the results are pretty close anyways. considering the downsides of using Pro paste, I picked easier Ultra and am happy with it. Possibly I could have achieved better results with Pro paste IF I did it right the first try, Ultra is not far behind anyways...
Neither ULTRA or PRO are suitable for contact with aluminum.
I found the PRO to be very easy to work with and got a very thin even layer of it on all contact surfaces. I'm new to this, not a pro, I don't know where the PRO product got a rep for being hard to use because I got a mirror surface finish with it just like the video on the first try.
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post #1244 of 33696
Quote:
Originally Posted by bigblock View Post

Quote:
Originally Posted by feniks View Post

well, I know at least 1 person, who achieved 30C drop in temps by using CLL Ultra ... so ... maybe Pro is better maybe not (considering downsides and CoolLaboratory statement that it's designed for copper only and NOT aluminum), but in real world comparison the results are pretty close anyways. considering the downsides of using Pro paste, I picked easier Ultra and am happy with it. Possibly I could have achieved better results with Pro paste IF I did it right the first try, Ultra is not far behind anyways...
Neither ULTRA or PRO are suitable for contact with aluminum.
I found the PRO to be very easy to work with and got a very thin even layer of it on all contact surfaces. I'm new to this, not a pro, I don't know where the PRO product got a rep for being hard to use because I got a mirror surface finish with it just like the video on the first try.

More user-friendly: Ultra

Pro and Ultra yield the same temperatures so don't worry whichever you get.

I personally like the Pro over the Ultra but that is my own preference. I do use Indigo Xtreme though for my IHS to HSF because I bought a lot actually. I bought about 10 units from a friend who bought them in bulk and got them for a cheaper price. tongue.gif
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post #1245 of 33696
Thread Starter 
Speaking of IX I got my free trials lol. just need to get some liquid pro ordered and possibry sand paper for my IHS. I want the best stuff available lol.
post #1246 of 33696
Quote:
Originally Posted by VonDutch View Post

Warning: Spoiler! (Click to show)
Warning: Spoiler! (Click to show)
first off, nice job feniks thumb.gif
ive noticed, and read about it too, you can see for yourself if you compare
delidded pics, Warning: Spoiler! (Click to show)
that the side im pointing at is open, that has a goal too,
its a way to get heat out of there..
i would leave it open next time, well, if there is a next time,
im not taking apart mine if i dont have to, it works so ..dont touch..lol

dude! Vondutch, you are my hero now! biggrin.gif the Flying Dutchman I'd say you should call yourself tongue.gif
I have just finished completely re-doing the die TIM and IHS cleaning together with black RTV silicone and avoided the area intel stock glue avoided (which you pointed out) and I am saved!!! core# 2 temps are pretty much only slightly above core #1 biggrin.gif

here, my 4.9GHz screenie (note that before the core #2 was hitting 102C!) where core#2 hit only 87C biggrin.gif
mve49ghzoffse02001424vv.png
Uploaded with ImageShack.us

despite my CPU degradation trouble, at least I was able to fix the temperatures AND my CPU looks still stock biggrin.gif .. I bet even Intel won't notice that I have tampered with IHS biggrin.gif

... hitting on 5GHz next biggrin.gif
Edited by feniks - 10/20/12 at 11:45pm
post #1247 of 33696
Quote:
Originally Posted by PCWargamer View Post

Hey feniks, one thing to consider is what some deliders have found, that since the die and IHS now touch, and there is some thermal heat/cool action taking place, that this can cause a "pumping" action that slowly removes some TIMs over time and can also create voids. This made those affected by this see temps rise over time, and the higher temps can reduced chips performance. So they would then reapply new TIM every few weeks to bring back the improved temps.
What TIM are you using between the die and IHS?
Maybe see if reapplying some new TIM between the die and IHS fixes the problem...

This is new to me, is this true and if so which TIM's are effected? Again this is the first I've heard of this so am somewhat unsure whether or not this is true, correct me if I'm wrong.
post #1248 of 33696
Quote:
Originally Posted by PCWargamer View Post

Hey feniks, one thing to consider is what some deliders have found, that since the die and IHS now touch, and there is some thermal heat/cool action taking place, that this can cause a "pumping" action that slowly removes some TIMs over time and can also create voids. This made those affected by this see temps rise over time, and the higher temps can reduced chips performance. So they would then reapply new TIM every few weeks to bring back the improved temps.
What TIM are you using between the die and IHS?
Maybe see if reapplying some new TIM between the die and IHS fixes the problem...

hey buddy, I use CoolLaboratory Liquid Ultra paste ... actually used up the whole syringe in my today's attempts (3 applications total on the die-2-IHS and 1 application on the IHS-2-cooler contact) to make it right biggrin.gif check my post above for results at 4.9GHz biggrin.gif
I don't want Pro paste, because it's a PITA to remove while Ultra wipes off with alcohol and paper towels easily wink.gif
I hope it stays that way for long time ... until my chip dies of degradation ha ha! wink.gif

I like CLL Ultra paste very much! biggrin.gif
post #1249 of 33696
Quote:
Originally Posted by Systemlord View Post

This is new to me, is this true and if so which TIM's are effected? Again this is the first I've heard of this so am somewhat unsure whether or not this is true, correct me if I'm wrong.

Systemlord, yes something odd that some deliders found on the anandtech forums. Delidded temp gains degraded over time. Problem is related to TIM choice and caused by thermal action "pumping" some types of TIM out - needing to be replaced over time. The link to the thread is found on the first page of this, our own, thread link under:

Now for the real reason your Ivy Bridge runs hot.

Where it notes the following about the die to IHS gap as being the main cause of the IB temp problem, but he also mentions the TIM choice issue they ran into and the need for further TIM testing. They still plan on doing further TIM testing sometime soon.


see #583:
http://forums.anandtech.com/showthread.php?t=2261855&page=24
_________________________________
....
The take home message there is replacing the CPU TIM doesn't really provide any benefit. Reducing the gap between the CPU and the IHS does. And removing the IHS entirely doesn't really provide much benefit either.

And that stands to reason. The heat is going to flow through the copper of the IHS the same as it does through the copper of the H100 waterblock.

But if there is a thick pad of thermal paste in the way, as was the case with my 3770k at time of purchase, then it doesn't really matter how good the TIM itself is (unless it too is made of metal) because the mere presence of that thick pad of thermal paste becomes the weakest link in the thermal conductivity equation.

Once you eliminate the bottleneck that is the gap between the IHS and the CPU, or if you happen to end up with an Ivy Bridge CPU which doesn't have much of a gap to begin with (Yuriman ), then you have pretty much optimized the system at that point regardless which CPU TIM of choice you employ and regardless whether or not you leave the IHS in place.

Now the choice of CPU TIM still plays a role in terms of the robustness in maintaining those nice low temperatures. If the so-called "pump out" effect is real then we can expect it to bite us unless we choose a substitute CPU TIM that is designed to avoid such thermo-mechanical effects.

I haven't really got into testing that part out yet, but I expect IC Diamond and the metal TIMs like Liquid Ultra to be key there.
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3770K Gaming Sys
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post #1250 of 33696
Quote:
Originally Posted by feniks View Post

hey buddy, I use CoolLaboratory Liquid Ultra paste ... actually used up the whole syringe in my today's attempts (3 applications total on the die-2-IHS and 1 application on the IHS-2-cooler contact) to make it right biggrin.gif check my post above for results at 4.9GHz biggrin.gif
I don't want Pro paste, because it's a PITA to remove while Ultra wipes off with alcohol and paper towels easily wink.gif
I hope it stays that way for long time ... until my chip dies of degradation ha ha! wink.gif
I like CLL Ultra paste very much! biggrin.gif

Great find - and thanks to VonDutch for his help. Great to see your temps fixed. smile.gif

If you use CL Ultra, then that is one of the TIMs that might/should do better on the "pumping" issue. But not fully tested yet. Did you notice how your first application looked before you replaced it today? Do you think the whole fix was due to the IHS problem? Or the new application of the TIM?

Keep an eye out to see if your temps start to degrade over time or not to see if this "pumping" issue is happening. If so, new TIM application will restore temps gains, and you/we will need to consider if Ultra is as good as ICD or PRO at fighting this "pumping" problem.
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3770K Gaming Sys
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120GB SanDisk Extreme SSD  1TB WD Black Caviar  2TB Seagate Barracuda TSSTcorp cd/dvd/bd 
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