Originally Posted by Systemlord
This is new to me, is this true and if so which TIM's are effected? Again this is the first I've heard of this so am somewhat unsure whether or not this is true, correct me if I'm wrong.
, yes something odd that some deliders found on the anandtech forums. Delidded temp gains degraded over time. Problem is related to TIM choice and caused by thermal action "pumping" some types of TIM out - needing to be replaced over time. The link to the thread is found on the first page of this, our own, thread link under:Now for the real reason your Ivy Bridge runs hot.
Where it notes the following about the die to IHS gap as being the main cause of the IB temp problem, but he also mentions the TIM choice issue they ran into and the need for further TIM testing. They still plan on doing further TIM testing sometime soon.
The take home message there is replacing the CPU TIM doesn't really provide any benefit. Reducing the gap between the CPU and the IHS does. And removing the IHS entirely doesn't really provide much benefit either.
And that stands to reason. The heat is going to flow through the copper of the IHS the same as it does through the copper of the H100 waterblock.
But if there is a thick pad of thermal paste in the way, as was the case with my 3770k at time of purchase, then it doesn't really matter how good the TIM itself is (unless it too is made of metal) because the mere presence of that thick pad of thermal paste becomes the weakest link in the thermal conductivity equation.
Once you eliminate the bottleneck that is the gap between the IHS and the CPU, or if you happen to end up with an Ivy Bridge CPU which doesn't have much of a gap to begin with (Yuriman ), then you have pretty much optimized the system at that point regardless which CPU TIM of choice you employ and regardless whether or not you leave the IHS in place.Now the choice of CPU TIM still plays a role in terms of the robustness in maintaining those nice low temperatures. If the so-called "pump out" effect is real then we can expect it to bite us unless we choose a substitute CPU TIM that is designed to avoid such thermo-mechanical effects.
I haven't really got into testing that part out yet, but I expect IC Diamond and the metal TIMs like Liquid Ultra to be key there.