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[Official] Delidded Club / Guide - Page 1241

post #12401 of 33411
Quote:
Originally Posted by Valgaur View Post

it can create a gap though

It was sarcasm. The idea of glueing it down does not appeal to me because if you get everything in and find your temps are not what you anticipated you have to delid all over again. Also as some have mentioned heat trapping is possible underneath the ihs if it is not ventilated through the gap left by not glueing and in turn the loop or heatsink has a bit more heat to dissapate.
post #12402 of 33411
Quote:
Originally Posted by chronicfx View Post

Quote:
Originally Posted by Valgaur View Post

it can create a gap though

It was sarcasm. The idea of glueing it down does not appeal to me because if you get everything in and find your temps are not what you anticipated you have to delid all over again. Also as some have mentioned heat trapping is possible underneath the ihs if it is not ventilated through the gap left by not glueing and in turn the loop or heatsink has a bit more heat to dissapate.

Exactly, I don't recommend gluing it down unless you are selling the chip and the buyer wants it glued down. There is absolutely no point, not like that piece of glue is going to prevent it from getting killed...
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post #12403 of 33411
So I settled on 4.9ghz OC (Want 5ghz but that requires a 1.5v jump... no thank you) on my chip... under extreme stress max temp is 65'C... that CLU was worth every penny indeed!

In other news, Just tried a 690 on my 7680x1440... it failed a very miserable failure with Vram hitting the ceiling very fast in BF3..... Took that one out and smacked in two 680 4GB.... smooth sailing!

Now to check if any waterblocks will fit these beauties and to find a third one for tri-sli.

Saw benchies for Titan... not impressed what so ever....
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post #12404 of 33411
moving on

regarding gluing/bonding the ihs to the pcb - consider the type of adhesive original used by intel - it's semi-rigid with low modulus to permit thermal movement/growth of the ihs - it's not hard setting

i am in agreement w/ idc/at re: excessive gap between face of die & "underside" of ihs being the fundamental cause of ivy bridge "thermal issues" and i have considered re-gluing the ihs using thixotropic semi rigid 2-part pu adhesive --- intel has bonded the ihs to pcb substrate to provide parallel plane surfaces of the thermal solution and the signal/power interface contact array and i believe it important to continue this design practice

i have reservations about the die face directly supporting the retention clamping force (however moderate this actually measures) as directly applied to the ihs and the likelyhood the typical die face surface is not a genuine parallel plane with the pcb substrate contact array

the "goal" being to minimize the internal gap while fully supporting the edge loading imposed by the retention mechanism AND the clamping force of the (4) threaded hold-downs of the water block while preventing any damage to the wafer die
Edited by buildtoexcess - 2/21/13 at 4:14am
post #12405 of 33411
This is how you glue your IHS back down without interfering with anything...

Get some rubber adhesive, or epoxy (I prefer epoxy) and get just a touch of it on the end of a tooth pick. Rub inside the IHS lips on the four corners. Try to put it so it just BARELY comes up over the lips of the IHS. Place it back on the PCB nice and square/ Then let it dry for 20 minutes if epoxy, a couple hours if rubber.



This will keep your IHS in place, be easy to remove later, and not interfere with IHS to Die distance.
post #12406 of 33411
there is a precise "bond line" created by the robotic placement fixture to ensure parallel ihs placement AND uniform height of ihs relative to pcb contact array surface --- this is not random or variable

the relatively large gap inside is what "we" want to reduce to a minimum, this is why the ihs is removed and remounted --- using higher coefficient tim simply makes this struggle win/win

look at idc/at again & note the fact that the ihs DOES NOT touch the pcb when intel adhesive is removed, even though the ihs is resting on the wafer die --- only when the edge of the ihs is supported by adhesive will the clamping forces be tranfered to the pcb and not applied directly to the wafer die --- yes the clp/clu couples together the ihs & die face, BUT THE EDGE OF THE IHS PROVIDES MECHANICAL SUPPORT OF THE CLAMPING LOAD then transfered through the motherboard cpu pin array into the mb cpu retention mechanism backplate

so accurate "leveling" of the ihs is important
post #12407 of 33411
so, if i want to preserve the original intel ihs "height" while at the same time move the ihs closer toward the die face, it seems that a precision shim in copper alloy "inside the ihs" represents one possible approach - unfortunately the ihs is formed having a measurably convex contact surface

i will increase thickness of top toward inside & cut rectangular "pocket" for die, hopefully increasing delta t

as several of you know the lunar new years / chinese new years annual holiday is still in effect in asia

on the 23rd or 24th (when production workers return in hk) i will show a spare core i7 ihs (separate from cpu assembly) to (2) cnc technicians & discuss cutting several modified billet cu ihs'sthese will have "flat" tops & lower inside surface (if this must go to shenzhen production shop, the workers will only return at month's end)

this is only for my own use
Edited by buildtoexcess - 2/21/13 at 8:17am
post #12408 of 33411
Guess I will keep my gtx680 sli. Looks like Titan is nice but on tech powerup it didn't win a single multi monitor battle against the 690.
post #12409 of 33411
funny you mention this - were you in shamshuipo today? (2) titans in specialist shop this afternoon - the courier talked w/ me - buyer in beijing offering 10,000rmb each to have bragging rights w/ his friends
v. difficult to buy in prc, so special orders hand carried from hk to cn buyers - but no boxes or customs cn side seizes as parallel import - than resells for profit...

must have missed you today
post #12410 of 33411
Quote:
Originally Posted by chronicfx View Post

Guess I will keep my gtx680 sli. Looks like Titan is nice but on tech powerup it didn't win a single multi monitor battle against the 690.
Yep, I was looking at all the Titan numbers. For any normal gaming use two 680 4g is best, next is the 690. The Titan doesn't do anything for gamers unless you use two or three and have a serious surround setup.
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