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[Official] Delidded Club / Guide - Page 1242

post #12411 of 33389
To use 6gb of vram you would need 6 2560x1440 monitors with all the eye candy on...

Then again u would also need 4 titans to push those monitors lol.

Titan is $999 uh? ummm yeah..... more then 2 gtx 680s which slap it around...
Edited by Hokies83 - 2/21/13 at 8:51am
    
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post #12412 of 33389
Looks like I will order a 670 FTW, $380 w/rebate, and three NF-A14 FLX for the case. Now I just have to wait for Swiftech to release the H220, then order a back plate and water block for the 670, another radiator, more fans, tubing, fittings, coolant, etc. Then figure out how to make it all work, then be talked into doing this modified gpu bios you guys talk about. Man, by the time I finish this it will be time to upgrade.
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post #12413 of 33389
There is a buy it now 680 on ebay for $355 free shipping.. so tempting even though I don't own a 3 way sli board to snag one with these low selling titan hopefuls putting cards up this week. I would have to put it on a shelf and save for a G1 sniper to use it though...
post #12414 of 33389
Have 25 bucks to spend on TIM, lol. Plan on getting some CLU so I can delid my next chip. Not sure what TIM to get for the heatsink tho. Maybe some nt-h1 or is there something better?
post #12415 of 33389
Quote:
Originally Posted by buildtoexcess View Post

moving on

regarding gluing/bonding the ihs to the pcb - consider the type of adhesive original used by intel - it's semi-rigid with low modulus to permit thermal movement/growth of the ihs - it's not hard setting

i am in agreement w/ idc/at re: excessive gap between face of die & "underside" of ihs being the fundamental cause of ivy bridge "thermal issues" and i have considered re-gluing the ihs using thixotropic semi rigid 2-part pu adhesive --- intel has bonded the ihs to pcb substrate to provide parallel plane surfaces of the thermal solution and the signal/power interface contact array and i believe it important to continue this design practice

i have reservations about the die face directly supporting the retention clamping force (however moderate this actually measures) as directly applied to the ihs and the likelyhood the typical die face surface is not a genuine parallel plane with the pcb substrate contact array

the "goal" being to minimize the internal gap while fully supporting the edge loading imposed by the retention mechanism AND the clamping force of the (4) threaded hold-downs of the water block while preventing any damage to the wafer die

...not to disturb this harmonious discussion, but when I finally delidded my 3770K less than two weeks ago, I had a big surprise...in fact I initially postponed delidding for a day because of this: The IHS on my CPU was ja bit 'crooked'...on one side, it showed almost no black glue and even a thin razor blade had trouble finding any kind of gap, on the other, I could have used a steak knife without touching the pcb, there was so much space.

When I was finally done, I also notched the IHS just a bit to allow air circulation...and no glue...though that was more a precaution re mounting a full water-block this weekend which may or may not require the removal of the CPU and perhaps IHS if I want to make final adjustments.
post #12416 of 33389
ok here is an update after taking off CLU and applying CLP this time I didn't use the glue to put IHS back on. Now I don't know if by chance I just did a better application but just by removing and not reusing glue and going from CLU to CLP my temps have dropped 5c by doing the way you guys thought was better, I guess I was wrong though it made it easier to install and I didn't have to put CL on while in the socket I figured I would do it everyone elses way. Thank you for the suggestions I like my new temps.

here is before with CLU and glue



here is after with CLP and no glue
post #12417 of 33389
Quote:
Originally Posted by justanoldman View Post

Looks like I will order a 670 FTW, $380 w/rebate, and three NF-A14 FLX for the case. Now I just have to wait for Swiftech to release the H220, then order a back plate and water block for the 670, another radiator, more fans, tubing, fittings, coolant, etc. Then figure out how to make it all work, then be talked into doing this modified gpu bios you guys talk about. Man, by the time I finish this it will be time to upgrade.

...well - you seem to like it though, otherwise you would have never opened the case smile.gif That said, it must be annoying not having the Swiftech 220 yet (don't you hate paper launches ?)

...as to Titan, there is no doubt that it is best single-GPU solution out there, at quite reasonable wattage...what's not reasonable though is the price / performance gain ratio.

Regarding 670ies, I was genuinely shocked to see at Tom's Hardware's comparison of Titan w/690, 680 and 7970 GE that my pair of 'optimized 670ies' beats them all, and even pulls ahead re some 680 SLI and 7970- CF results (which of course can also be 'optimized')...biggrin.gif

...please, this is NOT one of those 'gee, look at my rig' chest beating items, but instead underscores what 'reasonable optimization' (like deliddding a 3770K) can do...I moved my cards to the max factory voltage after installing and modifying different vid BIOS and applying better TIM, but did not go beyond it...yet in 3D11, I'm scoring over 17,770; 215+ in AvP, over 10800 in 'FireStrike', and over 51500 in 3D Vantage...all with no micro-stutter issues, but with low temps and low noise...kind of makes me wonder why I'm installing a 3rd 'optimized' 670 on the weekend (though that one will eventually go to another machine)

...in the end, I much prefer to make a 'silk purse out of a sow's ear' than go into a store and buy a silk purse - I think in a way we all do thumb.gif
post #12418 of 33389
Quote:
Originally Posted by Zeek View Post

Have 25 bucks to spend on TIM, lol. Plan on getting some CLU so I can delid my next chip. Not sure what TIM to get for the heatsink tho. Maybe some nt-h1 or is there something better?
Which TIM you use on the die matters more than on top of the IHS. Most tests I have seen have all the top TIMs pretty close when used between the IHS and heatsink. I can say that I got 4 or 5c when I switched from AS5 to Ultra on top of the IHS though.

I really like Ultra, but the two downsides are you don't want to get it on anything so you have to be careful, and it is a pain to clean if need be. I haven't seen anyone try to completely clean their IHS of Ultra with metal cleaner to see if the Intel markings are messed up though. It came off my H100i with a little work and time with the metal cleaner.
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post #12419 of 33389
Quote:
Originally Posted by Zeek View Post

Have 25 bucks to spend on TIM, lol. Plan on getting some CLU so I can delid my next chip. Not sure what TIM to get for the heatsink tho. Maybe some nt-h1 or is there something better?

U can use it on both. I have a d14 myself I don't think that paste is anywhere near what the ultra will give u for temps
post #12420 of 33389
Just flamed you chronicfx
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