RAVAGE THE EARTH
The reason we use Thermal paste is because the top of the cpu cover and the bottom of the heatsink are not perfectly flat and smooth. How to correct that and use minimal Thermal Paste is the objective.
Joa3D43 and justanoldman gave up some solution that hopefully will work, If not: and If the cooler block is flat like my corsair H60 you can greatly increase surface to surface contact by lapping the IHS
That said after you have tried everything else, other than filling in the a large void with thermal paste. I VOTE FOR LAPPING THE IHS!
I delidded, lapped it, CLU, tightened it down first time done - haven't seen it since; haven't "fixed" it since(see TonicX Motto). The temps tell me I did it right, after all looking to see if it spread right defeats the whole process by introducing air-so that's out on final install, I did use some cheap silicon paste as a test after lapping it. check this
justanoldman says clamping the chip assembly down in the socket can bend it, so beware: he know his stuff, but I did not experience that.
I wrapped sand paper around a super-flat piece of beveled glass see: http://www.overclock.net/t/1313179/official-delidded-ivy-bridge-club/13520#post_19492508
This took me almost an hour but i went all the way to flat cooper removing the nickle plating from the entire top surface.
I Lapped the IHS completely flat top and bottom starting with 360 and 400 then 800 finally 1600 sandpaper. I think i could have gone to 2500 or 3000 grit.
btw dont lap the die it is silicon(Glass) or underside of the cover.(i dont see how to make the flat and it would only degrade(scratch) the smooth metal.
1. short back-and-forth action alternating small circular action, finishing with back-and-forth with two finger inside the cover.
2. fine grain lastly- duh
3. mount the paper on a highly,super,ultra flat surface like tempered glass or machined-metal
4. do not let the IHS rock side-to-side
5. take it all the way down to just copper- mine was concave and I needed to get down to the lowest point, i.e. the center
6. optional: lap the bottom of cover ,but not excessively(this increases pressures on die(maybe test with some cheap silicon first)
7. I recommend a stationary sanding surface, but, if you use a sand-block method (not a rubber block it will round the corners and flex to the shape of your cover) place the cover on something that stabize it in place like a paper or cloth.
8. don't get lazy and use motorizered sanders - they are not flat enough - hard to control - too aggressive.
9. control the metal dust- use gloves or wash hand before,during breaks, and after. If you do this process in your computer room, do it on paper so you can just chuck the whole mess.
10. remember your SNIPER training "SLOW IS SMOOTH AND SMOOTH IS FAST"
"SLOW IS SMOOTH AND SMOOTH IS FAST"
Personally i think a good lap job is essential to making the COOL LABORATORY ULTRA fill in the gap between the cpu and the heatsink.
When I was done, I slapped my IHS onto my cooling block and it sounded like a freaken magnet making contact. (do not slide it around laterally in this position - it will scratch)
You can find fine grit sandpaper at home improvement stores, hardware store, woodworking store like ROCKLER woodworking.
wipe the thing of with an achohol swab after, and Im sure your alreadly know about contaminates and static shock dangers.
Nothing to fear- just MOD IT! Take your time and im sure you'll do GREAT!
why not lap it?
1. you may want to resell/return it
2. its flat enough as-is
3. you don't have a super flat surface or the right sand papers
4. voids warrentee- oh ya that shreaded already
5. you have not tried other methods yet - this is the last resort
IF IT AINT BROKE THEN YOU DIDN'T OVERCLOCK IT ENOUGHT