Alrighty now it's time to learn people!!!
just kidding feeling much better and feeling somewhat smurt today.
Anyways dr, as with the entire 80 way thing of paste lets make one thing clear about CLU/CLP right now. it's not meant to be on the IHS as a standard TIM, it's ment purely (as i see it) for the die of Ivy bridge.
liquid metal like solder is meant for small places to move lots of heat, CLU/CLP are key for this as their heat movement is pretty darn crazy as it is. This is why it's mainly for the die as the die is very small and outputs tons of heat which the CLP/CLP can immediately hold and throw out onto the IHs and then transfer to the heat sink. I don't believe there are any actual testings of switching die TIM from lets say AS5 and MX or even prolimatech or other stuff to CLU/CLP. this is because the smaller the are the more heat density and the more w/km (shut up if i spelled it wrong) then the best performance you can get. on the front page i have the list of the most used TIM on here... go take a look at the top two which are CLU/CLP they are at least twice as high on the values of heat movement.
IHS TIM's can't compete as they need a larger area to work as thats how they are designed to be placed and used, CLU/CLP do both they don't work the best on the IHS (still darn good with stock Intel TIM though) but put it on the die........ and use lets say MX-1 you'll drop at least 10 C no problem then switch the MX-1 and you'll drop more, why? because the CLU/CLP can move all the heat no problem but the MX-1 is holding everything back. then switch to a crazy good TIM like CLU and then you'll drop even more as it will have a much higher transfer rate of heat and then it's all based on your cooling unit after that.
We don't recommend it just for sponsor or kicks. it's the best TIM for this out there. take a look through the OP and look through the spreadsheet and see what TIMs everyone is using and the temp drops, it's for exactly that.