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[Official] Delidded Club / Guide - Page 1520

post #15191 of 33558
Quote:
Originally Posted by homestyle View Post

im not concered about absolute performance.

i've heard that regular tim can pump out and you get progressively higher and higher temps until you redo the tim again. i heard some people with as5 had this problem.

I think most here are using the liquid metal. I did use mx4 for a while as I was waiting for some CLU with the first chip I delidded, only a couple weeks & it was fine when I opened it up again.
I'm sure there are some here that have been using normal tim for longer, have to see if they pop up, or get some regular tim on your die & start testing. biggrin.gif
    
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post #15192 of 33558
Quote:
Originally Posted by homestyle View Post

i'm more concerned about the difficulty with removing the CLU after a while. .... which would happen if I switch mobos/cpus or ever want to try another tim.


...for what it is worth (and others may have a different opinion)

...MX4 is the less-complicated 98% solution which I run on customer machines...great temps on die and IHS and easy removal with a few rounds of Isopropanol every time...

...on the two-out-of-eight no holds barred machines, I run CL-U...more difficult to remove during mobo swaps later than MX4, but certainly not an unsolvable conundrum...just a bit more work...while I own several tubes of CL-Pro, I stay away from it...not because it is 'bad' in any way, just more tricky to clean up than CL-U, without a performance gain

Intel(R) IPP JPEG encoder 7.0.1041 - Jul 19 2011;
post #15193 of 33558
Hey guys, I'm sick and tired of this Zalman mic.

What do you guys think is the best headset for PC right now? For gaming. I need a headset because I don't want a separate mic anymore.
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post #15194 of 33558
Quote:
Originally Posted by Joa3d43 View Post

...for what it is worth (and others may have a different opinion)

...MX4 is the less-complicated 98% solution which I run on customer machines...great temps on die and IHS and easy removal with a few rounds of Isopropanol every time...

...on the two-out-of-eight no holds barred machines, I run CL-U...more difficult to remove during mobo swaps later than MX4, but certainly not an unsolvable conundrum...just a bit more work...while I own several tubes of CL-Pro, I stay away from it...not because it is 'bad' in any way, just more tricky to clean up than CL-U, without a performance gain

what is the consistency of mx4?

scale of 1 to 10. 1 is as5 and 10 is ic diamond.
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post #15195 of 33558
Kinda off subject their swag but its ok. I use this headset because its cheap its durable and they sound amazing. http://www.amazon.com/gp/product/B00B1KJK22
post #15196 of 33558
Quote:
Originally Posted by Rucka315 View Post

Kinda off subject their swag but its ok. I use this headset because its cheap its durable and they sound amazing. http://www.amazon.com/gp/product/B00B1KJK22

I go OT every time I'm here, I just wait until someone has a question about delidding and then we answer that but I like to go OT. offtopic.gif

Added to my list, my current list has the Corsair 1300 Analog and the Steelseries Siberia V2.
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post #15197 of 33558
Quote:
Originally Posted by homestyle View Post

what is the consistency of mx4?

scale of 1 to 10. 1 is as5 and 10 is ic diamond.

3 or 4
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post #15198 of 33558
Im sorry but I have to ask can someone in simple words explain what this actually involves and why people do it?

All I got was hit your CPU chip, with a hammer, and overclockers do this.......

Yes im not a pro-computer know it all person.
post #15199 of 33558
Quote:
Originally Posted by Tim Milano View Post

Im sorry but I have to ask can someone in simple words explain what this actually involves and why people do it?

All I got was hit your CPU chip, with a hammer, and overclockers do this.......

Yes im not a pro-computer know it all person.

These Ivy Bridge cpus come with the metal plate over the core attached to the pcb with glue and they use thermal paste as the thermal interface material between said metal plate (ihs) and the cpu core.
This generates bad contact cause of the amount of glue and tim used, which leads to really high temps. Even water cooling can't help if the thermal interface between the cpu cooler base and core is poor.
After delidding you can replace the paste with something with higher thermal conductivity and get rid of the glue to narrow the gap, hence reducing temperatures greatly!
post #15200 of 33558
Quote:
Originally Posted by ivanlabrie View Post

These Ivy Bridge cpus come with the metal plate over the core attached to the pcb with glue and they use thermal paste as the thermal interface material between said metal plate (ihs) and the cpu core.
This generates bad contact cause of the amount of glue and tim used, which leads to really high temps. Even water cooling can't help if the thermal interface between the cpu cooler base and core is poor.
After delidding you can replace the paste with something with higher thermal conductivity and get rid of the glue to narrow the gap, hence reducing temperatures greatly!

Hmmmm....now it makes sense. Would it help if the CPU chips were at a big size? Like more surface to water cool.....
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